Provided are a light board, a method for manufacturing the same, a light-emitting diode (LED) backlight module and an LED backlight device. The light board includes a substrate and a LED device. The substrate includes a first surface and a second surface disposed opposite to each other. The first surface and the second surface are each provided with a wiring area and a non-wiring area. A first heat sink assembly and multiple first reinforcement ribs are disposed in the non-wiring area of the first surface. The multiple first reinforcement ribs intersect to form a first encircled area. The first heat sink assembly is disposed in the first encircled area. The LED device is disposed in the wiring area of the second surface.

Inter-alia, a method for manufacturing a three-dimensional light emitting appliance is disclosed, said method comprising: providing a first data model of a three-dimensional area; arranging a plurality of spots for light emitting devices on the three-dimensional area of the first data model, wherein the plurality of spots is substantially evenly distributed over at least a part of the three-dimensional area; transforming the first data model of the three-dimensional area comprising the spots into a substantially two-dimensional and flat second data model, wherein the position of the spots on the second data model is derived; manufacturing a printed circuit board in accordance with the second data model and arranging pads of the printed circuit board on the spots of the second data model; equipping the pads of the printed circuit board with light emitting devices; and bringing the printed circuit board into the shape of the three-dimensional area. Further, a three-dimensional light emitting appliance is disclosed.

A light source module is provided. The light source module includes a metal substrate, a ceramic substrate, a heat conducting element, and a light emitting unit. The metal substrate has a surface. The ceramic substrate is disposed on the surface of the metal substrate, and the ceramic substrate has an upper surface. The heat conducting element partially covers the upper surface of the ceramic substrate and the surface of the metal substrate. The light emitting unit is disposed on the upper surface of the ceramic substrate. When the light emitting unit emits light, a portion of the heat generated by the light emitting unit is conducted from the ceramic substrate to the metal substrate via the heat conducting element.

Disclosed is an LED assembly having an omnidirectional light field. The LED assembly has a transparent substrate with first and second surfaces facing to opposite orientations respectively. LED chips are mounted on the first surface and are electrically interconnected by a circuit. A transparent capsule with a phosphor dispersed therein is formed on the first surface and substantially encloses the circuit and the LED chips. First and second electrode plates are formed on the first or second surface, and electrically connected to the LED chips.

Disclosed is an LED assembly having an omnidirectional light field. The LED assembly has a transparent substrate with first and second surfaces facing to opposite orientations respectively. LED chips are mounted on the first surface and are electrically interconnected by a circuit. A transparent capsule with a phosphor dispersed therein is formed on the first surface and substantially encloses the circuit and the LED chips. First and second electrode plates are formed on the first or second surface, and electrically connected to the LED chips.

An arrangement that illuminates and records a moving scene, including a light source that illuminates the moving scene, a control device that operates the light source, and a camera that records the moving scene, wherein the light source includes a plurality of pixels, each of which is configured to illuminate an area of the moving scene, the control device is configured to operate the pixels, and the light source includes at least one semiconductor component including at least one semiconductor chip containing two or more of the plurality of pixels.

A set including a plug connectable LED and a packaged photocurable composition. It relates also to methods for applying that article. The photocurable composition includes cyanoacrylate monomers and/or acrylate monomers, and a visible light photoinitiator system. The plug connectable LED, when connected to a host mobile device including a rechargeable battery, allows energisation of the LED so that it can be used as a convenient light source to cure the photocurable composition. The set itself does not comprise a battery or, batteries. The set is a versatile consumer product in the field of adhesives, fillers, sealants and coatings.

A set including a plug connectable LED and a packaged photocurable composition. It relates also to methods for applying that article. The photocurable composition includes cyanoacrylate monomers and/or acrylate monomers, and a visible light photoinitiator system. The plug connectable LED, when connected to a host mobile device including a rechargeable battery, allows energisation of the LED so that it can be used as a convenient light source to cure the photocurable composition. The set itself does not comprise a battery or, batteries. The set is a versatile consumer product in the field of adhesives, fillers, sealants and coatings.

A lighting device disclosed in an embodiment of the invention includes: a substrate; a plurality of light emitting devices disposed on the substrate; a first reflective member disposed on the substrate; a resin layer disposed on the first reflective member; a second reflective member disposed on the resin layer; and a wavelength conversion layer disposed on one surface of the resin layer opposite to the light emitting surface of the light emitting device, wherein a distance from the light emitting surface to the one surface may be 5 to 10 times a height of the resin layer.

A LED filament arrangement (100), comprising a plurality of LED filaments (110a, 110b), each LED filament comprising an array of a plurality of light emitting diodes (120), LEDs, arranged on an elongated carrier (70), wherein a first LED filament (110a) elongates along a respective first axis, A.sub.i, and a second LED filament (110b) of the plurality of LED filaments elongates along a respective second axis, B.sub.i, wherein a respective angle, θ.sub.i, between A.sub.i and B.sub.i fulfils |θ.sub.i|>10°, a frame (200) comprising a plurality of first elements (210) defining a mesh structure of the frame, wherein a first element elongates along a respective first element axis, C.sub.i, wherein a respective first angle, α.sub.i, between A.sub.i and C.sub.i, and wherein a respective second angle, β.sub.i, between B.sub.i and C.sub.i fulfils |α.sub.i|≠|β.sub.i|, and a control unit configured to individually control the operation of the first and second LED filaments.