Disclosed are a device and a method for pressure-molding an anti-overheating CSP fluorescent membrane. The device comprises a frame, a mould pressing device, a force measuring device, a control device and a feeding device; and the mould pressing device comprises an upper pressing mould, an upper clamp, a lower pressing mould, a guide post, an elastic supporting structure, and a lower clamp. As the stage of pressing the elastic supporting structure is added to the course of pressure molding, a mould clamping force of the pressure molding increases in a relatively steady way, and a force impact of a mould clamping device is reduced, thereby easily determining an initial point for maintain temperature of the pressure molding. The present invention effectively prevents overheating caused by long-term and large-area contact between the lower clamp and the heating lower pressing mould, and avoids the process defect of premature melting of the fluorescent membrane due to overheating, thereby greatly improving the product consistency and yield rate of the CSP-package fluorescent membrane in the pressure molding process.

The specification and drawings present a new apparatus such as a lighting apparatus, the apparatus comprising at least one LED (or OLED) module, configured to generate a visible light such as white light, and at least one component such as optical component comprising a compound consisting essentially of the elements neodymium (Nd) and fluorine (F), and optionally including one or more other elements. The lighting apparatus is configured to provide a desired light spectrum by filtering the generated visible light using the compound.

An LED lamp that can take the place of incandescent lamps. An elevated light source is positioned above a screw-type base. A first plurality of LEDs is connected in a series on one side of a flat substrate and a second plurality of LEDs, equal in number to the first, is connected in series on an opposite side of the substrate. Each LED of the first and second plurality of LEDs is mounted proximate a heat sink and a drive circuit is provided for the LEDs, with the drive circuit being located proximate and electrically connected to the screw base.

A lighting fixture includes a housing, substrate within the housing, a plurality of closely spaced LED components mounted on the substrate and forming an array, an optical component arranged at an output end of the housing, and at least one circuit electrically connected to a power supply for powering the LED components. The LED components are arranged in multiple color groups, each color group having multiple LED components, and each LED component positioned a distance no greater than 1.0 mm from an adjacent LED component.

An LED tube lamp includes an LED lamp tube, a coupling structure, one or more end caps, one or more power supplies, and an LED light strip. The end cap is connected to an end of the LED lamp tube by the coupling structure. The power supply is in the end cap. The LED light strip including one or more LED light sources is in the LED lamp tube. The LED light sources are electrically connected to the power supply via the LED light strip. The end cap includes a tube wall and an end wall. The tube wall is coaxial with the LED lamp tube and is connected to the end of the LED lamp tube. The end wall is perpendicular to an axial direction of the tube wall and is connected to an end of the tube wall away from the LED lamp tube.

The specification and drawings present a new apparatus such as a lighting apparatus, the apparatus comprising at least one LED (or OLED) module configured to generate a visible light such as white light, and at least one component such as an optical component comprising multiple (two or more) compounds, each containing neodymium (Nd) and at least one compound including fluorine (F) for imparting a desired color filtering effect to provide a desired light spectrum, where a color of the desired light spectrum in a color space is determined by relative amounts of the two or more compounds in the at least one component.

An integrated electrical connector device structure of LED light includes a light source board, a supporting board a light head, and at least a conductive connector. The supporting board is set between the light source board and the light head. The conductive includes a conductive pin, a fixed part and a plug. The fixed part is fixed on the supporting board. The conductive pin is connected to the light head electrically. The plug is connected to the light source board electrically to connect the light head and the light source board electrically. The integrated electrical connector device structure of LED light owns the advantages of simple structure and easy to be assembled automatically.

A LED based lighting apparatus is disclosed. The light engine used in the lighting apparatus may use printed circuit board and have a plurality of LED groups that are independently controllable by a control unit. The power supply input and return paths connected to each LED group may be implemented on different layers to allow a compact footprint that may be used with traditional fluorescent encasements with relatively little modification. The LEDs may comprise a subset of LEDs having a first colour and a subset of LEDs having a second colour different from said first colour intertwined on the light engine.

LED lamp systems having improved light quality are disclosed. The lamps emit more than 500 lm and more than 2% of the power in the spectral power distribution is emitted within a wavelength range from about 390 nm to about 430 nm.

A light source device includes: a holder that has a first surface and a second surface located higher than the first surface, and is an integral structure; a semiconductor light-emitting device on the first surface; an optical element unit that is disposed above the semiconductor light-emitting device, and has a reflective surface that inclines with respect to the first surface and reflects emitted light from the semiconductor light-emitting device; and a phosphor optical element that is disposed on the second surface and irradiated with reflected light from the optical element unit.