Provided herein are passive microfluidic pumps. The pumps can comprise a fluid inlet, an absorbent region, a resistive region fluidly connecting the fluid inlet and the absorbent region, and an evaporation barrier enclosing the resistive region, the absorbent region, or a combination thereof. The resistive region can comprise a first porous medium, and a fluidly non-conducting boundary defining a path for fluid flow through the first porous medium from the fluid inlet to the absorbent region. The absorbent region can comprise a fluidly non-conducting boundary defining a volume of a second porous medium sized to absorb a predetermined volume of fluid imbibed from the resistive region. The resistive region and the absorbent region can be configured to establish a capillary-driven fluid front advancing from the fluid inlet through the resistive region to the absorbent region when the fluid inlet is contacted with fluid.

The invention relates to a cooling apparatus comprising a base plate for receiving a heat load from an electric component, an evaporator, a condenser, and a connecting piece for passing fluid from the evaporator to the condenser. In order to efficiently fill the evaporator, the cooling apparatus is provided with a pump for pumping fluid from the condenser to the evaporator.