A light bulb apparatus includes a cap connector, a light source, a heat sink module, a bulb shell and a reflective layer. The cap connector is used for connecting to an external power source. The bulb shell has a bottom part and a neck part. The reflective layer is disposed at the bottom part of the bulb shell for guiding a first light emitted from the LED module on the reflective layer to escape from the neck part of the bulb shell.

A lamp includes a tubular glass bulb with open end sides, at least one elongate carrier, inserted into the glass bulb, for at least one light strip, at least one elastic diffuser layer which is introduced into the glass bulb, and two bases which are fitted onto the open end sides of the glass bulb. The at least one light strip has a strip-shaped circuit board with a front-side conduction structure and with at least one semiconductor light source which is electrically connected thereto. The conduction structure is electrically connected to at least one of the bases. The at least one diffuser layer arches over the at least one semiconductor light source and the at least one conduction structure in a contact-free fashion at least over a length between the bases. The at least one diffuser layer is latched to the at least one carrier.

The present invention provides a light-emitting diode (LED) device and a method for manufacturing the same. The LED device comprises: a substrate (1); a chip (2) disposed on the substrate (1); and a first lens (3) disposed on the substrate (1) and spaced from the chip (2); wherein the first lens (3) comprises luminescent powder (7) and at least one of light-diffusing particles (8) and light-reflecting particles (10). The LED device provided by the present invention has a high luminous efficiency, and solves the problem in the prior art that the LED device has a small angle of emergence and the emergent light emergence lacks of uniformity.

The present invention relates to a lighting device (300) having a housing (302) and multiple light sources (308) arranged in the housing. The light sources emit light of a first wavelength range. The lighting device includes a wavelength converting member (310) arranged at a distance from the light sources, and it comprises a first wavelength converting material configured to convert a part of said light of a first wavelength range into light of a second wavelength range. The lighting device further includes a color distribution member (312) providing a color distribution of the light emitted from the lighting device where the ratio of intensity of light with the first wavelength range to the intensity of light with the second wavelength range is larger at low angles to a light output surface of the lighting device than at high angles to the light output surface.

The invention provides a lighting device (1) comprising (i) a light source (10) configured to generate light source light (11), and (ii) a light converter (100) configured to convert at least part of the light source light (11) into visible converter light (121), wherein the light converter (100) comprises a polymeric host material (110) with light converter nanoparticles (120) embedded in the polymeric host material (110), wherein the polymeric host material (110) is based on radical polymerizable monomers, wherein the polymeric host material comprises a poly acrylate polymer and wherein the light converter nanoparticles (120) comprise Ag (silver) nanoparticles having mean dimensions below 3 nm.

An optical device includes a lower surface that is substantially transparent. The optical device further includes an upper surface disposed opposite the lower surface and having a first specular layer disposed thereon. The optical device further includes a first lateral surface extending between the lower surface and the upper surface and having a second specular layer disposed on at least a portion thereof.

Flexible interconnection between substrates, where the substrates include one or more solid state light sources, mounted at varying angles are provided. A multi-dimensional lighting device is formed using such substrates. The multi-dimensional lighting device includes external mounting surfaces, each configured to provide mounting positions for one or more substrates. A flexible jumper device electrically couples a given substrate to an adjacent substrate, and provides a predefined clearance between surfaces of the same and exposed conductive surfaces of the lighting device. Each flexible jumper includes a surface mount device (SMD) capable of being placed by automated process, such as by pick-and-place machines. Such lighting devices are thus possible using automated processes in a high-volume, highly-precise manner.

An LED lamp A1 includes a plurality of LED modules 1 and a substrate 2 on which the LED modules 1 are mounted in a row. A light guide 3 covering the LED modules 1 is provided on the substrate 2. The light guide 3 is held in close contact with each of the LED modules. With this arrangement, a proper amount of light is obtained with the use of a smaller number of LED modules 1 or with less power consumption.

A method of producing a partial luminaire includes arranging at least one semiconductor chip that emits electromagnetic radiation on a substrate, and applying an elastic waveguide, disposed downstream of the at least one semiconductor chip in an emission direction, such that the elastic waveguide projects at at least one of its side surfaces beyond the substrate.

A lighting module (150) and a method (100) of manufacturing a lighting module, wherein the method comprises the steps of providing a heat sink material (120) in a fluid state and providing a light-source assembly (110) comprising a plurality of light sources (111) being electrically connected to a carrier (112), wherein each of the light sources has a light-emitting surface (113). The method further comprises the steps of embedding (130) the light-source assembly into the heat sink material such that the carrier and a part of each of the light sources are covered by the heat sink material while the light-emitting surface of each of the light sources is uncovered by the heat sink material, and solidifying (140) the heat sink material.