A light emitting device includes light emitting elements mounted on a first surface of a board, and a common-lead region disposed on the first surface of the board between the first light emitting element and the second light emitting element. A wavelength conversion member covers the light emitting elements and the common-lead region. The wavelength conversion member has a first end and a second end. A first metal plate protrudes at the first end of the wavelength conversion member. A second metal plate protrudes at the second end of the wavelength conversion member. The first light emitting element is connected to the common-lead region via the first wire and is electrically connected to the first metal plate via the second wire. The second light emitting element is connected to the common-lead region via the third wire and is electrically connected to the second metal plate via the fourth wire.

An LED filament, comprising a plurality of light-emitting chips, a metal electrical terminal, a fluorescent glue, an insulating substrate and an electrically and magnetically conductive connector. The plurality of light-emitting chips are connected in series, and encapsulated and fixed on a surface of the insulating substrate by the fluorescent glue, one face of the electrically and magnetically conductive connector is fitted on the other surface of the insulating substrate, the metal electrical terminal is electrically connected to a light-emitting chip at one end of the insulating substrate. Also provided is an LED filament light, comprising a plurality of LED filaments and a permanent magnet. The LED filaments are magnetically and movably connected by means of magnetic attraction via the permanent magnet, and are capable of automatic sliding adjustment during thermal expansion and elongation.

The present invention relates to a light emitting device (100). The light emitting device comprising a carrier (130). The carrier comprising a first plurality of LEDs (110) arranged in a matrix arrangement, the matrix arrangement having a plurality of LED columns (112, 114, 116) and a plurality of LED rows (113, 115, 117), wherein LED columns of the plurality of LED columns (112, 114, 116) are spaced apart from each other with a first spacing (S1) and LED rows of the plurality of LED rows (113, 115, 117) are spaced apart from each other with a second spacing (S2) and, a second plurality of LEDs (120) arranged in a linear arrangement, the linear arrangement having a length (L) larger than a width (W), wherein LEDs of the second plurality of LEDs (120) are spaced apart from each other with a third spacing (S3), the third spacing (S3) being smaller than the first and the second spacings (S1, S2) and wherein the second plurality of LEDs (120) are arranged in between LEDs of the first plurality of LEDs (110) and within the first and the second spacings (S1, S2).

A thin light-transmitting substrate showing high thermal conduction efficiency, and having a function of raising surface temperature thereof is provided. The light-transmitting substrate of the present invention comprises a substrate that transmits at least a light of a predetermined wavelength, and a conductor pattern that is disposed on the substrate, and generates heat to raise temperature of the surface of the substrate when it is supplied with an electric current. The conductor pattern is directly disposed on the substrate without any adhesive layer.

A light emitting device including a transparent board elongated in a first direction and having a first surface and an opposite second surface. Light emitting elements are arranged in the first direction on the first surface side of the board. A transparent bulb houses the board and the elements. A base is connected to the bulb, and leads electrically connect the elements to the base. The leads have a first end portion connected to the base, and an opposite second end portion. Conductive members are respectively connected to the second end portions of the leads, and the conductive members are arranged at both side of the elements on the board in the first direction. A first wavelength converting member is provided on the first surface and seals the elements. The first wavelength converting member is elongated in the first direction. The second surface of the board faces the base.

An LED filament comprising: a plurality of LED chips electrically connected with one another; two conductive electrodes, each of the two conductive electrodes being electrically connected to a corresponding LED chip of the LED chips; a light conversion coating coated on the two conductive electrodes, a portion of each of the two conductive electrodes being exposed from the light conversion coating, wherein the light conversion coating comprises a top layer and a base layer, the base layer coats on one side of the LED chips, and the top layer coats on another sides of the LED chips, so that the light conversion coating is coated on at least two sides of the LED chips; and the top layer comprise a wave crest and a wave trough adjacent to the wave crest, and an attaching structure disposed either between the top layer and the base layer, or between the base layer and the conductive electrodes, or between the top layer and the conductive electrodes to enhance fastness between the light conversion coating and the two conductive electrodes.

A lighting device disclosed in the embodiment of the invention includes a base member including a straight portion and a curved portion, a substrate including a first substrate disposed on the straight portion of the base member and a second substrate disposed on the curved portion; a plurality of light sources disposed on each of the first and second substrates, a resin layer including a first resin portion disposed on the first substrate and a second resin portion surrounding the second substrate, and a phosphor layer disposed on the resin layer, and an outer side surface of the second resin portion may include a curved surface.

An LED filament includes LED chips, two conductive electrodes, and an enclosure. The LED chips are arranged in an array along an axial direction of the LED filament and are electrically connected with one another. The two conductive electrodes are disposed corresponding to the array. Each of the two conductive electrodes is electrically connected to a corresponding LED chip at an end of the array. The enclosure is coated on two or more sides of the array and the two conductive electrodes. A portion of each of the two conductive electrodes is exposed from the enclosure. Postures of two or more of the LED chips related to an axis of the LED filament along the axial direction or related to a horizontal plane the LED filament is laid on are different from each other.

An illumination unit includes a transparent substrate, a light source, a first half mirror, and a mirror. The light source is mounted on the transparent substrate. The first half mirror is disposed on a front side of the transparent substrate. The mirror is disposed on a rear side of the transparent substrate. Light emitted from the light source is repeatedly reflected between the first half mirror and the mirror while being transmitted through the transparent substrate, so as to be output forward from the first half mirror.

A light-emitting device and corresponding method for providing a light-emitting device are described herein. In some aspects, a light-emitting device may include a flexible, light-permeable laminar substrate. The laminar substrate may include a plastic material, such as polyethylene naphtalate (PEN). The light-emitting device may also include a distribution of laminar, electrically powered light radiation sources. The electrically powered light radiation sources may include light-emitting diodes (LEDs) of a chip scale package (CSP) type on the laminar substrate. The light-emitting device may further include a layout of laminar (e.g., ink-printed), electrically conductive traces on the laminar substrate. The electrically conductive traces may be configured to serve the electrically powered light radiation sources.