The present invention provides a thermal transferring method and a structural device utilizing thermal energy body performing vibration displacement to fluid in which a vibration actuating device is provided for performing vibration driving to a thermal energy body disposed in a fluid thereby allowing the thermal energy body to perform periodic vibration displacement to the fluid for transferring thermal energy and enabling the fluid to circulatively flow, thereby a novel thermal transferring method and a structural device utilizing thermal energy body performing vibration displacement to fluid for the purpose of heating or cooling are provided.

The present invention provides a thermal transferring method and a structural device utilizing thermal energy body performing vibration displacement to fluid in which a vibration actuating device is provided for performing vibration driving to a thermal energy body disposed in a fluid thereby allowing the thermal energy body to perform periodic vibration displacement to the fluid for transferring thermal energy and enabling the fluid to circulatively flow, thereby a novel thermal transferring method and a structural device utilizing thermal energy body performing vibration displacement to fluid for the purpose of heating or cooling are provided.

A vortex ring generation device includes a casing and an extrusion mechanism. The casing has a gas passage and a discharge port. The extrusion mechanism extrudes gas in the gas passage such that the gas in a vortex ring shape is discharged from the discharge port. V (m.sup.3) represents an extrusion volume, D (m) represents a diameter of the discharge port, L (m) represents a length of a cylinder having the diameter D and the volume V, and U (m/s) represents a discharge flow rate 0.045≤D≤0.135, 0.15≤L≤0.35, and 3≤U≤5.

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.

A pump includes a pump flow path and electrodes and dielectric members in the pump flow path to allow a fluid to pass through the electrodes and the dielectric members in a flowing direction. The electrodes and the dielectric members are alternately stacked in the flowing direction so that a dielectric member is located between adjacent electrodes. Among the electrodes, an inter-electrode polarity of each pair of electrodes is different from that of an adjacent pair of electrodes. The dielectric members include a first dielectric member at a position of an odd-numbered dielectric member counted from the most upstream side of the flowing direction and a second dielectric member at a position of an even-numbered dielectric member counted from the most upstream side of the flowing direction. Material of the first and second dielectric members provide signs of a zeta potential opposite to each other.

A cooling system is described. The cooling system includes a cooling element having a central region and a perimeter. The cooling element is anchored at the central region. At least a portion of the perimeter is unpinned. The cooling element is in communication with a fluid. The cooling element is actuated to induce vibrational motion to drive the fluid toward a heat-generating structure.

A mobile device case is described. The mobile device case includes a housing configured to retain a mobile device and an active cooling system integrated into the housing. The active cooling system configured to use vibrational motion to cool a surface of the mobile device.