Disclosed are novel electrolytes, and techniques for making and devices using such electrolytes, which are based on compressed-gas solvents. Unlike conventional electrolytes, the disclosed electrolytes are based on compressed-gas solvents mixed with various salts, referred to as compressed gas electrolytes. Various embodiments of a compressed-gas solvent includes a material that is in a gas phase and has a vapor pressure above atmospheric pressure at a room temperature. The disclosed compressed-gas electrolytes can have wide electrochemical potential windows, high conductivity, low temperature capability and/or high-pressure solvent properties. Examples of a class of compressed gases that can be used as solvent for electrolytes include hydrofluorocarbons, in particular fluoromethane, difluoromethane, tetrafluoroethane, and pentafluoroethane. Also disclosed are battery structures and supercapacitor structures that use compressed gas solvent-based electrolytes, and techniques for constructing such energy storage devices. Techniques for electroplating difficult-to-deposit materials using compressed-gas electrolytes as an electroplating bath are also disclosed.

The present invention relates to a module kit for a chemical and/or electrolytic surface treatment of a substrate, a platform assembly comprising such a module kit, a method for a chemical and/or electrolytic surface treatment of substrates and a use of such a module kit. The module kit comprises a process chamber, a first exchangeable dispense unit for dispensing a first liquid on the substrate, and a second exchangeable dispense unit for dispensing a second liquid on the substrate. The process chamber is dimensioned to receive either the first exchangeable dispense unit or the second exchangeable dispense unit. The first exchangeable dispense unit and the second exchangeable dispense unit are each dimensioned to receive the substrate. The process chamber comprises a kit interface for supplying the first liquid or the second liquid. The first exchangeable dispense unit comprises a first inlet interface for the first liquid. The second exchangeable dispense unit comprises a second inlet interface for the second liquid. The kit interface, the first inlet interface and the second inlet interface are configured for an exchangeable cooperation either between the kit interface and the first inlet interface or between the kit interface and the second inlet interface.

The present invention relates to a module kit for a chemical and/or electrolytic surface treatment of a substrate, a platform assembly comprising such a module kit, a method for a chemical and/or electrolytic surface treatment of substrates and a use of such a module kit. The module kit comprises a process chamber, a first exchangeable dispense unit for dispensing a first liquid on the substrate, and a second exchangeable dispense unit for dispensing a second liquid on the substrate. The process chamber is dimensioned to receive either the first exchangeable dispense unit or the second exchangeable dispense unit. The first exchangeable dispense unit and the second exchangeable dispense unit are each dimensioned to receive the substrate. The process chamber comprises a kit interface for supplying the first liquid or the second liquid. The first exchangeable dispense unit comprises a first inlet interface for the first liquid. The second exchangeable dispense unit comprises a second inlet interface for the second liquid. The kit interface, the first inlet interface and the second inlet interface are configured for an exchangeable cooperation either between the kit interface and the first inlet interface or between the kit interface and the second inlet interface.

A plating apparatus includes a plating tank configured to store a plating solution, a substrate holder configured to hold a substrate as a target on which a plating process is performed, a rotation mechanism that rotates the substrate holder, an elevating/lowering mechanism that elevates and lowers the substrate holder, and a control device, and the substrate holder includes a contact member configured to contact the substrate to be able to supply power to the substrate, a sealing member configured to seal a gap between the substrate holder and the substrate, a liquid holding portion including the contact member inside, and being configured to be able to hold liquid when the gap between the substrate holder and the substrate is sealed with the sealing member, and a spout port that is configured to open into the liquid holding portion or a space communicating with the liquid holding portion inside the substrate holder, or that can be disposed on a side of the substrate holder, to spout the liquid.

Disclosed are novel electrolytes, and techniques for making and devices using such electrolytes, which are based on compressed gas solvents. Unlike conventional electrolytes, disclosed electrolytes are based on compressed gas solvents mixed with various salts, referred to as compressed gas electrolytes. Various embodiments of a compressed gas solvent include a material that is in a gas phase and has a vapor pressure above an atmospheric pressure at room temperature. The disclosed compressed gas electrolytes can have wide electrochemical potential windows, high conductivity, low temperature capability and/or high pressure solvent properties. Examples of a class of compressed gases that can be used as solvent for electrolytes include hydrofluorocarbons, in particular fluoromethane, difluoromethane, tetrafluoroethane, and pentafluoroethane. Also disclosed are battery and supercapacitor structures that use compressed gas solvent-based electrolytes and techniques for constructing such energy storage devices. Techniques for electroplating difficult-to-deposit materials using compressed gas electrolytes as an electroplating bath are also disclosed.

Aspects are directed to a reference electrode integrated on a surface of a substrate to facilitate functionalization of a working electrode. The reference electrode is used in the electrochemical deposition or electrodeposition of one or more functional layers on a working electrode. The working electrode may be a sensing element of an analyte-selective sensor. Additional aspects of the current subject matter are directed to a counter electrode integrated on a surface of a substrate.

Disclosed are an electronic device including a housing having a matte surface and a method of manufacturing the same. An electronic device according to various embodiments of the disclosure is an electronic device including a housing. The housing may include a base material including an aluminum alloy, a plurality of pits adjacently formed on a surface of the base material, and a crystal grain boundary protrusion part formed as a crystal grain boundary of the surface of the base material portion protrudes on the surface. A method of manufacturing a housing for an electronic device may include an etching step of generating irregularities on a surface of a base material including an aluminum alloy in a way to etch the base material by dipping the base material into an etching solution containing chloride ions, and an anodizing step of forming an anodizing layer on the surface of the base material by dipping, into an anodizing solution, the base material on which the etching step has been completed and applying a current to the base material by using the base material as an anode.