The present invention deals with a process for deposition of indium or indium alloys and an article obtained by the process, wherein the process includes the steps i. providing a substrate having at least one metal or metal alloy surface; ii. depositing a first indium or indium alloy layer on at least one portion of said surface whereby a composed phase layer is formed of a part of the metal or metal alloy surface and a part of the first indium or indium alloy layer; iii. removing partially or wholly the part of the first indium or indium alloy layer which has not been formed into the composed phase layer; iv. depositing a second indium or indium alloy layer on the at least one portion of the surface obtained in step iii.

The present invention is a method of metal polishing and oxidation film process applied on a metal workpiece. The process comprises (a) providing the metallic workpiece in an electrolysis polishing liquid; (b) a temperature control device controlling a liquid temperature of the electrolysis polishing liquid; (c) a voltage supply device to exercising an operating voltage between the metallic workpiece and the electrolysis polishing liquid; (d) polishing the surface of the metallic workpiece and forming an oxidation layer by regulating the temperature control device and the voltage supply device; and (e) determining a film thickness of the oxidation layer formed on the metallic workpiece according to an operation time, wherein the film thickness is related to a roughness and a color displayed on the metallic workpiece. The metallic workpiece may be dyed together during the polishing process without adding any dyes. The present invention further provides a system of alloy oxidation film process.

The present invention is a method of metal polishing and oxidation film process applied on a metal workpiece. The process comprises (a) providing the metallic workpiece in an electrolysis polishing liquid; (b) a temperature control device controlling a liquid temperature of the electrolysis polishing liquid; (c) a voltage supply device to exercising an operating voltage between the metallic workpiece and the electrolysis polishing liquid; (d) polishing the surface of the metallic workpiece and forming an oxidation layer by regulating the temperature control device and the voltage supply device; and (e) determining a film thickness of the oxidation layer formed on the metallic workpiece according to an operation time, wherein the film thickness is related to a roughness and a color displayed on the metallic workpiece. The metallic workpiece may be dyed together during the polishing process without adding any dyes. The present invention further provides a system of alloy oxidation film process.

A system and method of operating an electrochemical mirror for reversibly controlling the propagation of electromagnetic radiation. The mirror preferably includes a first electrode transmissive substrate which is substantially transparent to the electromagnetic radiation, a second electrode, and an electrolyte containing metal ions between the pair of electrodes. A first cathodic potential is applied across the electrodes to cause the metal ions from the electrolyte to electrodeposit a mirror film on the first electrode transmissive substrate. A second anodic potential is applied across the electrodes to oxidize and strip the metallic mirror film from the first electrode transmissive electrode. After a plurality of deposition and stripping cycles, a cleaning cycle is initiated to remove undissolved reflective material on the first electrode preferably by applying a third potential across the first and second electrodes which is increased to a fourth potential and then decreased back to the third potential.

Provided are a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, in which a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.

Provided are a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, in which a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.

An electroplating etching apparatus includes a power to output current, and a container configured to contain an electrolyte. A cathode is coupled to the container and configured to fluidly communicate with the electrolyte. An anode is electrically connected to the output, and includes a graphene layer. A metal substrate layer is formed on the graphene layer, and is etched from the graphene layer in response to the current flowing through the anode.

An electroplating etching apparatus includes a power to output current, and a container configured to contain an electrolyte. A cathode is coupled to the container and configured to fluidly communicate with the electrolyte. An anode is electrically connected to the output, and includes a graphene layer. A metal substrate layer is formed on the graphene layer, and is etched from the graphene layer in response to the current flowing through the anode.

Systems and methods for the recovery of noble metal from noble-metal-containing material are generally described. Certain embodiments related to systems and methods in which an electric current is transported between an electrode and the noble metal of a noble-metal-containing material to dissolve at least a portion of the noble metal from the noble-metal-containing material. The dissolved noble metal can subsequently be precipitated out of solution and recovered, according to certain embodiments. Noble metals can be recovered from any suitable noble-metal-containing material, including plated and/or filled scrap materials and/or other materials.

A system and method of operating an electrochemical mirror for reversibly controlling the propagation of electromagnetic radiation. The mirror preferably includes a first electrode transmissive substrate which is substantially transparent to the electromagnetic radiation, a second electrode, and an electrolyte containing metal ions between the pair of electrodes. A first cathodic potential is applied across the electrodes to cause the metal ions from the electrolyte to electrodeposit a mirror film on the first electrode transmissive substrate. A second anodic potential is applied across the electrodes to oxidize and strip the metallic mirror film from the first electrode transmissive electrode. After a plurality of deposition and stripping cycles, a cleaning cycle is initiated to remove undissolved reflective material on the first electrode preferably by applying a third potential across the first and second electrodes which is increased to a fourth potential and then decreased back to the third potential.