Patent classifications
F21K99/00
Downlight module and method for manufacturing the same
Disclosed herein is a downlight module that includes a light source driving board, an isolating board, a lens module, a back housing, and an input power line. The light source driving board includes a light-emitting diode and a driving circuit. The isolating board has a through hole. The lens module includes a lens housing, wherein the light source driving board and the isolating board are disposed in the lens housing. The back housing covers the lens housing of the lens module. The back housing has an opening, wherein the melting temperature of the back housing is lower than the melting temperature of the lens housing. The input power line is connected with the light source driving board via the opening of the back housing and the through hole of the isolating board.
LED lamps with improved quality of light
LED lamp systems having improved light quality are disclosed. The lamps emit more than 500 lm and more than 2% of the power in the spectral power distribution is emitted within a wavelength range from about 390 nm to about 430 nm.
Backlight module
A backlight module includes a light source and an optical film group. The light source is suitable for emitting a first light. The optical film group includes an optical wavelength conversion film, which is adapted to receive the first light and to convert the first light into a second light with different wavelength. The optical wavelength conversion film includes a first portion and a second portion, wherein a quantity of the first light received per unit area of the first portion of the optical wavelength conversion film is greater than a quantity of the first light received per unit area of the second portion of the optical wavelength conversion film. Furthermore, an optical wavelength conversion efficiency of the first portion of the optical wavelength conversion film with respect to the first light is smaller than an optical wavelength conversion efficiency of the second portion of the optical wavelength conversion film with respect to the first light.
LED tube with safety device
A LED tube with a safety device is provided. The LED tube is connected with an external power supply, comprises: two conductive needle groups, each of the conductive needle groups includes two needles; at least a LED light-emitting component configured to be electrically connected with the needles; and a plurality of fuses configured at the conductive needle groups, respectively.
Spectrally enhanced white light for better visual acuity
A lighting configuration for providing improved vision acuity includes a first light source emitting light having a first wavelength peak in the range from 500 to 530 nm; a second light source emitting light having a second wavelength peak in the range from 600 to 640 nm; and a third light source emitting light having a third wavelength peak in the range from 440 to 460 nm. The radiated power at 555 nm is less than 15% of the radiated power at the wavelength of the second wavelength peak. The light configurations are characterized by an S/P ratio between 2 and 5. Optionally the radiated power at 480 nm is at least 20% of the second wavelength peak. The light sources used in the lighting configuration can be LEDs, preferably LEDs that are substantially free of a color conversion layer.
LED-based light with canted outer walls
An LED-based light has an elongate housing having a longitudinal axis and a vertical axis, the housing defined by a base and two canted outer walls meeting opposite the base, the housing defining a cavity. An LED circuit board on which a plurality of LEDs are located is positioned within the cavity. End caps are positioned at opposite ends of the housing.
In mold electronic printed circuit board encapsulation and assembly
The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
Isolating alignment and structural strength in LED display systems
A display system, a method of constructing a display system, and a method of displaying an image are described. In one embodiment, a display system includes a support structure having a plurality of attachment members and a plurality of tiles. Each of the plurality of tiles is attached to a corresponding attachment member of the plurality of attachment members. The support structure is configured to structurally support each of the plurality of tiles, and at least one of the plurality of tiles includes at least one connection configured to removably connect and align the at least one of the plurality of tiles with another one of the plurality of tiles.
Light emitting diode array assembly
The present invention relates generally to LED (light emitting diode) array assemblies, and more specifically, to hi-powered LED array assemblies which are compact, cost-effective and easily assembled, while still addressing the issue of thermal management in such systems. An improved LED array assembly is described which is compact, cost-effective and easily assembled, while still addressing the issue of thermal management. An exemplary LED assembly consists of four separate and independent printed circuit boards (PCBs) which are arranged in an elongated square prism on a base PCB to form a tower, the four PCBs being mechanically interconnected by means of complementary slots and tabs. Each of the vertically arranged PCBs supports and provides power to one or more LEDs. Other aspects of the invention are also described including a flared base, drainage openings, and retaining notches on the perimeter of the PCB tower.
Solid-state light source device
A solid-state light source device is equipped with a semiconductor light emitting element and a wavelength conversion element. The semiconductor light emitting element has a first light emitter and a second light emitter. The wavelength conversion element has a first wavelength converter containing a first phosphor and has a second wavelength converter containing a second phosphor. The first wavelength converter and the second wavelength converter are disposed apart from each other. The first light emitter emits first excitation light, and the second light emitter emits second excitation light. The first phosphor converts the first excitation light into first-wavelength light, and the second phosphor converts the second excitation light into second-wavelength light.