An apparatus and system for in-situ electropolishing and/or for in-situ electroforming a structural or functional reinforcement layer such as a sleeve of a selected metallic material on the internal surfaces of metallic tubular conduits are described. The apparatus and system can be employed on straight tubes, tube joints to different diameter tubes or face plates, tube elbows and other complex shapes encountered in piping systems. The apparatus includes components which can be independently manipulated and assembled on or near a degraded site and, after secured in place, form an electrolytic cell within the workpiece. The apparatus contains counter-electrodes which can be moved relative to the workpiece surface during the electroplating and/or electropolishing operation to provide flexibility in selecting and employing electropolishing process parameters and electroplating process parameters to design and optimize the surface roughness as well as the size, shape and properties of the electrodeposited reinforcing layer(s).

An apparatus and system for in-situ electropolishing and/or for in-situ electroforming a structural or functional reinforcement layer such as a sleeve of a selected metallic material on the internal surfaces of metallic tubular conduits are described. The apparatus and system can be employed on straight tubes, tube joints to different diameter tubes or face plates, tube elbows and other complex shapes encountered in piping systems. The apparatus includes components which can be independently manipulated and assembled on or near a degraded site and, after secured in place, form an electrolytic cell within the workpiece. The apparatus contains counter-electrodes which can be moved relative to the workpiece surface during the electroplating and/or electropolishing operation to provide flexibility in selecting and employing electropolishing process parameters and electroplating process parameters to design and optimize the surface roughness as well as the size, shape and properties of the electrodeposited reinforcing layer(s).

Systems and methods for electroless plating a first metal onto a second metal in a molten salt bath including: a bath vessel holding a dry salt mixture including a dry salt medium and a dry salt medium of the first metal, and without the reductant therein, the dry salt mixture configured to be heated to form a molten salt bath; and the second metal is configured to be disposed in the molten salt bath and receive a pure coating of the first metal thereon by electroless plating in the molten salt bath, wherein the second metal is more electronegative than the first metal.

Systems and methods for electroless plating a first metal onto a second metal in a molten salt bath including: a bath vessel holding a dry salt mixture including a dry salt medium and a dry salt medium of the first metal, and without the reductant therein, the dry salt mixture configured to be heated to form a molten salt bath; and the second metal is configured to be disposed in the molten salt bath and receive a pure coating of the first metal thereon by electroless plating in the molten salt bath, wherein the second metal is more electronegative than the first metal.

A welding burn remover includes: a mover including a movable body to which a support of an electrolytic end effector is attached and at least one actuator that moves the movable body; and processing circuitry configured to control the actuator. The processing circuitry is configured to execute an electrolytic treatment in which the processing circuitry controls the actuator to slide an electrode on a welding burn portion of a welded workpiece through a short-circuit prevention cover while controlling a pump to supply an electrolytic solution to a boundary by an electrolytic solution feeder. The support of the electrolytic end effector includes: a base attached to the movable body of the mover; and a coupler connecting the electrode to the base such that the electrode is angularly displaceable relative to the base.

A welding burn remover includes: a mover including a movable body to which a support of an electrolytic end effector is attached and at least one actuator that moves the movable body; and processing circuitry configured to control the actuator. The processing circuitry is configured to execute an electrolytic treatment in which the processing circuitry controls the actuator to slide an electrode on a welding burn portion of a welded workpiece through a short-circuit prevention cover while controlling a pump to supply an electrolytic solution to a boundary by an electrolytic solution feeder. The support of the electrolytic end effector includes: a base attached to the movable body of the mover; and a coupler connecting the electrode to the base such that the electrode is angularly displaceable relative to the base.

An integrated circuit (IC) package incorporating controlled induced warping is disclosed. The IC package includes an electronic substrate having an active side upon which semiconducting dies and functional circuits have been lithographed or otherwise fabricated, leading to an inherent warping in the direction of the active side. One or more corrective layers may be deposited to the opposing, or inactive, side of the semiconducting die via electroplating in order to induce corrective warping of the electronic substrate back toward the horizontal (e.g., in the direction of the inactive side) to a desired degree.

An integrated circuit (IC) package incorporating controlled induced warping is disclosed. The IC package includes an electronic substrate having an active side upon which semiconducting dies and functional circuits have been lithographed or otherwise fabricated, leading to an inherent warping in the direction of the active side. One or more corrective layers may be deposited to the opposing, or inactive, side of the semiconducting die via electroplating in order to induce corrective warping of the electronic substrate back toward the horizontal (e.g., in the direction of the inactive side) to a desired degree.

An electrochemical method includes performing anodic halogenation of Cu foils, performing subsequent oxide-formation in a KHCO.sub.3 electrolyte, and performing an electroreduction in neutral KHCO.sub.3 to generate a copper catalyst.

An electrochemical method includes performing anodic halogenation of Cu foils, performing subsequent oxide-formation in a KHCO.sub.3 electrolyte, and performing an electroreduction in neutral KHCO.sub.3 to generate a copper catalyst.