Anodic oxide coatings that provide corrosion resistance to parts having protruding features, such as edges, corners and convex-shaped features, are described. According to some embodiments, the anodic oxide coatings include an inner porous layer and an outer porous layer. The inner layer is adjacent to an underlying metal substrate and is formed under compressive stress anodizing conditions that allow the inner porous layer to be formed generally crack-free. In this way, the inner porous layer acts as a barrier that prevents water or other corrosion-inducing agents from reaching the underlying metal substrate. The outer porous layer can be thicker and harder than the inner porous layer, thereby increasing the overall hardness of the anodic oxide coating.

This invention involves a plasma oxidation method for making an oxide coating containing air pockets. The encapsulated air, which has minimal thermal conductivity and capacity, allows the coating to adapt quickly to changes in the surrounding temperature. The thermal diffusivity and conductivity of the coated metal can be tailored to provide various thermal functions for internal combustion engine parts.

Disclosed are novel electrolytes, and techniques for making and devices using such electrolytes, which are based on compressed gas solvents. Unlike conventional electrolytes, disclosed electrolytes are based on compressed gas solvents mixed with various salts, referred to as compressed gas electrolytes. Various embodiments of a compressed gas solvent includes a material that is in a gas phase and has a vapor pressure above an atmospheric pressure at a room temperature. The disclosed compressed gas electrolytes can have wide electrochemical potential windows, high conductivity, low temperature capability and/or high pressure solvent properties. Examples of a class of compressed gases that can be used as solvent for electrolytes include hydrofluorocarbons, in particular fluoromethane, difluoromethane, tetrafluoroethane, pentafluoroethane. Also disclosed are battery and supercapacitor structures that use compressed gas solvent-based electrolytes, techniques for constructing such energy storage devices. Techniques for electroplating difficult-to-deposit materials using compressed gas electrolytes as an electroplating bath are also disclosed.

According to the invention a method of removing electrolyte from an electrochemical deposition or polishing chamber comprising the steps of: providing an electrochemical deposition or polishing chamber comprising a support for a substrate, the support having an in-use position; a housing having an interior surface and a fluid outlet pathway for removing electrolyte from the chamber, wherein the fluid outlet pathway includes one or more slots which extend into the housing from at least one slotted opening formed in the interior surface; a seal for sealing the housing to a peripheral portion of a surface of a substrate position on the support in its in-use position; and a tilting mechanism for tilting the chamber in order to assist in removing electrolyte from the housing through the fluid outlet pathway; using an electrolyte to perform an electrochemical deposition or polishing processing on a substrate positioned on the support in its in-use position; and tilting the chamber using the tilting mechanism in order to assist in removing electrolyte from the housing through the fluid outlet pathway.

An electrolytic plating apparatus capable of establishing electric connection between a power supply and a substrate without physical contact is disclosed. The electrolytic plating apparatus includes: a plating tank configured to hold a plating solution therein; an anode disposed in the plating tank; a substrate holder having an electric contact arranged to be able to contact a substrate; a power supply coupled to the anode; a wireless electric-power transmitter coupled to the power supply; and a wireless electric-power receiver mounted to the substrate holder and electrically connected to the electric contact.

An electrochemical plating apparatus for depositing a conductive material on a wafer includes a cell chamber. The plating solution is provided from a bottom of the cell chamber into the cell chamber. A plurality of openings passes through a sidewall of the cell chamber. A flow regulator is arranged with each of the plurality of openings configured to regulate an overflow amount of the plating solution flowing out through the each of the plurality of openings. The electrochemical plating apparatus further comprises a controller to control the flow regulator such that overflow amounts of the plating solution flowing out through the plurality of openings are substantially equal to each other.

An electrochemical plating apparatus for depositing a conductive material on a wafer includes a cell chamber. The plating solution is provided from a bottom of the cell chamber into the cell chamber. A plurality of openings passes through a sidewall of the cell chamber. A flow regulator is arranged with each of the plurality of openings configured to regulate an overflow amount of the plating solution flowing out through the each of the plurality of openings. The electrochemical plating apparatus further comprises a controller to control the flow regulator such that overflow amounts of the plating solution flowing out through the plurality of openings are substantially equal to each other.

The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.

The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.

The object of the present invention is to provide a method and system for electroplating without requiring ancillary facilities or anolyte control, while using an anode which can be relatively easily produced without requiring an expensive metal or special metal. When electroplating an article with metal, decomposition of an organic compound additive in a plating bath can be suppressed by using, as an anode, a conductive substrate having a layer comprising oxide or nitride of nickel and iron formed on a surface thereof.