Patent classifications
F04D33/00
METHOD AND SYSTEM FOR DRIVING PIEZOELECTRIC MEMS-BASED ACTIVE COOLING DEVICES
A cooling system and method for using the cooling system are described. The cooling system includes an array of cooling elements and a controller. The array of cooling elements corresponds to regions of the heat-generating structure where heat is generated in response to operation of the semiconductor. The controller is configured to activate portions of the array of cooling elements based on a determination that operation of the heat-generating structure is likely to generate heat in a given region of the heat-generating structure.
PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COMPUTE DEVICES
An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.
MOBILE PHONE AND OTHER COMPUTE DEVICE COOLING ARCHITECTURE
A system for cooling a mobile phone and method for using the system are described. The system includes an active piezoelectric cooling system, a controller and an interface. The active piezoelectric cooling system is configured to be disposed in a rear portion of the mobile phone distal from a front screen of the mobile phone. The controller is configured to activate the active piezoelectric cooling system in response to heat generated by heat-generating structures of the mobile phone. The interface is configured to receive power from a mobile phone power source when the active piezoelectric cooling system is activated.
HIGH PERFORMANCE CANTILEVER FAN
A cantilever fan including a blade and a blade permanent magnet. The blade is clamped at one end to a base and has a distal end which is free to oscillate with distal end having the largest swept displacement of any portion of the blade. The blade extends from the clamped end to the distal end. The blade permanent magnet is attached only to the blade at a point along the blade's length and is free to move with the blade. The fan includes a stationary permanent magnet attached only to the base. The respective locations and relative orientation of the blade permanent magnet and stationary magnet result in a repulsive magnetic force between the blade permanent magnet and stationary magnet. The fan is configured so that the repulsive force increases as the blade's deflection brings the blade permanent magnet closer to the stationary magnet.
HIGH PERFORMANCE CANTILEVER FAN
A cantilever fan including a blade and a blade permanent magnet. The blade is clamped at one end to a base and has a distal end which is free to oscillate with distal end having the largest swept displacement of any portion of the blade. The blade extends from the clamped end to the distal end. The blade permanent magnet is attached only to the blade at a point along the blade's length and is free to move with the blade. The fan includes a stationary permanent magnet attached only to the base. The respective locations and relative orientation of the blade permanent magnet and stationary magnet result in a repulsive magnetic force between the blade permanent magnet and stationary magnet. The fan is configured so that the repulsive force increases as the blade's deflection brings the blade permanent magnet closer to the stationary magnet.
Carbon fiber laminate piezoelectric cooler and method therefor
An opening at a first carbon fiber sheet is provided, the opening extending through the sheet from a first major surface to a second major surface, the opening defining two sides and a first end of a rectangular flap, a second end of the flap remaining rooted in the first carbon fiber sheet. A piezoelectric transducer is bonded to the first carbon fiber sheet, the transducer proximate to the second end of the flap. A controller including a signal generator is coupled to the piezoelectric transducer, the piezoelectric transducer to excite sympathetic vibration of the flap.
Carbon fiber laminate piezoelectric cooler and method therefor
An opening at a first carbon fiber sheet is provided, the opening extending through the sheet from a first major surface to a second major surface, the opening defining two sides and a first end of a rectangular flap, a second end of the flap remaining rooted in the first carbon fiber sheet. A piezoelectric transducer is bonded to the first carbon fiber sheet, the transducer proximate to the second end of the flap. A controller including a signal generator is coupled to the piezoelectric transducer, the piezoelectric transducer to excite sympathetic vibration of the flap.
ELECTROSTATIC PERISTALTIC PUMP AND METHOD OF OPERATION
A method of producing a flow of a fluid through a passage (24) defined in a rigid frame (22) comprises selectively actuating a flexible membrane (38) disposed across a midpoint of the passage (24) with an actuating system in a manner which produces a wave-like motion in the membrane (38) thereby causing a peristaltic movement of the fluid through the passage (24).
ELECTROSTATIC PERISTALTIC PUMP AND METHOD OF OPERATION
A method of producing a flow of a fluid through a passage (24) defined in a rigid frame (22) comprises selectively actuating a flexible membrane (38) disposed across a midpoint of the passage (24) with an actuating system in a manner which produces a wave-like motion in the membrane (38) thereby causing a peristaltic movement of the fluid through the passage (24).
PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COMPUTE DEVICES
An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.