F04D33/00

Piezo flapping fan
10184493 · 2019-01-22 ·

A flapping fan for cooling electronic devices includes an elongated piezo actuator, two supporting members, two connecting members, and a thin blade. The supporting members are attached to the piezo actuator at its two ends, while the blade is connected to the piezo actuator through the connecting members. When activated by an AC signal, the piezo actuator oscillates around its neutral position, which causes the blade to oscillate. The blade rotates around its leading edge when its direction of motion changes, keeping its angle of incidence lower than ninety degrees. This helps the flapping fan to generate a significant air flow.

Fluid control device having a piezoelectric actuator

A fluid control device includes a piezoelectric actuator, a housing and a glue body. The piezoelectric actuator includes a suspension plate, an outer frame, a bracket and a piezoelectric element. The housing includes an outlet plate and a base. The outlet plate accommodates the piezoelectric actuator and the base includes an inlet plate and a resonance plate. The glue body is arranged between the outer frame and the resonance plate to maintain a gap formed therebetween. The suspension plate is made of a material having a linear expansion coefficient less than a linear expansion coefficient of the piezoelectric element. The suspension plate has a specified hardness to maintain a curved shape after being heated, and the linear expansion coefficient of the suspension plate is different from a linear expansion coefficient of the resonance plate, so that an effective deformation displacement between the suspension plate and the resonance plate is obtained.

Fluid control device having a piezoelectric actuator

A fluid control device includes a piezoelectric actuator, a housing and a glue body. The piezoelectric actuator includes a suspension plate, an outer frame, a bracket and a piezoelectric element. The housing includes an outlet plate and a base. The outlet plate accommodates the piezoelectric actuator and the base includes an inlet plate and a resonance plate. The glue body is arranged between the outer frame and the resonance plate to maintain a gap formed therebetween. The suspension plate is made of a material having a linear expansion coefficient less than a linear expansion coefficient of the piezoelectric element. The suspension plate has a specified hardness to maintain a curved shape after being heated, and the linear expansion coefficient of the suspension plate is different from a linear expansion coefficient of the resonance plate, so that an effective deformation displacement between the suspension plate and the resonance plate is obtained.

Mounting and use of piezoelectric cooling systems in devices

A cooling system including a heat spreader, an active cooling element, and a base is described. The heat spreader is in thermal communication with a heat-generating structure mounted on a substrate. The heat spreader over hangs the heat-generating structure. The active cooling element is in thermal communication with the heat spreader. The base supports the heat spreader and transfers a load from the heat spreader to the substrate such that a bending of the heat spreader does not exceed ten degrees.

Package integrated synthetic jet device

Embodiments include a synthetic jet device formed within layers of a package substrate, such as to provide a controlled airflow for sensing or cooling applications. The jet device includes an electromagnetically driven vibrating membrane of conductive material between a top and bottom cavity. A top lid with an opening covers the top cavity, and a permanent magnet is below the bottom cavity. An alternating current signal conducted through the membrane causes the membrane to vibrate in the presence of a magnetic field caused by the permanent magnet. By being manufactured with package forming processes, the jet (1) is manufactured more cost-effectively than by using silicon chip or wafer processing; (2) is easily integrated as part of and with the other layers of a package substrate; and (3) can be driven by a chip mounted on the package. Embodiments also include systems having and processes for forming the jet.

Low resonance acoustic synthetic jet structure

A system and method for reducing or increasing the mechanical structure resonance of a synthetic jet device is disclosed. A synthetic jet device includes a first plate, a second plate spaced apart from the first plate, a spacing component coupled to and positioned between the first and second plates to form a chamber and including an orifice therein, and an actuator element coupled to at least one of the first and second plates to selectively cause deflection thereof, thereby changing a volume within the chamber so that a series of fluid vortices is generated and projected out from the orifice of the spacing component. At least one of the first and second plates includes a modified section that alters a mechanical resonance of the synthetic jet device, so as to control a level of acoustic noise generated by the synthetic jet device.

Low resonance acoustic synthetic jet structure

A system and method for reducing or increasing the mechanical structure resonance of a synthetic jet device is disclosed. A synthetic jet device includes a first plate, a second plate spaced apart from the first plate, a spacing component coupled to and positioned between the first and second plates to form a chamber and including an orifice therein, and an actuator element coupled to at least one of the first and second plates to selectively cause deflection thereof, thereby changing a volume within the chamber so that a series of fluid vortices is generated and projected out from the orifice of the spacing component. At least one of the first and second plates includes a modified section that alters a mechanical resonance of the synthetic jet device, so as to control a level of acoustic noise generated by the synthetic jet device.

Pump
10125760 · 2018-11-13 · ·

A pump includes a pressure chamber that generates pressure oscillation occurring from the center of the pressure chamber to an outer peripheral portion of the pressure chamber when viewed in plan view in a thickness direction. The pump includes a vibrating plate portion that faces the pressure chamber in the thickness direction and that is displaced in the thickness direction and a top plate portion that faces the pressure chamber in a direction opposite to the direction in which the vibrating plate portion faces the pressure chamber. The vibrating plate portion has a first inlet port that is open at the outer peripheral portion of the pressure chamber. The top plate portion has an outlet port that is open at a center portion of the pressure chamber and a second inlet port that is open at the outer peripheral portion of the pressure chamber.

Pump
10125760 · 2018-11-13 · ·

A pump includes a pressure chamber that generates pressure oscillation occurring from the center of the pressure chamber to an outer peripheral portion of the pressure chamber when viewed in plan view in a thickness direction. The pump includes a vibrating plate portion that faces the pressure chamber in the thickness direction and that is displaced in the thickness direction and a top plate portion that faces the pressure chamber in a direction opposite to the direction in which the vibrating plate portion faces the pressure chamber. The vibrating plate portion has a first inlet port that is open at the outer peripheral portion of the pressure chamber. The top plate portion has an outlet port that is open at a center portion of the pressure chamber and a second inlet port that is open at the outer peripheral portion of the pressure chamber.

Package integrated synthetic jet device

Embodiments include a synthetic jet device formed within layers of a package substrate, such as to provide a controlled airflow for sensing or cooling applications. The jet device includes an electromagnetically driven vibrating membrane of conductive material between a top and bottom cavity. A top lid with an opening covers the top cavity, and a permanent magnet is below the bottom cavity. An alternating current signal conducted through the membrane causes the membrane to vibrate in the presence of a magnetic field caused by the permanent magnet. By being manufactured with package forming processes, the jet (1) is manufactured more cost-effectively than by using silicon chip or wafer processing; (2) is easily integrated as part of and with the other layers of a package substrate; and (3) can be driven by a chip mounted on the package. Embodiments also include systems having and processes for forming the jet.