The present disclosure discloses a method for growing a crystal for detecting neutrons, gamma rays, and/or x rays. The method may include weighting reactants based on a molar ratio of the reactants according to a reaction equation (1-x-z)X.sub.2O.sub.3+SiO.sub.2+2xCeO.sub.2+zZ.sub.2O.sub.3.fwdarw.X.sub.2(1-x-z)Ce.sub.2xZ.sub.2zSiO.sub.5+x/2O.sub.2 or (1-x-y-z)X.sub.2O.sub.3+yY.sub.2O.sub.3+SiO.sub.2+2xCeO.sub.2+zZ.sub.2O.sub.3.fwdarw.X.sub.2(1-x-y-z)Y.sub.2yCe.sub.2xZ.sub.2zSiO.sub.5+x/2O.sub.2; placing the reactants on which a second preprocessing operation has been performed into a crystal growth device after an assembly processing operation is performed on at least one component of the crystal growth device; introducing a flowing gas into the crystal growth device after sealing the crystal growth device; and activating the crystal growth device to grow the crystal based on the Czochralski technique.

A method for growing a single crystal silicon ingot by the continuous Czochralski method is disclosed. The melt depth and thermal conditions are constant during growth because the silicon melt is continuously replenished as it is consumed, and the crucible location is fixed. The critical v/G is determined by the hot zone configuration, and the continuous replenishment of silicon to the melt during growth enables growth of the ingot at a constant pull rate consistent with the critical v/G during growth of a substantial portion of the main body of the ingot. The continuous replenishment of silicon is accompanied by periodic or continuous nitrogen addition to the melt to result in a nitrogen doped ingot.

The present disclosure discloses a method for growing a crystal with a short decay time. According to the method, a new single crystal furnace and a temperature field device are adapted and a process, a ration of reactants, and growth parameters are adjusted and/or optimized, accordingly, a crystal with a short decay time, a high luminous intensity, and a high luminous efficiency can be grown without a co-doping operation.

A method for growing a single crystal silicon ingot by the continuous Czochralski method is disclosed. The melt depth and thermal conditions are constant during growth because the silicon melt is continuously replenished as it is consumed, and the crucible location is fixed. The critical v/G is determined by the hot zone configuration, and the continuous replenishment of silicon to the melt during growth enables growth of the ingot at a constant pull rate consistent with the critical v/G during growth of a substantial portion of the main body of the ingot. The continuous replenishment of silicon is accompanied by periodic or continuous nitrogen addition to the melt to result in a nitrogen doped ingot.

A method of manufacturing a silicon wafer includes extracting an n-type silicon ingot over an extraction time period from a silicon melt comprising n-type dopants, adding p-type dopants to the silicon melt over at least part of the extraction time period, so as to compensate an n-type doping in the n-type silicon ingot by 20% to 80%, and slicing the silicon ingot.

A method of manufacturing a silicon wafer includes extracting an n-type silicon ingot over an extraction time period from a silicon melt comprising n-type dopants, adding p-type dopants to the silicon melt over at least part of the extraction time period, so as to compensate an n-type doping in the n-type silicon ingot by 20% to 80%, and slicing the silicon ingot.

In a chip, a manufacturing method, and a mobile terminal, the chip includes a first region and a second region. The first region is formed by at least one first circuit unit set. The second region is formed by a second circuit unit set. The at least one first circuit unit set includes a plurality of identical circuit units. A number of circuit units in the first region determines a specification of the chip and a size of the first region of the chip.

In a chip, a manufacturing method, and a mobile terminal, the chip includes a first region and a second region. The first region is formed by at least one first circuit unit set. The second region is formed by a second circuit unit set. The at least one first circuit unit set includes a plurality of identical circuit units. A number of circuit units in the first region determines a specification of the chip and a size of the first region of the chip.

A polycrystalline silicon rod is formed of polycrystalline silicon deposited radially around a silicon core line and is characterized by, in a cross-section that is a perpendicular cut in respect to the axial direction of a cylindrical rod, a ratio of surface area covered by coarse crystal particles having a diameter of 50 m or greater is 20% or more of the crystal observed at the face, excluding the core line portion.

A polycrystalline silicon rod is formed of polycrystalline silicon deposited radially around a silicon core line and is characterized by, in a cross-section that is a perpendicular cut in respect to the axial direction of a cylindrical rod, a ratio of surface area covered by coarse crystal particles having a diameter of 50 m or greater is 20% or more of the crystal observed at the face, excluding the core line portion.