F21V29/00

Light Mounting Apparatus
20170268762 · 2017-09-21 ·

A light socket configuration originally intended for light sources based on technologies other than light emitting diodes (LEDs) can be upgraded to accommodate an LED light source. The upgraded socket can be backward compatible with the non-LED light sources and thus may accommodate both LED- and non-LED-based light sources. The upgrade can comprise adding heat management technology to the light socket to address heat sensitivity of LED light sources. A structural portion of the socket can be formed from a material that has a relatively high thermal conductivity in order to conduct heat away from the LED light source. The socket may include heat dissipating fins. An associated heat spreader or heat sink can spread, sink, dissipate, or otherwise manage the heat conducted away from the LED light source.

Interfacing a light emitting diode (LED) module to a heat sink
09810407 · 2017-11-07 · ·

A light emitting diode (LED) module is in thermal communication with front and back heat sinks for dissipation of heat therefrom. The LED module is physically held in place with at least the back heat sink. A mounting ring and locking ring can also be used to hold the LED module in place and in thermal communication with the back heat sink. Key pins and key holes are used to prevent using a high power LED module with a back heat sink having insufficient heat dissipation capabilities required for the high power LED module. The key pins and key holes allow lower heat generating (power) LED modules to be used with higher heat dissipating heat sinks, but higher heat generating (power) LED modules cannot be used with lower heat dissipating heat sinks.

Solid state lights with cooling structures
09810418 · 2017-11-07 · ·

A solid state lighting (SSL) with a solid state emitter (SSE) having thermally conductive projections extending into an air channel, and methods of making and using such SSLs. The thermally conductive projections can be fins, posts, or other structures configured to transfer heat into a fluid medium, such as air. The projections can be electrical contacts between the SSE and a power source. The air channel can be oriented generally vertically such that air in the channel warmed by the SSE flows upward through the channel.

Lighting apparatus and lighting control system
09810414 · 2017-11-07 · ·

Disclosed are a lighting apparatus and a lighting control system. The lighting apparatus includes a heat radiation frame, at least one light emitting device on the heat radiation frame, a diffusion frame provided on the heat radiation frame to protect the at least one light emitting device and diffuse a light emitted from the at least one light emitting device, and a support frame provided under the heat radiation frame and having a receiving space to receive at least one module. The module includes a wireless communication module to transmit or receive a control single of the at least one light emitting device. The power supply module is physically separated from the wireless communication module.

Method for manufacturing a lamp-housing-type heat-sink, lamp-housing-type heat-sink, and LED lighting device

A lamp-housing-type heat-sink in an LED lighting device is provided, which is a hollow middle part formed monolithically by extending a high purity aluminum plate with a thickness of 0.5 mm to 5 mm and an aluminum content of above 95%. The heat-sink has a heat-sinking surface and housing body. A surface contact structure is formed between the heat-sinking surface and a circuit board, and several radiating holes are set on the housing body to form heat dissipation channels. A method for manufacturing the lamp-housing-type heat-sink in LED lighting device is also provided. The lamp-housing-type heat-sink uses fewer materials and costs less than conventional die-cast aluminum housing, while providing a higher thermal conductivity co-efficient.

Light-emitting assembly and lamp having a light-emitting assembly

A light-emitting assembly that has a light-radiating element for radiating light, an optical element for influencing the light, and a transparent insulating element, which is arranged in the path of the light, wherein the insulating element is made of a material that is more thermally stable than the material of the optical element. A lamp, in particular in the form of a spotlight, having such a light-emitting assembly is also disclosed.

LED lamp

A lamp has an optically transmissive enclosure and a base. A tower extends from the base into the enclosure and supports an LED assembly in the enclosure. The LED assembly comprises a plurality of LEDs operable to emit light when energized through an electrical path from the base. The tower and the LED assembly are arranged such that the plurality of LEDs are disposed about the periphery of the tower in a band and face outwardly toward the enclosure to create a source of the light that appears as a glowing filament. The tower forms part of a heat sink that transmits heat from the LED assembly to the ambient environment. The LED assembly has a three-dimensional shape. An electrical interconnect connects a conductor to the heat sink where the conductor is in the electrical path between the LED assembly and the base.

Quick-release mechanism for a modular LED light engine
09810417 · 2017-11-07 · ·

A light emitting diode module is removably coupled to a heat sink with screws and includes slots configured to receive at least a portion of the screw therethrough, the width of the slot being greater than the thread-width of the screw but less than the width of the screw head. Some slots also include a keyhole having a diameter greater than the width of the screw head. For embodiments without keyholes, the module is coupled to a heat sink by loosening the screws, sliding them into the slots, and tightening the screws to hold the LED module in place. For embodiments with one or more keyholes, the keyhole is vertically aligned with the screw, the module is moved down over the screw, and the screw is moved into the narrower portion of the slot. Then, the screws are tightened to hold the module in place against the heat sink.

LED candle bulb and LED candle light
09765955 · 2017-09-19 · ·

The present invention is directed generally to electric lighting, and more particularly to a light emitting diode (LED) candle bulb and LED candle light. More particularly, the present invention relates to a candle light assembly comprising: a bulb enclosing a volume and having an opening at a longitudinal end, wherein the opening has an interior circumference which is threaded; a heat sink base with an opening at a longitudinal end, wherein the opening has an interior circumference which is threaded; a connector for securing the bulb to the heat sink base, which has an upper exterior threaded portion for communicating with the threaded bulb and a lower exterior threaded portion for communicating with the threaded base; and an optics assembly comprising an LED, a lens, and a drive circuit for operating the LED. The LED candle lights according to embodiments of the invention can provide bright lighting similar to that of traditional incandescent candle light without overheating.

Method for constructing universal LED bulb, flange inner snap ring type LED bulb and lamp
09765951 · 2017-09-19 · ·

The present invention discloses a method for constructing a universal LED bulb, a flange snap ring type LED bulb and a lamp. A heat conductive bracket (3) with a flange is used as a structure supporting main body of the bulb to establish an optical engine core member of the LED bulb. An inner snap ring (81) fixed to the heat conductive bracket (3) is used to support the optical engine core member in an auxiliary manner. The optical engine core member is composed of the heat conductive bracket (3), an optical engine module (4), the inner snap ring (81), an inner cover (6), an electric connector (11) and a light distribution optical lens (7). The optical engine module (4) is made up of an optical engine die plate, an LED chip and a relevant wiring by bonding and packaging, or is further integrated with a power supply drive chip.