Patent classifications
C25F5/00
Method and apparatus for removing paint on metallic components
An apparatus for removing paint from a metallic component. The apparatus includes an electrolytic cell in which the metallic component is an anode, and a DC power supply capable of producing a plasma causing the paint from the metallic component to disintegrate. A method of depainting a metallic component includes providing an electrolytic cell with the metallic component to be depainted acting as an anode. A DC power supply connected to the cathode and anode is activated to produce a plasma causing the paint from the metallic component to disintegrate. Another method of method of depainting a metallic component includes providing an aqueous solution of sodium hydrogen carbonate, sodium citrate, and potassium oxalate as an electrolyte, a cathode and a pained metallic component as an anode. A DC power supply connected to the cathode and anode produces a plasma causing the paint from the painted metallic component to disintegrate.
Method and apparatus for removing paint on metallic components
An apparatus for removing paint from a metallic component. The apparatus includes an electrolytic cell in which the metallic component is an anode, and a DC power supply capable of producing a plasma causing the paint from the metallic component to disintegrate. A method of depainting a metallic component includes providing an electrolytic cell with the metallic component to be depainted acting as an anode. A DC power supply connected to the cathode and anode is activated to produce a plasma causing the paint from the metallic component to disintegrate. Another method of method of depainting a metallic component includes providing an aqueous solution of sodium hydrogen carbonate, sodium citrate, and potassium oxalate as an electrolyte, a cathode and a pained metallic component as an anode. A DC power supply connected to the cathode and anode produces a plasma causing the paint from the painted metallic component to disintegrate.
Method of manufacturing graphene film and graphene film manufactured thereby
According to an aspect of the present invention, there is provided a method of manufacturing a graphene film, the method including: preparing a catalyst metal having at least a surface on which graphene is formed; forming a support layer on the graphene; and isolating the graphene and the support layer from the catalyst metal by dipping the catalyst metal in an electrolytic solution perpendicularly to a liquid surface of the electrolytic solution when a voltage is applied to the catalyst metal.
Method of manufacturing graphene film and graphene film manufactured thereby
According to an aspect of the present invention, there is provided a method of manufacturing a graphene film, the method including: preparing a catalyst metal having at least a surface on which graphene is formed; forming a support layer on the graphene; and isolating the graphene and the support layer from the catalyst metal by dipping the catalyst metal in an electrolytic solution perpendicularly to a liquid surface of the electrolytic solution when a voltage is applied to the catalyst metal.
Method of releasing graphene from substrate
The disclosed technology generally relates to preparing two-dimensional material layers, and more particularly to releasing a graphene layer from a template substrate. According to an aspect, a method of releasing a graphene layer includes providing a template substrate on which the graphene layer is provided, the method comprising: subjecting the graphene layer and the template substrate to a water treatment by soaking the graphene layer and the template substrate in water such that water is intercalated between the template substrate and the graphene layer; and subjecting the graphene layer and the template substrate to a delamination process, thereby releasing the graphene layer from the template substrate.
Method of releasing graphene from substrate
The disclosed technology generally relates to preparing two-dimensional material layers, and more particularly to releasing a graphene layer from a template substrate. According to an aspect, a method of releasing a graphene layer includes providing a template substrate on which the graphene layer is provided, the method comprising: subjecting the graphene layer and the template substrate to a water treatment by soaking the graphene layer and the template substrate in water such that water is intercalated between the template substrate and the graphene layer; and subjecting the graphene layer and the template substrate to a delamination process, thereby releasing the graphene layer from the template substrate.
Method for producing plated material, and plated material
Provided are: a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, and wherein a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.
Method for producing plated material, and plated material
Provided are: a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, and wherein a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.
Eutectic solvent
A novel eutectic solvent (NES) includes one or more derivative(s) of methanesulfonic, one or more ammonium salt(s) and one or more hydrogen bond donor(s). The disclosed NES may exhibit qualities such as low freezing and eutectic points, low viscosity, negligible vapor pressure, non-volatility, less water content, high potential window, high thermal stability, high solubility, long shelf life, high recyclability, high biodegradability, high ionic character, air and moisture stability, non-corrosive, non-mutagenic, economical, non-flammable, etc., hence having broader applications.
Bimetallic zincating processing for enhanced adhesion of aluminum on aluminum alloys
A coated metal component includes an aluminum alloy substrate and a protective aluminum coating on a substrate. An interfacial boundary layer between the coating and substrate enhances coating adhesion. The boundary layer includes isolated regions of copper or tin produced by a double zincating process. The protective aluminum coating exhibits improved adhesion and is formed by electrodeposition in an ionic liquid.