Patent classifications
C25F1/00
Process for producing a distributor plate for an electrochemical system and distributor plate for an electrochemical system
A process (30) for producing a distributor plate (1) for an electrochemical system, wherein the distributor plate (1) has at least one metal foil (2) having a first surface (3) and a second surface (4) and the process (30) has the following process steps: a) pretreatment (31) of the metal foil (2); b) mask formation (32) at least on the first surface (3) of the pretreated metal foil (2); c) structure formation (33) at least on the first surface (3) of the metal foil (2) provided with the mask (10), as a result of which a first fluid distributor structure (5) is formed; d) mask removal (36).
Process for producing a distributor plate for an electrochemical system and distributor plate for an electrochemical system
A process (30) for producing a distributor plate (1) for an electrochemical system, wherein the distributor plate (1) has at least one metal foil (2) having a first surface (3) and a second surface (4) and the process (30) has the following process steps: a) pretreatment (31) of the metal foil (2); b) mask formation (32) at least on the first surface (3) of the pretreated metal foil (2); c) structure formation (33) at least on the first surface (3) of the metal foil (2) provided with the mask (10), as a result of which a first fluid distributor structure (5) is formed; d) mask removal (36).
METHOD OF CLEANING USED DIALYSIS FLUID USING ELECTRODIALYSIS AND UREA OXIDATION
A method of cleaning used dialysis fluid having urea to produce a cleaned dialysis fluid, the method including passing the used dialysis fluid having urea through a combination electrodialysis and urea oxidation cell, the cell including (i) a first set of electrodes for separation of the used dialysis fluid having urea into an acid stream and a basic stream, wherein the first set of electrodes includes an anode and a cathode; (ii) one or more second set of electrodes positioned to contact the basic stream with an electrocatalytic surface for decomposition of urea via electrooxidation, wherein the one or more second set of electrodes includes an anode and a cathode; and (iii) at least one power source to provide the first and second sets of electrodes with an electrical charge to activate the electrocatalytic surface.
METHOD OF CLEANING USED DIALYSIS FLUID USING ELECTRODIALYSIS AND UREA OXIDATION
A method of cleaning used dialysis fluid having urea to produce a cleaned dialysis fluid, the method including passing the used dialysis fluid having urea through a combination electrodialysis and urea oxidation cell, the cell including (i) a first set of electrodes for separation of the used dialysis fluid having urea into an acid stream and a basic stream, wherein the first set of electrodes includes an anode and a cathode; (ii) one or more second set of electrodes positioned to contact the basic stream with an electrocatalytic surface for decomposition of urea via electrooxidation, wherein the one or more second set of electrodes includes an anode and a cathode; and (iii) at least one power source to provide the first and second sets of electrodes with an electrical charge to activate the electrocatalytic surface.
WAFER-LIKE SUBSTRATE PROCESSING METHOD AND APPARATUS
The present invention refers to a method for processing a wafer like substrate using a touching gripper and a touchless gripper. Furthermore, the present invention refers to an apparatus for processing a wafer-like substrate containing a touching gripper and a touchless gripper. Additionally, the present invention refers to the use of an inventive apparatus to process a wafer-like substrate.
WAFER-LIKE SUBSTRATE PROCESSING METHOD AND APPARATUS
The present invention refers to a method for processing a wafer like substrate using a touching gripper and a touchless gripper. Furthermore, the present invention refers to an apparatus for processing a wafer-like substrate containing a touching gripper and a touchless gripper. Additionally, the present invention refers to the use of an inventive apparatus to process a wafer-like substrate.
METHOD OF TIN-PLATING COPPER ALLOY FOR ELECTRIC OR ELECTRONIC PARTS AND AUTOMOBILE PARTS AND TIN-PLATING MATERIAL OF COPPER ALLOY MANUFACTURED THEREFROM
The present invention provides a method of tin-plating a copper alloy for electric or electronic parts and automobile parts which has excellent insertion force, heat-resistant peeling, and solderability, and a tin-plating material of a copper alloy manufactured therefrom.
TREATMENT SYSTEM FOR CLEANING A COMPONENT CONTAMINATED BY BIOFILM, IN PARTICULAR AN IMPLANT PART
The invention relates to a treatment system (1) for cleaning a component contaminated by biofilm, more particularly for cleaning bacterially contaminated surfaces of bone implants or dental implants (30), the treatment system comprising at least two conductor elements (2, 4) connected to an electrical supply unit (10) to form an electrical circuit. One of the conductor elements can be brought into electrical contact with the component in need of treatment. The object of the invention is to provide a treatment system of this type which allows a particularly acceptable and flexible treatment. To this end, according to the invention at least one of the conductor elements (2, 4) is designed as a diamond electrode (26).
Grain-oriented electrical steel sheet
Provided is a grain-oriented electrical steel sheet including a steel sheet having a steel sheet surface in which a groove, which extends in a direction intersecting a rolling direction and of which a groove depth direction matches a sheet thickness direction, is formed. When an average value of a groove depth in a sheet thickness direction at a central portion of the groove in a longitudinal groove direction is set as an average groove depth D, a straight line, which connects a first point at which a groove depth in the sheet thickness direction becomes 0.05D and a second point at which the groove depth becomes 0.50D, at an inclined portion of the groove is set as a groove end straight line, an angle made by the steel sheet surface and the groove end straight line is set as a first angle , and an average value of a groove-width-direction length, which is a length of a line segment connecting two points at which a groove depth in the sheet thickness direction in a contour of the groove on the groove-width-direction cross-section becomes 0.05D, is set as an average groove width W, an aspect ratio A obtained by dividing the average groove depth D by the average groove width W, and the first angle satisfy the following Expression (1).
<21A+77(1)
Grain-oriented electrical steel sheet
Provided is a grain-oriented electrical steel sheet including a steel sheet having a steel sheet surface in which a groove, which extends in a direction intersecting a rolling direction and of which a groove depth direction matches a sheet thickness direction, is formed. When an average value of a groove depth in a sheet thickness direction at a central portion of the groove in a longitudinal groove direction is set as an average groove depth D, a straight line, which connects a first point at which a groove depth in the sheet thickness direction becomes 0.05D and a second point at which the groove depth becomes 0.50D, at an inclined portion of the groove is set as a groove end straight line, an angle made by the steel sheet surface and the groove end straight line is set as a first angle , and an average value of a groove-width-direction length, which is a length of a line segment connecting two points at which a groove depth in the sheet thickness direction in a contour of the groove on the groove-width-direction cross-section becomes 0.05D, is set as an average groove width W, an aspect ratio A obtained by dividing the average groove depth D by the average groove width W, and the first angle satisfy the following Expression (1).
<21A+77(1)