The invention relates to a device for burnishing and smoothing metal parts, particularly suitable for use in mechanical-galvanic processes, comprising a main body (3) having a securing disc (6) to which guides (7) are radially coupled and the body of which includes at least three mobile drive systems (5) which are actuated by electromechanical means and move in a synchronised concentric manner, approaching and moving away from the central point and acting on a rotating structure (41) from equidistant angles, said structure being centrally located and coupled in a detachable head (4) that is coupled centrally relative to, and above, a cylindrical tank (2). The drivers (5), provided with brushes (51), move from an open position in which they remain separate from one another and at a distance from the centre, into a closed position in which they are joined to one another in the centre of the tank (2), coming into contact with the structure (41) containing the parts to be treated. The structure (41), coupled to a casing (8), consists of a vertical rod provided with securing means (42) for the parts to be treated.

The invention relates to a device for burnishing and smoothing metal parts, particularly suitable for use in mechanical-galvanic processes, comprising a main body (3) having a securing disc (6) to which guides (7) are radially coupled and the body of which includes at least three mobile drive systems (5) which are actuated by electromechanical means and move in a synchronised concentric manner, approaching and moving away from the central point and acting on a rotating structure (41) from equidistant angles, said structure being centrally located and coupled in a detachable head (4) that is coupled centrally relative to, and above, a cylindrical tank (2). The drivers (5), provided with brushes (51), move from an open position in which they remain separate from one another and at a distance from the centre, into a closed position in which they are joined to one another in the centre of the tank (2), coming into contact with the structure (41) containing the parts to be treated. The structure (41), coupled to a casing (8), consists of a vertical rod provided with securing means (42) for the parts to be treated.

An electropolishing or electroplating system and method for metal conveyor belts is described. In some embodiments, the system has a metal conveyor belt held in constant tension; a tank for holding an electrolytic fluid, the tank having an interior space suitable to contain the fluid, a metal plate and the metal conveyor belt; and an electrical current supply. In an electropolishing application, the current passes from the metal conveyor belt, through the fluid and into the metal plate. In an electroplating application, the current passes from the metal plate, through the fluid and into the metal conveyor belt.

An electropolishing or electroplating system and method for metal conveyor belts is described. In some embodiments, the system has a metal conveyor belt held in constant tension; a tank for holding an electrolytic fluid, the tank having an interior space suitable to contain the fluid, a metal plate and the metal conveyor belt; and an electrical current supply. In an electropolishing application, the current passes from the metal conveyor belt, through the fluid and into the metal plate. In an electroplating application, the current passes from the metal plate, through the fluid and into the metal conveyor belt.

A nozzle for charging and ejecting electrolyte in SFP process is disclosed. The nozzle includes an insulated foundation defining a through-hole, a conductive body as negative electrode connecting with a power source for charging the electrolyte and an insulated nozzle head. The conductive body has a fixing portion located on the insulated foundation. The fixing portion forms a receiving portion inserted into the through-hole and defining a receiving hole passing therethrough. The insulated nozzle head has a cover assembled with the insulated foundation above the conductive body and a tube extending through the cover and defining a main fluid path through where the charged electrolyte is ejected for polishing. The tube is inserted in the receiving hole and stretches out of the receiving hole of the conductive body forming an auxiliary fluid path between an inner circumferential surface of the receiving portion and an outer circumferential surface of the tube.

A nozzle for charging and ejecting electrolyte in SFP process is disclosed. The nozzle includes an insulated foundation defining a through-hole, a conductive body as negative electrode connecting with a power source for charging the electrolyte and an insulated nozzle head. The conductive body has a fixing portion located on the insulated foundation. The fixing portion forms a receiving portion inserted into the through-hole and defining a receiving hole passing therethrough. The insulated nozzle head has a cover assembled with the insulated foundation above the conductive body and a tube extending through the cover and defining a main fluid path through where the charged electrolyte is ejected for polishing. The tube is inserted in the receiving hole and stretches out of the receiving hole of the conductive body forming an auxiliary fluid path between an inner circumferential surface of the receiving portion and an outer circumferential surface of the tube.

A surface treatment device utilizes an electrode device. The electrode device is provided with a closed part facing a bottom part of a bottomed hole when inserted inside the bottomed hole, and a flow through hole linking the inside and outside of the electrode device is formed in the electrode device. When surface treatment is implemented on the inner wall surface of the bottomed hole, the hollow electrode device is inserted into the inside of the bottomed hole, the electrolytic treatment solution is made to flow through the space inside the bottomed hole, and power is applied across the electrode device and the inner wall surface of the bottomed hole. The closed part faces the bottom part of the bottomed hole as an electrode across a prescribed surface area; therefore, electroplating at the bottom part of the bottomed hole proceeds to the same extent as other sites.

A partial surface treatment apparatus includes a first electrode member electrically connected to a treatment object including an outer circumferential surface and a circumferential groove, a second electrode member including an inner circumferential surface, a pair of annular-shaped elastic sealing members configured to seal a clearance between the outer circumferential surface and the inner circumferential surface, an accommodation portion accommodating each of the annular-shaped elastic sealing members, the annular-shaped elastic sealing members are movable in a diameter reduction direction, a pressure applying mechanism supplying a pressurized fluid to the annular-shaped elastic sealing members, the annular-shaped elastic sealing members are in pressure contact with the outer circumferential surface in a case where the annular-shaped elastic sealing members are moved in the diameter reduction direction, and a cutout formed at each of the annular-shaped elastic sealing members to be extended from an outer circumferential side edge portion towards the inner circumferential side.

A partial surface treatment apparatus includes a first electrode member electrically connected to a treatment object including an outer circumferential surface and a circumferential groove, a second electrode member including an inner circumferential surface, a pair of annular-shaped elastic sealing members configured to seal a clearance between the outer circumferential surface and the inner circumferential surface, an accommodation portion accommodating each of the annular-shaped elastic sealing members, the annular-shaped elastic sealing members are movable in a diameter reduction direction, a pressure applying mechanism supplying a pressurized fluid to the annular-shaped elastic sealing members, the annular-shaped elastic sealing members are in pressure contact with the outer circumferential surface in a case where the annular-shaped elastic sealing members are moved in the diameter reduction direction, and a cutout formed at each of the annular-shaped elastic sealing members to be extended from an outer circumferential side edge portion towards the inner circumferential side.

An electro-anti deposit device is coupled to an irrigation pipe for removing mineral deposit from drippers of the pipe. The electro-anti deposit device includes an engine configured to move the electro-anti deposit device along the pipe. The electro-anti deposit device also includes a mineral deposit removal module. The mineral deposit removal module includes a water container, a battery, and two electrodes. The water container may be configured to create an ionic environment at a dripper. The dripper may be covered with the mineral deposit. The battery may be configured to generate electric current. The two electrodes may be connected to two poles of the battery with a space separating tips of the two electrodes.