A manufacturing method includes: (1) providing M-M nanowires, wherein M is at least one sacrificial metal different from M; and (2) subjecting the M-M nanowires to electrochemical de-alloying to form jagged M nanowires.

A manufacturing method includes: (1) providing M-M nanowires, wherein M is at least one sacrificial metal different from M; and (2) subjecting the M-M nanowires to electrochemical de-alloying to form jagged M nanowires.

Provided are: a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, and wherein a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.

Provided are: a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, and wherein a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.

Processes for cleaning anodic film pore structures are described. The processes employ methods for gas generation within the pores to flush out contamination within the anodic film. The pore cleaning processes can eliminate cosmetic defects related to anodic pore contamination during the manufacturing process. For example, an anodic film that is adjacent to a polymer piece can experience contamination originating from a gap between the anodic film and polymer piece, which can inhibit colorant uptake of the anodic film in areas proximate the polymer piece. In some cases, an alternating current anodizing process or a separate operation of cathodic polarization is implemented to generate hydrogen gas that bubbles out of the pores, forcing the contaminates out of the anodic film.

Processes for cleaning anodic film pore structures are described. The processes employ methods for gas generation within the pores to flush out contamination within the anodic film. The pore cleaning processes can eliminate cosmetic defects related to anodic pore contamination during the manufacturing process. For example, an anodic film that is adjacent to a polymer piece can experience contamination originating from a gap between the anodic film and polymer piece, which can inhibit colorant uptake of the anodic film in areas proximate the polymer piece. In some cases, an alternating current anodizing process or a separate operation of cathodic polarization is implemented to generate hydrogen gas that bubbles out of the pores, forcing the contaminates out of the anodic film.

An example method for plasma cleaning a container includes generating plasma flowing within the container, applying a magnet to an exterior surface of the container causing the plasma within the container to be attracted to the magnet, and moving the magnet in a motion over the exterior surface to control movement of the plasma within the container and to clean one or more areas of the container with the plasma according to the motion. An example system for plasma cleaning a container includes a power source, a gas inlet on the container for dispersing a gas within the container, and based on current flowing, the gas converts to plasma. The system also includes a robotic manipulator having an end effector coupled to a magnet to move the magnet in a motion over an exterior surface of the container causing the plasma within the container to be attracted to the magnet.

A reactor vessel is provided having a solids feed opening for particulate graphite and a product outlet for purified particulate graphite. The vessel has an interior volume for containing the graphite particles, with a plurality of gas feed openings at the bottom of the interior volume, near the centre-line, for feeding of chlorine-containing gas, wherein the chlorine-containing gas passes through the particulate graphite, fluidizing the particulate graphite. Electrodes are provided which function to heat the particulate graphite, as it is carried upwards under the fluidizing effect of the centrally injected chlorine-containing gas. When the heated graphite particles react with the chlorine gas, purified particulate graphite is formed and may be extracted through the product outlet.

An electrochemical cleaner is disclosed including a power supply coupled to a transformer and an electronics housing including one or more wand assembly ports and one or more ground ports. A first wand assembly port of the one or more wand assembly ports is electronically coupled to a first wire coupled to a magnet wire of the transformer and a ground connector is electronically coupled to approximately the first end of the magnet wire. The electrochemical cleaner also includes a voltage selector configured to select between a plurality of voltage potentials between a wand assembly connector and the ground connector and a wand assembly comprising a handle coupled to a length of wire and an electrode port, the electrode port configured to couple to an electrode shaft.

An electrochemical cleaner is disclosed including a power supply coupled to a transformer and an electronics housing including one or more wand assembly ports and one or more ground ports. A first wand assembly port of the one or more wand assembly ports is electronically coupled to a first wire coupled to a magnet wire of the transformer and a ground connector is electronically coupled to approximately the first end of the magnet wire. The electrochemical cleaner also includes a voltage selector configured to select between a plurality of voltage potentials between a wand assembly connector and the ground connector and a wand assembly comprising a handle coupled to a length of wire and an electrode port, the electrode port configured to couple to an electrode shaft.