An oven in which a cooking space in a cooking chamber is dividable into a plurality of individual cooking spaces by a partition member. The oven includes a door assembly including a main door rotatably combined with a main body and provided with a plurality of openings corresponding to the respective plurality of individual cooking spaces and a plurality of individual doors rotatably combined with the main body to open and close the respective plurality of openings. The door assembly may selectively open and close the entirety of the cooking space or the respective plurality of individual cooking spaces, and thus a heat loss or danger of burn generated due to opening and closing the main door when only the individual cooking space is used may be prevented.

An oven in which a cooking space in a cooking chamber is dividable into a plurality of individual cooking spaces by a partition member. The oven includes a door assembly including a main door rotatably combined with a main body and provided with a plurality of openings corresponding to the respective plurality of individual cooking spaces and a plurality of individual doors rotatably combined with the main body to open and close the respective plurality of openings. The door assembly may selectively open and close the entirety of the cooking space or the respective plurality of individual cooking spaces, and thus a heat loss or danger of burn generated due to opening and closing the main door when only the individual cooking space is used may be prevented.

Light is applied for preheating from a halogen lamp to a lower surface of a semiconductor wafer supported on a susceptor within a chamber. Thereafter, flash light is applied for flash heating from a flash lamp to an upper surface of the semiconductor wafer. High-temperature treatment gas heated by a heater is supplied into the chamber to preheat a structure inside the chamber including a susceptor before heat treatment for an initial semiconductor wafer of a lot starts. By raising the temperature of the structure inside the chamber to a temperature substantially equivalent to a temperature of the structure during steady treatment, all semiconductor wafers constituting the lot are supportable on the susceptor maintained at a constant temperature without the necessity of dummy running. Accordingly, a temperature history is equalized for all the semiconductor wafers.

A combination type cooker may include a top plate with a surface, a case that is configured to define a space shielded by the top plate, a gas burner that is provided inside the case, and in which a heat plate is heated by combustion of a fuel gas, an induction burner that is provided inside the case, and that is configured to heat a cooking container by induction, and a barrier that is provided between the gas burner and the induction burner, and that is configured to partition an inside of the case into a first space where the gas burner housed, and a second space where the induction burner is housed.

A combination type cooker may include a top plate with a surface, a case that is configured to define a space shielded by the top plate, a gas burner that is provided inside the case, and in which a heat plate is heated by combustion of a fuel gas, an induction burner that is provided inside the case, and that is configured to heat a cooking container by induction, and a barrier that is provided between the gas burner and the induction burner, and that is configured to partition an inside of the case into a first space where the gas burner housed, and a second space where the induction burner is housed.

Provided is a cooking apparatus. The cooking apparatus has a structure in which cooking modules different from each other are selectively mounted with a free arrangement structure on a top surface of the cooking apparatus.

An oven appliance includes a hinge assembly. The hinge assembly couples a door to slide assemblies such that the door is pivotable. The hinge assembly includes a hinge arm that extends through an opening of the door. The hinge arm has a plurality of rounded edges at the opening of the door. A gasket is mounted to the door at the opening of the door. The gasket extends around the hinge arm and contacts the hinge arm at the rounded edges of the hinge arm.

An oven appliance includes a hinge assembly. The hinge assembly couples a door to slide assemblies such that the door is pivotable. The hinge assembly includes a hinge arm that extends through an opening of the door. The hinge arm has a plurality of rounded edges at the opening of the door. A gasket is mounted to the door at the opening of the door. The gasket extends around the hinge arm and contacts the hinge arm at the rounded edges of the hinge arm.

A combination type cooker may include a top plate with a surface, a case that is configured to define a space shielded by the top plate, a gas burner that is provided inside the case, and in which a heat plate is heated by combustion of a fuel gas, an induction burner that is provided inside the case, and that is configured to heat a cooking container by induction, and a barrier that is provided between the gas burner and the induction burner, and that is configured to partition an inside of the case into a first space where the gas burner housed, and a second space where the induction burner is housed.

A combination type cooker may include a top plate with a surface, a case that is configured to define a space shielded by the top plate, a gas burner that is provided inside the case, and in which a heat plate is heated by combustion of a fuel gas, an induction burner that is provided inside the case, and that is configured to heat a cooking container by induction, and a barrier that is provided between the gas burner and the induction burner, and that is configured to partition an inside of the case into a first space where the gas burner housed, and a second space where the induction burner is housed.