A method for additive manufacturing utilizing a build plate with a release layer is provided. The method includes irradiating a first layer of powder in a powder bed to form a first fused region over a support. The first release layer is provided between the first fused region and the support. The method also includes providing a given layer of powder over the powder bed and irradiating the given layer of powder in the powder bed to form a given fused region. Providing the given layer of powder over the powder bed and irradiating the given layer of powder in the powder bed to form a given fused region are repeated until the object is formed in the powder bed. The object may be formed fusing individual layers with irradiation by laser or ebeam, or by binder jetting. The method further includes separating the object from the support by melting or dissolving the first release layer.

A method of producing a graphene film (22) includes forming a catalyst film (20) on a support (18); forming a graphene film (22) on the catalyst film (20); and electrolytically removing the catalyst film (20) from the support (18). The method may include transferring the graphene film (22) to a substrate (29). A supported graphene film includes a conductive support (18); a catalyst film (20) formed on the conductive support (18) having a thickness in a range of 1 nm to 10 μm, and a graphene film (22) formed on the catalyst film (20).

A method of producing a graphene film (22) includes forming a catalyst film (20) on a support (18); forming a graphene film (22) on the catalyst film (20); and electrolytically removing the catalyst film (20) from the support (18). The method may include transferring the graphene film (22) to a substrate (29). A supported graphene film includes a conductive support (18); a catalyst film (20) formed on the conductive support (18) having a thickness in a range of 1 nm to 10 μm, and a graphene film (22) formed on the catalyst film (20).

Provided are a diamond composite body capable of shortening a separation time for separating a substrate and a diamond layer, the substrate, and a method for manufacturing a diamond, as well as a diamond obtained from the diamond composite body and a tool including the diamond. The diamond composite body includes a substrate including a diamond seed crystal and having grooves in a main surface, a diamond layer formed on the main surface of the substrate, and a non-diamond layer formed on a substrate side at a constant depth from an interface between the substrate and the diamond layer.

Provided are a diamond composite body capable of shortening a separation time for separating a substrate and a diamond layer, the substrate, and a method for manufacturing a diamond, as well as a diamond obtained from the diamond composite body and a tool including the diamond. The diamond composite body includes a substrate including a diamond seed crystal and having grooves in a main surface, a diamond layer formed on the main surface of the substrate, and a non-diamond layer formed on a substrate side at a constant depth from an interface between the substrate and the diamond layer.

Provided are a diamond composite body capable of shortening a separation time for separating a substrate and a diamond layer, the substrate, and a method for manufacturing a diamond, as well as a diamond obtained from the diamond composite body and a tool including the diamond. The diamond composite body includes a substrate including a diamond seed crystal and having grooves in a main surface, a diamond layer formed on the main surface of the substrate, and a non-diamond layer formed on a substrate side at a constant depth from an interface between the substrate and the diamond layer.

Provided are a diamond composite body capable of shortening a separation time for separating a substrate and a diamond layer, the substrate, and a method for manufacturing a diamond, as well as a diamond obtained from the diamond composite body and a tool including the diamond. The diamond composite body includes a substrate including a diamond seed crystal and having grooves in a main surface, a diamond layer formed on the main surface of the substrate, and a non-diamond layer formed on a substrate side at a constant depth from an interface between the substrate and the diamond layer.

A method of adding a feature to a part made of a metal alloy includes wire electric-discharge machining the feature into the part using a wire electrode having a zinc component to create a recast layer. After the step of wire electric-discharge machining the feature, at least some of the recast layer is removed by performing an electrochemical etching process that includes positioning a cathode adjacent the feature and passing current through a portion of the part that contains the feature.

Provided herein is a method for preparing MXenes, such as Ti.sub.2CT.sub.x, Cr.sub.2CT.sub.x, and V.sub.2CT.sub.x, products prepared therefrom, and compositions and devices including the same.

The present invention deals with a process for deposition of indium or indium alloys and an article obtained by the process, wherein the process includes the steps i. providing a substrate having at least one metal or metal alloy surface; ii. depositing a first indium or indium alloy layer on at least one portion of said surface whereby a composed phase layer is formed of a part of the metal or metal alloy surface and a part of the first indium or indium alloy layer; iii. removing partially or wholly the part of the first indium or indium alloy layer which has not been formed into the composed phase layer; iv. depositing a second indium or indium alloy layer on the at least one portion of the surface obtained in step iii.