A rotary apparatus for inputting thermal energy into fluidic medium is provided, the apparatus is being configured to impart an amount of thermal energy to a stream of fluidic medium directed along a flow path formed inside the casing between the inlet and the outlet by virtue of a series of energy transformations occurring when said stream of fluidic medium successively passes through the blade/vane rows formed by the nozzle guide vanes, the rotor blades and the diffuser vanes, respectively. A space formed between an exit from the at least one row of diffuser vanes and an entrance to the at least one row of nozzle guide vanes in a direction of the flow path formed inside the casing between the inlet and the outlet is made variable to regulate the amount of thermal energy input to the stream of fluidic medium propagating through the apparatus.

A rotary apparatus for inputting thermal energy into fluidic medium is provided, the apparatus is being configured to impart an amount of thermal energy to a stream of fluidic medium directed along a flow path formed inside the casing between the inlet and the outlet by virtue of a series of energy transformations occurring when said stream of fluidic medium successively passes through the blade/vane rows formed by the nozzle guide vanes, the rotor blades and the diffuser vanes, respectively. A space formed between an exit from the at least one row of diffuser vanes and an entrance to the at least one row of nozzle guide vanes in a direction of the flow path formed inside the casing between the inlet and the outlet is made variable to regulate the amount of thermal energy input to the stream of fluidic medium propagating through the apparatus.

A heat pump is provided that includes a first pipe in which a first refrigerant flows; a second pipe disposed at a side of the first pipe and in which a second refrigerant flows; a first heat exchanger connected with the first pipe and the second pipe and in which the first refrigerant exchanges heat with the second refrigerant; a boiler connected with the first pipe and in which the first refrigerant flows; a compressor connected with the second pipe and that compresses the second refrigerant; a second heat exchanger connected with the second pipe and in which the second refrigerant exchanges heat with outdoor air; a bypass pipe branched from first pipe and configured to exchange heat with the second heat exchanger; and a three-way valve that directs the first refrigerant to pass through the bypass pipe. When the outdoor heat exchanger operates as an evaporator, frost formation thereon may be prevented.

Provided are integrated water device applied to heat pump system, heat pump system, and control method thereof. The integrated water device includes: main module, auxiliary module, and three-way valve; when the heat pump system simultaneously has heating water demand and air conditioning demand, first end and second end of the three-way valve are controlled to be communicated, so that the heat pump main unit heats the water in the domestic water tank through the main module, and the heat pump auxiliary unit provides heat source or cooling source to the terminal device through the auxiliary module; and, when the heating for the domestic water tank is completed, the first end of the three-way valve is controlled to switch to be communicated with the third end so that the heat pump main unit and the heat pump auxiliary unit jointly provide heat source or cooling source to the terminal device.

Provided are integrated water device applied to heat pump system, heat pump system, and control method thereof. The integrated water device includes: main module, auxiliary module, and three-way valve; when the heat pump system simultaneously has heating water demand and air conditioning demand, first end and second end of the three-way valve are controlled to be communicated, so that the heat pump main unit heats the water in the domestic water tank through the main module, and the heat pump auxiliary unit provides heat source or cooling source to the terminal device through the auxiliary module; and, when the heating for the domestic water tank is completed, the first end of the three-way valve is controlled to switch to be communicated with the third end so that the heat pump main unit and the heat pump auxiliary unit jointly provide heat source or cooling source to the terminal device.

A system includes one or more semiconductor processing chambers, and a processing fluid supply system which includes an input portion configured to receive a first fluid from a first fluid source, and a heated flow portion configured to deliver a heated processing fluid including the first fluid to the one or more semiconductor processing chambers. A waste system is configured to receive hot waste fluid from the heated flow portion and/or the one or more semiconductor processing chambers. A heat pump includes a source loop and a load loop, the source loop being thermally coupled to an external heat source. A first heat exchanger includes a first supply-side flow path in fluid communication with the input portion, and a first heat delivery-side flow path in fluid communication with the load loop such that the heat exchanger heats the first fluid before the first fluid enters the heated flow portion.

A system includes one or more semiconductor processing chambers, and a processing fluid supply system which includes an input portion configured to receive a first fluid from a first fluid source, and a heated flow portion configured to deliver a heated processing fluid including the first fluid to the one or more semiconductor processing chambers. A waste system is configured to receive hot waste fluid from the heated flow portion and/or the one or more semiconductor processing chambers. A heat pump includes a source loop and a load loop, the source loop being thermally coupled to an external heat source. A first heat exchanger includes a first supply-side flow path in fluid communication with the input portion, and a first heat delivery-side flow path in fluid communication with the load loop such that the heat exchanger heats the first fluid before the first fluid enters the heated flow portion.

A system includes one or more semiconductor processing chambers, and a processing fluid supply system including an input portion configured to receive a first fluid from a first fluid source, a heater fluidly coupled to the input portion and configured to heat the first fluid, and a heated flow portion fluidly coupled to the heater and configured to deliver a heated processing fluid including the first fluid heated by the heater to the one or more semiconductor processing chambers. A waste system is configured to receive hot waste fluid from the heated flow portion and/or a semiconductor processing chamber. A heat exchanger includes a supply-side flow path in fluid communication with the input portion and a heat delivery-side flow path in fluid communication with the waste system. The heat exchanger is configured to transfer thermal energy from the waste system to the input portion to heat the first fluid.