The present disclosure relates a method of purifying diamond by removing carbon contaminants from diamond grains in the diamond by a plasma cleaning process at a temperature at which metal inclusion contaminants in the diamond grains crack the diamond grains from within, and removing metal contaminants from the diamond in a chemical or electrochemical cleaning process.

A method for removing powder from a component or part produced by metal additive manufacturing systems based on powder beds. The method includes manufacturing a part by additive manufacturing, the part having at least one internal cavity with at least one external opening. The internal cavity is at least partly filled with powder, the powder in the internal cavity having grains agglomerated or connected to each other. The method further including: evacuating gas from the internal cavity; adding liquid electrolyte to the internal cavity, and using an electrochemical process for separating connected powder grains in the cavity.

A method for removing powder from a component or part produced by metal additive manufacturing systems based on powder beds. The method includes manufacturing a part by additive manufacturing, the part having at least one internal cavity with at least one external opening. The internal cavity is at least partly filled with powder, the powder in the internal cavity having grains agglomerated or connected to each other. The method further including: evacuating gas from the internal cavity; adding liquid electrolyte to the internal cavity, and using an electrochemical process for separating connected powder grains in the cavity.

The invention relates to a strip consisting of an aluminium alloy for providing adhesive connections. In addition, the invention relates to a method for producing a strip having a one or two-sided surface structure which consists of an aluminium alloy, at least provided in certain areas and prepared for an adhesive connection, and also relates to a corresponding adhesive connection. The object of providing an aluminium alloy strip optimised for adhesive connections, which has optimised surface properties for ageing-resistant adhesive connections, on the one hand, and which can be cost-effectively produced in a way which is reliable in terms of the process, on the other hand, is achieved for a strip consisting of an aluminium alloy for providing adhesive connections by the strip at least in areas having a surface structure prepared for adhesive connections, wherein the surface structure has depressions which were produced using an electrochemical graining process.

The invention relates to a strip consisting of an aluminium alloy for providing adhesive connections. In addition, the invention relates to a method for producing a strip having a one or two-sided surface structure which consists of an aluminium alloy, at least provided in certain areas and prepared for an adhesive connection, and also relates to a corresponding adhesive connection. The object of providing an aluminium alloy strip optimised for adhesive connections, which has optimised surface properties for ageing-resistant adhesive connections, on the one hand, and which can be cost-effectively produced in a way which is reliable in terms of the process, on the other hand, is achieved for a strip consisting of an aluminium alloy for providing adhesive connections by the strip at least in areas having a surface structure prepared for adhesive connections, wherein the surface structure has depressions which were produced using an electrochemical graining process.

A gas exchange valve for an internal combustion engine may include a valve stem and a wear resistance improving functional layer. The valve stem may extend in an axial direction and may transition into a valve plate in the axial direction. The functional layer may include nickel and tungsten. The functional layer may be arranged in a coating area on an outer circumference of the valve stem and may at least partially define a sliding surface.

In a tin-plated product wherein a surface of a substrate 10 of copper or a copper alloy is plated with tin, an underlying layer 12 of at least one of nickel and a copper-nickel alloy is formed on the surface of the substrate 10, and an outermost layer formed on the surface of the underlying layer 12 is composed of a copper-tin alloy layer 14 and tin layers 16, the copper-tin alloy 14 being formed of a large number of crystal grains of a copper-tin alloy, each of the tin layers 16 being arranged in a corresponding one of recessed portions, each of which is formed between adjacent crystal grains of the large number of crystal grains of the copper-tin alloy, the adjacent crystal grains being adjacent to each other on the outermost surface of the outer most layer, the area ratio occupied by the tin layers 16 on the outermost surface being 20 to 80%, and the maximum thickness of the tin layers 16 being smaller than the average particle diameter of the crystal grains of the copper-tin alloy.

In a tin-plated product wherein a surface of a substrate 10 of copper or a copper alloy is plated with tin, an underlying layer 12 of at least one of nickel and a copper-nickel alloy is formed on the surface of the substrate 10, and an outermost layer formed on the surface of the underlying layer 12 is composed of a copper-tin alloy layer 14 and tin layers 16, the copper-tin alloy 14 being formed of a large number of crystal grains of a copper-tin alloy, each of the tin layers 16 being arranged in a corresponding one of recessed portions, each of which is formed between adjacent crystal grains of the large number of crystal grains of the copper-tin alloy, the adjacent crystal grains being adjacent to each other on the outermost surface of the outer most layer, the area ratio occupied by the tin layers 16 on the outermost surface being 20 to 80%, and the maximum thickness of the tin layers 16 being smaller than the average particle diameter of the crystal grains of the copper-tin alloy.

The present invention refers to a method for processing a wafer like substrate using a touching gripper and a touchless gripper. Furthermore, the present invention refers to an apparatus for processing a wafer-like substrate containing a touching gripper and a touchless gripper. Additionally, the present invention refers to the use of an inventive apparatus to process a wafer-like substrate.

The present invention refers to a method for processing a wafer like substrate using a touching gripper and a touchless gripper. Furthermore, the present invention refers to an apparatus for processing a wafer-like substrate containing a touching gripper and a touchless gripper. Additionally, the present invention refers to the use of an inventive apparatus to process a wafer-like substrate.