An illumination assembly includes a polymeric substrate, an electrical circuit including two conductors supported by the polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader thermally coupled to the LED. The two conductors can be printed on the polymeric substrate, embedded within the polymeric substrate, or lie atop the polymeric substrate. The illumination assembly may be fabricated in three-dimensional form factors.

An LED assembly includes an omnidirectional light field. The LED assembly has a transparent substrate with first and second surfaces facing to opposite orientations respectively. LED chips are mounted on the first surface and are electrically interconnected by a circuit. A transparent capsule with a phosphor dispersed therein is formed on the first surface and substantially encloses the circuit and the LED chips. First and second electrode plates are formed on the first or second surface, and electrically connected to the LED chips.

A light includes a housing defining a bottom end and a top end, a heat sink disposed within the housing and including a central body that defines a central aperture, and a plurality of arms coupled to the central body and extending outward from the central body, each of the arms including a light receiving surface. A plurality of LEDs is coupled to each of the light receiving surfaces and a hollow tube extends from the bottom of the housing and is coupled to the heat sink to define a cooling air passage that passes through the hollow tube and the central aperture to direct cooling air from the bottom of the housing to the top of the housing.

An LED light bulb comprising a lamp housing, a bulb base, connected to the lamp housing, a stem connected to the bulb base and located in the lamp housing; an LED filament, disposed in the lamp housing, where points of the LED filament in an xyz coordinates are defined as x, y, and z, an x-y plane of the xyz coordinates is perpendicular to the height direction of the LED light bulb, an z-axis of xyz coordinates is parallel with the stem, and the projection of the LED filament on the x-y plane, y-z plane and x-z plane respectively has a length L1, L2 and L3, and the length L1, the length L2, and the length L3 are substantially in a ratio of 1:(0.5 to 1):(0.6 to 0.9).

An illumination assembly includes a polymeric substrate, an electrical circuit including two conductors supported by the polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader thermally coupled to the LED. The two conductors can be printed on the polymeric substrate, embedded within the polymeric substrate, or lie atop the polymeric substrate. The illumination assembly may be fabricated in three-dimensional form factors.

A novel heat sinking technology, uniquely adaptive to LED lighting devices in a generally LED array format containing multiple openings on said heat sink's base portions and optionally fin portions providing “short path cooling” technology. The “short path cooling” technology is thoroughly taught with multiple examples. Also taught, are methods of heat sink area maintenance when said openings are placed on said heat sinks. Indeed, even surface area increases are shown to be possible when multiple openings are placed on said heat sinks. Lastly, other non-LED semiconductor cooling is discussed and illustrated in various figures using said “short path cooling” technology.

A light emitting device includes a substrate, a first group of light emitting diode (LED) structures, a second group of LED structures, and a connection port is provided. The substrate has a first surface and a second surface opposite to the first surface. The first group of LED structures is disposed on one side of the first surface. The second group of LED structures is disposed on another side of the first surface opposite to the first group of LED structures. The connection portion includes at least an opening, and a first connection pad and a second connection pad electrically coupled to at least a part of the LED structures. The connection port is adapted to be coupled to other device through the opening. A light emitting module and an illuminating apparatus are also provided.

There is provided a light emitting diode, LED, filament lamp (100) which has a longitudinal axis (LA) and provides LED filament lamp light (101). The LED filament lamp (100) comprises a LED filament (102) which comprises a light transmissive, elongated substrate (103). Said substrate (103) has a first main surface (105) at a first side (105) and a second main surface (106) at a second side (106′) opposite to the first side (105′). A plurality of LEDs (104) is mounted only onto said first main surface (105) and configured to emit LED light (107). An encapsulant (108, 114) covers the plurality of LEDs (104) and at least part of said first main surface (105). The LED filament (102) by a specific distribution of beam modifying material (115′, 115″, 109′, 109″) comprises at least a luminescent material (109′, 109″) provided in the encapsulant, and is configured to emit first LED filament light (112) in a first main direction (D1) away from the first main surface (105) and having a first color point x1,y1, and to emit second LED filament light (113) in a second main direction (D2) away from the second main surface (106) having a second color point x2,y2. The first main direction (D1) is opposite to the second main direction (D2), and, wherein (i) |x1-x2|≥0.05 and/or (ii) |y1-y2|≥0.05 applies.

Filament type light emitting devices are disclosed. One of the light emitting devices includes a non-conductive transparent substrate, one or more light emitting diode chips arrayed above the upper surface of the non-conductive transparent substrate and each including input and output ends extending toward the non-conductive transparent substrate, and conductive transparent connection portions formed on the upper surface of the non-conductive transparent substrate and electrically connected to the input and output ends. Light transmitting regions are provided without reflectors in the vicinity of the input and output ends between the non-conductive transparent substrate and the light emitting diode chips. Thus, light is emitted backward from the light emitting diode chips through the light transmitting regions and the non-conductive transparent substrate.

A light-emitting device of an embodiment of the present application comprises light-emitting units; a transparent structure having cavities configured to accommodate at least one of the light-emitting units; and a conductive element connecting at least two of the light-emitting units.