C30B15/00

METHODS FOR DETERMINING SUITABILITY OF CZOCHRALSKI GROWTH CONDITIONS FOR PRODUCING SUBSTRATES FOR EPITAXY

Methods for determining suitability of Czochralski growth conditions to produce silicon substrates for epitaxy. The methods involve evaluating substrates sliced from ingots grown under different growth conditions (e.g., impurity profiles) by imaging the wafer by infrared depolarization. An infrared depolarization parameter is generated for each epitaxial wafer. The parameters may be compared to determine which growth conditions are well-suited to produce substrates for epitaxial and/or post-epi heat treatments.

METHODS FOR DETERMINING SUITABILITY OF CZOCHRALSKI GROWTH CONDITIONS FOR PRODUCING SUBSTRATES FOR EPITAXY

Methods for determining suitability of Czochralski growth conditions to produce silicon substrates for epitaxy. The methods involve evaluating substrates sliced from ingots grown under different growth conditions (e.g., impurity profiles) by imaging the wafer by infrared depolarization. An infrared depolarization parameter is generated for each epitaxial wafer. The parameters may be compared to determine which growth conditions are well-suited to produce substrates for epitaxial and/or post-epi heat treatments.

DEVICE FOR MANUFACTURING MONOCRYSTALLINE SILICON AND COOLING METHOD THEREOF
20220389608 · 2022-12-08 ·

Provided is a device for manufacturing monocrystalline silicon and a cooling method thereof. The device includes a crystal puller and a cooling apparatus. A heating apparatus and a first thermal insulation structure are arranged in the crystal puller. The first thermal insulation structure is located above the heating apparatus. The cooling apparatus includes a jacking mechanism and a cooling pipe. The cooling pipe is capable of moving into or out of the crystal puller. When the cooling pipe enters the crystal puller, the cooling pipe is connected to the first thermal insulation structure, and the cooling pipe lifts the first thermal insulation structure through the jacking mechanism to increase a distance between the first thermal insulation structure and the heating apparatus, and a cooling medium is output to the cooling pipe to cool the crystal puller. The cooling medium may be liquid or gas.

SCINTILLATION CRYSTAL INCLUDING A CO-DOPED RARE EARTH SILICATE, A RADIATION DETECTION APPARATUS INCLUDING THE SCINTILLATION CRYSTAL, AND A PROCESS OF FORMING THE SAME
20220380667 · 2022-12-01 ·

A scintillation crystal can include a rare earth silicate, an activator, and a Group 2 co-dopant. In an embodiment, the Group 2 co-dopant concentration may not exceed 200 ppm atomic in the crystal or 0.25 at % in the melt before the crystal is formed. The ratio of the Group 2 concentration/activator atomic concentration can be in a range of 0.4 to 2.5. In another embodiment, the scintillation crystal may have a decay time no greater than 40 ns, and in another embodiment, have the same or higher light output than another crystal having the same composition except without the Group 2 co-dopant. In a further embodiment, a boule can be grown to a diameter of at least 75 mm and have no spiral or very low spiral and no cracks. The scintillation crystal can be used in a radiation detection apparatus and be coupled to a photosensor.

PROCESS FOR SYNTHESIZING INDIUM PHOSPHIDE BY LIQUID PHOSPHORUS INJECTION METHOD

The present invention relates to a process for synthesizing indium phosphide by liquid phosphorus injection method, which belongs to the field of semiconductor technology. The method comprises: converting gaseous phosphorus into liquid phosphorus through a condenser, injecting the liquid phosphorus into an indium melt while preventing phosphorus vaporization by randomly delivering a low temperature inert gas, and causing an instantaneous reaction between the liquid phosphorus and the liquid indium melt, so that an indium phosphide melt can be synthesized at a relatively low temperature, with advantages of high efficiency, high purity, precise proportioning, large capacity, aiding in the growth of a phosphorus-rich indium phosphide polycrystal and facilitating the growth of an indium phosphide monocrystal. The method includes the steps of indium cleaning, phosphorus charging, furnace loading, communication of condenser, synthesis, preparation of crystals, etc.

POINT DEFECT SIMULATOR, POINT DEFECT SIMULATION PROGRAM, POINT DEFECT SIMULATION METHOD, METHOD OF PRODUCING SILICON SINGLE CRYSTAL, AND SINGLE CRYSTAL PULLING APPARATUS
20220364260 · 2022-11-17 · ·

Provided is a point detect simulator which makes it possible to determine the distribution of point defects in a silicon single crystal in consideration of the thermal stress of the silicon single crystal being grown. A point defect simulator 1 is a point defect simulator calculating the concentration profiles of vacancies and interstitial silicon during pulling of a silicon single crystal using a convection-diffusion equation reflecting the consideration of thermal stress in the silicon single crystal, and includes an analysis unit used to fit calculation results to experimental results using stress coefficients that are the coefficients of stress terms as a fitting parameter.

Method for manufacturing ingot block, method for manufacturing semiconductor wafer, and device for manufacturing ingot block
11587792 · 2023-02-21 · ·

A method for manufacturing an ingot block in which an ingot of a silicon single crystal pulled up by a Czochralski process is cut and subjected to outer periphery grinding to manufacture an ingot block of the silicon single crystal, the method including: a step of measuring a radial center position of the ingot at one or more locations along a longitudinal direction of the ingot, a step of setting a reference position at which an offset amount of the measured radial center position of the ingot is equal to or less than a predetermined eccentricity amount, a step of cutting the ingot into the ingot blocks based on the set reference position, and a step of performing outer periphery grinding on each of the cut ingot blocks.

Method for manufacturing ingot block, method for manufacturing semiconductor wafer, and device for manufacturing ingot block
11587792 · 2023-02-21 · ·

A method for manufacturing an ingot block in which an ingot of a silicon single crystal pulled up by a Czochralski process is cut and subjected to outer periphery grinding to manufacture an ingot block of the silicon single crystal, the method including: a step of measuring a radial center position of the ingot at one or more locations along a longitudinal direction of the ingot, a step of setting a reference position at which an offset amount of the measured radial center position of the ingot is equal to or less than a predetermined eccentricity amount, a step of cutting the ingot into the ingot blocks based on the set reference position, and a step of performing outer periphery grinding on each of the cut ingot blocks.

PIEZOELECTRIC MATERIAL, PIEZOELECTRIC MEMBER, PIEZOELECTRIC ELEMENT, AND PRESSURE SENSOR
20220359812 · 2022-11-10 ·

Provided are a piezoelectric material, a piezoelectric member, a piezoelectric element and a pressure sensor that can be used in high-temperature environments. The piezoelectric material is composed of Sr-substituted akermanite represented by Ca.sub.(2-x)Sr.sub.xMgSi.sub.2O.sub.7 (0.1≤x≤0.6).

CRYSTAL GROWTH APPARATUS WITH MOVABLE SEED FIXTURE

A crucible device for growing crystals includes a container being arrangeable in a heating chamber of a heating apparatus, and a seed fixture element. The container includes a base section and the seed fixture element includes a seed surface which is configured for attaching a seed crystal. The seed fixture element is moveable coupled to the base section such that the distance between the seed surface and the base section is adjustable.