Provided are cleaning methods and systems to remove unintended metallic deposits from electroplating apparatuses using reverse current deplating techniques. Such cleaning involves positioning a cleaning (deplating) disk in an electroplating cup similar to a regular processed substrate. The front surface of the cleaning disk includes a corrosion resistant conductive material to form electrical connections to deposits on the cup's surfaces. The disk is sealed in the cup and submerged into a plating solution. A reverse current is then applied to the front conductive surface of the disk to initiate deplating of the deposits. Sealing compression in the cup may change during cleaning to cause different deformation of the lip seal and to form new electrical connections to the deposits. The proposed cleaning may be applied to remove deposits formed during electroplating of alloys, in particular, tin-silver alloys widely used for semiconductor and wafer level packaging.

Provided are cleaning methods and systems to remove unintended metallic deposits from electroplating apparatuses using reverse current deplating techniques. Such cleaning involves positioning a cleaning (deplating) disk in an electroplating cup similar to a regular processed substrate. The front surface of the cleaning disk includes a corrosion resistant conductive material to form electrical connections to deposits on the cup's surfaces. The disk is sealed in the cup and submerged into a plating solution. A reverse current is then applied to the front conductive surface of the disk to initiate deplating of the deposits. Sealing compression in the cup may change during cleaning to cause different deformation of the lip seal and to form new electrical connections to the deposits. The proposed cleaning may be applied to remove deposits formed during electroplating of alloys, in particular, tin-silver alloys widely used for semiconductor and wafer level packaging.

Disclosed are novel electrolytes, and techniques for making and devices using such electrolytes, which are based on compressed gas solvents. Unlike conventional electrolytes, disclosed electrolytes are based on compressed gas solvents mixed with various salts, referred to as compressed gas electrolytes. Various embodiments of a compressed gas solvent includes a material that is in a gas phase and has a vapor pressure above an atmospheric pressure at a room temperature. The disclosed compressed gas electrolytes can have wide electrochemical potential windows, high conductivity, low temperature capability and/or high pressure solvent properties.

An electrolytic plating apparatus capable of establishing electric connection between a power supply and a substrate without physical contact is disclosed. The electrolytic plating apparatus includes: a plating tank configured to hold a plating solution therein; an anode disposed in the plating tank; a substrate holder having an electric contact arranged to be able to contact a substrate; a power supply coupled to the anode; a wireless electric-power transmitter coupled to the power supply; and a wireless electric-power receiver mounted to the substrate holder and electrically connected to the electric contact.

An electrolytic plating apparatus capable of establishing electric connection between a power supply and a substrate without physical contact is disclosed. The electrolytic plating apparatus includes: a plating tank configured to hold a plating solution therein; an anode disposed in the plating tank; a substrate holder having an electric contact arranged to be able to contact a substrate; a power supply coupled to the anode; a wireless electric-power transmitter coupled to the power supply; and a wireless electric-power receiver mounted to the substrate holder and electrically connected to the electric contact.

A system and method of operating an electrochemical mirror for reversibly controlling the propagation of electromagnetic radiation. The mirror preferably includes a first electrode transmissive substrate which is substantially transparent to the electromagnetic radiation, a second electrode, and an electrolyte containing metal ions between the pair of electrodes. A first cathodic potential is applied across the electrodes to cause the metal ions from the electrolyte to electrodeposit a mirror film on the first electrode transmissive substrate. A second anodic potential is applied across the electrodes to oxidize and strip the metallic mirror film from the first electrode transmissive electrode. After a plurality of deposition and stripping cycles, a cleaning cycle is initiated to remove undissolved reflective material on the first electrode preferably by applying a third potential across the first and second electrodes which is increased to a fourth potential and then decreased back to the third potential.

To stably convey a substrate (workpiece) while suppressing the workpiece from bending. A treatment device is provided. This treatment device includes: a conveying part that conveys a workpiece in a state where a flat surface of the workpiece is inclined around a conveying directional axis relative to a horizontal plane; and a treatment part in which at least one of polishing and cleaning is performed on the flat surface of the workpiece, wherein the conveying part has a drive part configured to be brought into physical contact with an end part of the workpiece and apply force in a conveying direction to the workpiece, a first Bernoulli chuck arranged to face the flat surface of the workpiece, and a second Bernoulli chuck arranged to face an end face of an opposite end part to the end part of the workpiece.

To stably convey a substrate (workpiece) while suppressing the workpiece from bending. A treatment device is provided. This treatment device includes: a conveying part that conveys a workpiece in a state where a flat surface of the workpiece is inclined around a conveying directional axis relative to a horizontal plane; and a treatment part in which at least one of polishing and cleaning is performed on the flat surface of the workpiece, wherein the conveying part has a drive part configured to be brought into physical contact with an end part of the workpiece and apply force in a conveying direction to the workpiece, a first Bernoulli chuck arranged to face the flat surface of the workpiece, and a second Bernoulli chuck arranged to face an end face of an opposite end part to the end part of the workpiece.

An electroplating bath includes a bottom plate, and a first side wall and a second side wall arranged oppositely on the bottom plate. The first side wall is provided with a first drainage zone, and the first drainage zone includes a first side plate with a first overflow hole. The second side wall is provided with a second drainage zone, and the second drainage zone includes a second side plate with a second overflow hole. The second side wall is further provided with a plurality of liquid outlet holes communicating with the second drainage zone, and a height of each liquid outlet hole is lower than a height of the first overflow hole and a height of the second overflow hole. The bottom plate is provided with a third drainage zone, and the third drainage zone communicates with the first drainage zone and the second drainage zone.

An electroplating bath includes a bottom plate, and a first side wall and a second side wall arranged oppositely on the bottom plate. The first side wall is provided with a first drainage zone, and the first drainage zone includes a first side plate with a first overflow hole. The second side wall is provided with a second drainage zone, and the second drainage zone includes a second side plate with a second overflow hole. The second side wall is further provided with a plurality of liquid outlet holes communicating with the second drainage zone, and a height of each liquid outlet hole is lower than a height of the first overflow hole and a height of the second overflow hole. The bottom plate is provided with a third drainage zone, and the third drainage zone communicates with the first drainage zone and the second drainage zone.