According to one embodiment, a method of manufacturing a semiconductor device includes loading a substrate into a processing container, airtightly sealing the processing container in which the substrate has been loaded, reducing a pressure of the processing container airtightly sealed, supplying a processing solution into the processing container with reduced pressure, performing a process on the substrate using the processing solution, discharging the processing solution used for the process from the processing container, after discharging the processing solution, opening the processing container, and unloading the substrate subjected to the process out of the processing container.

According to one embodiment, a method of manufacturing a semiconductor device includes loading a substrate into a processing container, airtightly sealing the processing container in which the substrate has been loaded, reducing a pressure of the processing container airtightly sealed, supplying a processing solution into the processing container with reduced pressure, performing a process on the substrate using the processing solution, discharging the processing solution used for the process from the processing container, after discharging the processing solution, opening the processing container, and unloading the substrate subjected to the process out of the processing container.

The invention relates to a treatment system (I) for cleaning a component contaminated by biofilm, more particularly for cleaning bacterially contaminated surfaces of bone implants or dental implants (30), the treatment system comprising at least two conductor elements (2, 4) connected to an electrical supply unit (10) to form an electrical circuit. One of the conductor elements can be brought into electrical contact with the component in need of treatment. The object of the invention is to provide a treatment system of this type which allows a particularly acceptable and flexible treatment. To this end, according to the invention at least one of the conductor elements (2, 4) is designed as a diamond electrode (26).

A welding burn remover includes: a mover including a movable body to which a support of an electrolytic end effector is attached and at least one actuator that moves the movable body; and processing circuitry configured to control the actuator. The processing circuitry is configured to execute an electrolytic treatment in which the processing circuitry controls the actuator to slide an electrode on a welding burn portion of a welded workpiece through a short-circuit prevention cover while controlling a pump to supply an electrolytic solution to a boundary by an electrolytic solution feeder. The support of the electrolytic end effector includes: a base attached to the movable body of the mover; and a coupler connecting the electrode to the base such that the electrode is angularly displaceable relative to the base.

A welding burn remover includes: a mover including a movable body to which a support of an electrolytic end effector is attached and at least one actuator that moves the movable body; and processing circuitry configured to control the actuator. The processing circuitry is configured to execute an electrolytic treatment in which the processing circuitry controls the actuator to slide an electrode on a welding burn portion of a welded workpiece through a short-circuit prevention cover while controlling a pump to supply an electrolytic solution to a boundary by an electrolytic solution feeder. The support of the electrolytic end effector includes: a base attached to the movable body of the mover; and a coupler connecting the electrode to the base such that the electrode is angularly displaceable relative to the base.

A method of cleaning used dialysis fluid having urea to produce a cleaned dialysis fluid, the method including passing the used dialysis fluid having urea through a combination electrodialysis and urea oxidation cell, the cell including (i) a first set of electrodes for separation of the used dialysis fluid having urea into an acid stream and a basic stream, wherein the first set of electrodes includes an anode and a cathode; (ii) one or more second set of electrodes positioned to contact the basic stream with an electrocatalytic surface for decomposition of urea via electrooxidation, wherein the one or more second set of electrodes includes an anode and a cathode; and (iii) at least one power source to provide the first and second sets of electrodes with an electrical charge to activate the electrocatalytic surface.

A method of cleaning used dialysis fluid having urea to produce a cleaned dialysis fluid, the method including passing the used dialysis fluid having urea through a combination electrodialysis and urea oxidation cell, the cell including (i) a first set of electrodes for separation of the used dialysis fluid having urea into an acid stream and a basic stream, wherein the first set of electrodes includes an anode and a cathode; (ii) one or more second set of electrodes positioned to contact the basic stream with an electrocatalytic surface for decomposition of urea via electrooxidation, wherein the one or more second set of electrodes includes an anode and a cathode; and (iii) at least one power source to provide the first and second sets of electrodes with an electrical charge to activate the electrocatalytic surface.

A method for cleaning a surface of an aluminum or aluminum alloy body by immersing the surface in a basic aqueous electrolyte formed essentially from dissolved trisodium phosphate, flowing DC current through the electrolyte and the body for cleaning, and then removing the body from the electrolyte. An additional cleaning step, which may include ultrasonic cleaning, may be performed to remove loose matter adhering to the body after the electrolytic cleaning.

A method for cleaning a surface of an aluminum or aluminum alloy body by immersing the surface in a basic aqueous electrolyte formed essentially from dissolved trisodium phosphate, flowing DC current through the electrolyte and the body for cleaning, and then removing the body from the electrolyte. An additional cleaning step, which may include ultrasonic cleaning, may be performed to remove loose matter adhering to the body after the electrolytic cleaning.

The present invention provides a resin plating method using an etching bath containing manganese as an active ingredient, the method being capable of maintaining stable etching performance even during continuous use. The resin plating method includes: an etching step, which uses a resin material-containing article as an object to be treated and etches the article using an acidic etching bath containing manganese; a catalyst application step, which uses palladium as a catalyst metal; and an electroless plating step; and the method further includes a step of maintaining the palladium concentration in the acidic etching bath at 100 mg/L or less.