Patent classifications
C25F1/00
PROCESSING DEVICE FOR METAL MATERIALS
A processing device for a metal material, containing: an airtight container for housing a specimen thereinside; an oxygen pump for extracting oxygen molecules from a gas discharged from the airtight container; a circulation means for returning the gas into the airtight container; and a plasma generation means present inside the airtight container for converting the gas returned from the circulation means into plasma and exposing the specimen thereto.
PROCESSING DEVICE FOR METAL MATERIALS
A processing device for a metal material, containing: an airtight container for housing a specimen thereinside; an oxygen pump for extracting oxygen molecules from a gas discharged from the airtight container; a circulation means for returning the gas into the airtight container; and a plasma generation means present inside the airtight container for converting the gas returned from the circulation means into plasma and exposing the specimen thereto.
COPPER ALLOY PLATE STRIP FOR USE IN LED LEAD FRAME
A copper alloy sheet or strip for a lead frame of LED includes specific amounts of Fe, P, Zn, and Sn with the remainder being Cu and unavoidable impurities. A surface roughness thereof is less than 0.06 μm in terms of arithmetic average roughness Ra and is less than 0.5 μm in terms of ten-point average roughness Rz.sub.JIS. The number of groove-shaped recesses present on the surface, each having a length of 5 μm or more and a depth of 0.25 μm or more, is 2 or less in a range of a square of 200 μm×200 μm with a pair of its sides running in transverse to a rolling direction. A thickness of a work affected layer formed of fine grains on the surface is 0.5 μm or less.
COPPER ALLOY PLATE STRIP FOR USE IN LED LEAD FRAME
A copper alloy sheet or strip for a lead frame of LED includes specific amounts of Fe, P, Zn, and Sn with the remainder being Cu and unavoidable impurities. A surface roughness thereof is less than 0.06 μm in terms of arithmetic average roughness Ra and is less than 0.5 μm in terms of ten-point average roughness Rz.sub.JIS. The number of groove-shaped recesses present on the surface, each having a length of 5 μm or more and a depth of 0.25 μm or more, is 2 or less in a range of a square of 200 μm×200 μm with a pair of its sides running in transverse to a rolling direction. A thickness of a work affected layer formed of fine grains on the surface is 0.5 μm or less.
PRETREATMENT METHOD FOR PRETREATING COMPONENTS PRIOR TO ELECTROPLATING
A pretreatment method for pretreating components, which are each formed of at least two different materials, prior to a coating process. The pretreatment method includes the steps: alkaline degreasing; chemical pickling in a first pickling medium; anodic pickling in a second pickling medium; and cathodic degreasing.
Electrolyte for electrochemical decontamination and preparation method and application thereof
An electrolyte for electrochemical decontamination and a preparation method and application thereof. The electrolyte is an aqueous solution including the following solutes: phosphoric acid, oxalic acid, citric acid, tartaric acid, hydrogen peroxide and glacial acetic acid. The electrolyte has a good decontamination effect and allows for fast decontamination and is obtained by reasonably combining different types of solutes and controlling the levels of the solutes and resulting secondary waste solution and residues are easy to treat. The electrolyte is suitable for overall or local electrochemical decontamination of radioactively contaminated stainless steel scrap.
Electrolyte for electrochemical decontamination and preparation method and application thereof
An electrolyte for electrochemical decontamination and a preparation method and application thereof. The electrolyte is an aqueous solution including the following solutes: phosphoric acid, oxalic acid, citric acid, tartaric acid, hydrogen peroxide and glacial acetic acid. The electrolyte has a good decontamination effect and allows for fast decontamination and is obtained by reasonably combining different types of solutes and controlling the levels of the solutes and resulting secondary waste solution and residues are easy to treat. The electrolyte is suitable for overall or local electrochemical decontamination of radioactively contaminated stainless steel scrap.
Electrode array device having an adsorbed porous reaction layer
There is disclosed an electrode array device having an adsorbed porous reaction layer for improved synthesis quality. The array comprises a plurality of electrodes on a substrate, wherein the electrodes are electronically connected to a computer control system. The array has an adsorbed porous reaction layer on the plurality of electrodes, wherein the adsorbed porous reaction layer comprises a chemical species having at least one hydroxyl group. In the preferred embodiment, the reaction layer is sucrose. A method for preparing an electrode array for improved synthesis quality is disclosed. The method comprises a cleaning method and a method of attachment of a reaction layer. The cleaning method comprises a plasma cleaning method and a chemical cleaning method. The reaction layer is attached after cleaning by exposing the microarray to a solution containing the chemical species having at least one hydroxyl group.
Electrode array device having an adsorbed porous reaction layer
There is disclosed an electrode array device having an adsorbed porous reaction layer for improved synthesis quality. The array comprises a plurality of electrodes on a substrate, wherein the electrodes are electronically connected to a computer control system. The array has an adsorbed porous reaction layer on the plurality of electrodes, wherein the adsorbed porous reaction layer comprises a chemical species having at least one hydroxyl group. In the preferred embodiment, the reaction layer is sucrose. A method for preparing an electrode array for improved synthesis quality is disclosed. The method comprises a cleaning method and a method of attachment of a reaction layer. The cleaning method comprises a plasma cleaning method and a chemical cleaning method. The reaction layer is attached after cleaning by exposing the microarray to a solution containing the chemical species having at least one hydroxyl group.
Electrolytic brush assembly
Disclosed herein is an electrolytic brush assembly comprising a handle assembly; a shroud extending from the handle assembly, the shroud having an aperture at a distal end thereof; a brush connecting assembly for releasably connecting a brush to the handle assembly whereby the brush extends through the aperture of the shroud and a fluid delivery assembly. The handle assembly comprises an adjustment sub-assembly for selectively moving the brush connecting assembly and a brush connected thereto relative to the handle assembly and the aperture of the shroud. The fluid delivery assembly delivers electrolytic fluid to the proximity of the brush, optionally under closed loop control.