The apparatus for making a nanopore in a membrane generally has an electrode configured to connect to one of two opposing surfaces of the membrane; a conductive tip configured to contact a location of the other one of the two opposing surfaces of the membrane; and a voltage source electrically connected between the electrode and the conductive tip and operable to generate an electric potential across the membrane, the electric potential locally removing material of the membrane at the location to make the nanopore.

An apparatus for micromachining a semiconductor material from opposing sides through synchronous coordination of laser and electrochemistry includes an optical path system, a stable low-pressure jet generation system, and an electrolytic machining system. The optical path system includes a laser generator, a beam expander, a reflector, a galvanometer, and a lens. The electrolytic machining system includes a direct-current pulsed power supply, an adjustable cathode fixture, an electrolyte tank, a current probe, and an oscilloscope. The stable low-pressure jet generation system provides an electrolyte flow into a metal needle. The electrolyte flow forms an electrolyte layer between a semiconductor material and a cathode copper plate, such that the cathode and the anode are in electrical contact with each other. In a method employing the apparatus, a laser beam is irradiated onto the semiconductor material to form a local high-temperature region, which leads to a localized increase in electrical conductivity.

An electrolytic processing apparatus configured for processing a hole of a work piece. The electrolytic processing apparatus includes a work platform, an electrolyte providing device and an electrolytic electrode. The work platform includes a loading platform and a flow channel. When the loading platform loads the work piece, the position of the flow channel is corresponding to that of the hole. The electrolyte providing device connects to the flow channel to provide an electrolyte to the hole through the flow channel. The electrolytic electrode is configured relative to the work platform and moves in a direction perpendicular to the loading platform. When the loading platform loads the work piece, the electrolyte flows through the hole and the electrolytic electrode moves in the hole in a variable speed to process the inside surface of the hole by electrolytic process, thereby forming a characteristic shape of the hole.

An electrolytic processing apparatus configured for processing a hole of a work piece. The electrolytic processing apparatus includes a work platform, an electrolyte providing device and an electrolytic electrode. The work platform includes a loading platform and a flow channel. When the loading platform loads the work piece, the position of the flow channel is corresponding to that of the hole. The electrolyte providing device connects to the flow channel to provide an electrolyte to the hole through the flow channel. The electrolytic electrode is configured relative to the work platform and moves in a direction perpendicular to the loading platform. When the loading platform loads the work piece, the electrolyte flows through the hole and the electrolytic electrode moves in the hole in a variable speed to process the inside surface of the hole by electrolytic process, thereby forming a characteristic shape of the hole.

A method of and system for surface finishing an additive manufactured pint. A part having a surface roughness with macroasperities is placed in a chamber with an electrolyte and an electrode. A pulse/pulse reverse power supply is connected to the part rendering it anodic and connected to the electrode rendering it cathodic. The power supply is operated to decrease the surface roughness of the part by applying a first series of waveforms including at least two waveforms where a diffusion layer is maintained at a thickness to produce a macroprofile regime relative to the macroasperities, the first series of waveforms having anodic voltages applied for anodic time periods before cathodic voltages applied for cathodic time periods to effect part surface smoothing to a first surface roughness with minimal material removal and applying a final waveform where the diffusion layer represents a microprofile regime, the final waveform having a final anodic voltage applied for a final anodic time period before a final cathodic voltage applied for a final cathodic time period to effect part surface smoothing to a final surface roughness with minimal material removal.

A method of and system for surface finishing an additive manufactured pint. A part having a surface roughness with macroasperities is placed in a chamber with an electrolyte and an electrode. A pulse/pulse reverse power supply is connected to the part rendering it anodic and connected to the electrode rendering it cathodic. The power supply is operated to decrease the surface roughness of the part by applying a first series of waveforms including at least two waveforms where a diffusion layer is maintained at a thickness to produce a macroprofile regime relative to the macroasperities, the first series of waveforms having anodic voltages applied for anodic time periods before cathodic voltages applied for cathodic time periods to effect part surface smoothing to a first surface roughness with minimal material removal and applying a final waveform where the diffusion layer represents a microprofile regime, the final waveform having a final anodic voltage applied for a final anodic time period before a final cathodic voltage applied for a final cathodic time period to effect part surface smoothing to a final surface roughness with minimal material removal.

The present invention relates to a method and a system for treating a surface of an object obtained by direct metal laser sintering. The object is sintered from a metal powder with a grain size distribution. Due to the manufacturing process, the object can comprise a rough surface with remaining grains of the metal powder attached to the surface. The method according to the present invention provides parameters for post-processing the object to achieve a smooth surface suitable for use in medical imaging systems.

A method for smoothing and polishing metals via ion transport by free solid bodies comprises connecting a part to be treated to a positive pole (anode) of a current generator and subjecting the part to friction with a set of particles comprising electrically conductive free solid bodies charged with negative electrical charge in a gaseous environment.

A method for smoothing and polishing metals via ion transport by free solid bodies comprises connecting a part to be treated to a positive pole (anode) of a current generator and subjecting the part to friction with a set of particles comprising electrically conductive free solid bodies charged with negative electrical charge in a gaseous environment.

An electrochemical deposition system configured for electrochemical plating of a substrate includes a chamber, an electrode, a plating cup and a controller. The chamber holds a plating bath. The electrode is disposed in the plating bath. The plating cup includes a contact ring. The contact ring includes contacts. The contacts are immersed in the plating bath. The controller is configured to apply a voltage signal across the contact ring and the electrode to remove residual from the contacts. The voltage signal includes a plating-de-plating waveform. The plating-de-plating waveform includes multiple cycles. Each of the cycles includes a pair of pulses with different polarity.