An adsorptive cooling system includes: a first highly adsorptive structure positioned to receive thermal energy from a thermal energy source, including: a first substrate; and a first metal-organic framework (MOF) coupled to the first substrate and adapted for adsorbing and desorbing a refrigerant under predetermined thermodynamic conditions; a second highly adsorptive structure positioned to receive thermal energy from the thermal energy source including: a second substrate; and a second MOF coupled to the second substrate and adapted for adsorbing and desorbing a refrigerant under predetermined thermodynamic conditions; a cooling unit; and a circulation system adapted for circulating refrigerant from the first highly adsorptive structure and the second highly adsorptive structure to the cooling unit to provide cooling from the thermal energy source and to return the refrigerant to at least one of the first highly adsorptive structure and the second highly adsorptive structure.

A climate-control system may include a first fluid circuit, a desiccant system, and a second fluid circuit. The first fluid circuit may include a desorber, an absorber, and an evaporator. A first fluid exits the desorber through a first outlet and flows through the evaporator and a first inlet of the absorber. A second fluid exits the desorber through a second outlet and may flow through a second inlet of the absorber. The desiccant system includes a conditioner and a regenerator. The conditioner includes a first desiccant flow path. The regenerator includes a second desiccant flow path in communication with the first desiccant flow path. The second fluid circuit circulates a third fluid that is fluidly isolated from the first and second fluids and desiccant in the desiccant system. The second fluid circuit may be in heat transfer relationships with the first fluid and the first desiccant flow path.

A climate-control system may include a first fluid circuit, a desiccant system, and a second fluid circuit. The first fluid circuit may include a desorber, an absorber, and an evaporator. A first fluid exits the desorber through a first outlet and flows through the evaporator and a first inlet of the absorber. A second fluid exits the desorber through a second outlet and may flow through a second inlet of the absorber. The desiccant system includes a conditioner and a regenerator. The conditioner includes a first desiccant flow path. The regenerator includes a second desiccant flow path in communication with the first desiccant flow path. The second fluid circuit circulates a third fluid that is fluidly isolated from the first and second fluids and desiccant in the desiccant system. The second fluid circuit may be in heat transfer relationships with the first fluid and the first desiccant flow path.

A projector a cooler configured to cool a cooling target based on transformation of a refrigerant into a gas. The cooler includes a refrigerant generator configured to generate the refrigerant and a refrigerant sender configured to send the generated refrigerant toward the cooling target. The refrigerant generator includes a moisture absorbing/discharging member, a first air blower configured to deliver air outside the projector to the moisture absorbing/discharging member, a heat exchanger connected to the refrigerant sender, a heater configured to heat the moisture absorbing/discharging member, and a second air blower configured to deliver, to the heat exchanger, air around a portion of the moisture absorbing/discharging member that is the portion heated by the heater. The heat exchanger, by cooling the air having flowed into the heat exchanger, generates the refrigerant from the air having flowed into the heat exchanger. The moisture absorbing/discharging member is fixed.

There is disclosed a heat transferring device comprising a number of spaces and conduits together with heat transferring elements and a heat exchanger as well as a heat source. A capillary tube feeds a heat transferring medium to a space from which is can be evaporated. The invention is highly suitable for all applications where heat is to be transferred from a small volume to a large area. It is also suitable where the same large area needs to be cooled. The energy consumption is reduced compared to more traditional technologies. The number of moving parts is minimized which gives lower costs for use, manufacture, maintenance etc. The invention is very versatile and can be utilized in many different applications where it is desired to transfer heat from one point to a large area. It can also be used for cooling purposes.

A heating, ventilation, air conditioning and refrigeration (HVAC/R) system includes a sorption circuit including a heat absorption heat exchanger in fluid communication with a primary fluid flow source such that a primary fluid flow from is directed therethrough. The heat absorption heat exchanger is configured to exchange thermal energy between the primary fluid flow and a secondary fluid flow. A sorption heat exchanger includes a sorbent material to adsorb or absorb the primary fluid flow, generating thermal energy. The sorption heat exchanger is configured to transfer the generated thermal energy to a tertiary fluid flow. A heat exchange circuit is in fluid communication with the sorption circuit and includes a control valves connected to both the secondary fluid flow and the tertiary fluid flow configured to selectably direct the secondary fluid flow and/or the tertiary fluid flow to a conditioning heat exchanger or an ambient heat exchanger.

A heating, ventilation, air conditioning and refrigeration (HVAC/R) system includes a sorption circuit including a heat absorption heat exchanger in fluid communication with a primary fluid flow source such that a primary fluid flow from is directed therethrough. The heat absorption heat exchanger is configured to exchange thermal energy between the primary fluid flow and a secondary fluid flow. A sorption heat exchanger includes a sorbent material to adsorb or absorb the primary fluid flow, generating thermal energy. The sorption heat exchanger is configured to transfer the generated thermal energy to a tertiary fluid flow. A heat exchange circuit is in fluid communication with the sorption circuit and includes a control valves connected to both the secondary fluid flow and the tertiary fluid flow configured to selectably direct the secondary fluid flow and/or the tertiary fluid flow to a conditioning heat exchanger or an ambient heat exchanger.

Chemical heat pump system 1 includes: endothermic unit 3 that contains a slurry containing a solid product and that absorbs heat supplied from an outside to perform an endothermic reaction at first pressure P.sub.1; exothermic unit 2 that contains a slurry containing a solid reactant and that performs an exothermic reaction at a second pressure P.sub.2 that is higher than the first pressure P.sub.1 to generate heat; gas recovery supply unit 4 that recovers a gas reactant that has been decomposed in endothermic unit 3 and that supplies the gas reactant to exothermic unit 2; and circulation unit 5 that supplies the slurry containing the solid reactant, that has been decomposed in endothermic unit 3, to exothermic unit 2 after pressurizing the slurry from first pressure P.sub.1 to second pressure P.sub.2, and that supplies the slurry containing the solid product, that has been produced in exothermic unit 2, to endothermic unit 3 after depressurizing the slurry from second pressure P.sub.2 to first pressure P.sub.1, so as to circulate the slurry between endothermic unit 3 and exothermic unit 2.

Chemical heat pump system 1 includes: endothermic unit 3 that contains a slurry containing a solid product and that absorbs heat supplied from an outside to perform an endothermic reaction at first pressure P.sub.1; exothermic unit 2 that contains a slurry containing a solid reactant and that performs an exothermic reaction at a second pressure P.sub.2 that is higher than the first pressure P.sub.1 to generate heat; gas recovery supply unit 4 that recovers a gas reactant that has been decomposed in endothermic unit 3 and that supplies the gas reactant to exothermic unit 2; and circulation unit 5 that supplies the slurry containing the solid reactant, that has been decomposed in endothermic unit 3, to exothermic unit 2 after pressurizing the slurry from first pressure P.sub.1 to second pressure P.sub.2, and that supplies the slurry containing the solid product, that has been produced in exothermic unit 2, to endothermic unit 3 after depressurizing the slurry from second pressure P.sub.2 to first pressure P.sub.1, so as to circulate the slurry between endothermic unit 3 and exothermic unit 2.

In one aspect, a refrigeration system is provided. The refrigeration system includes a refrigeration circuit configured to condition an air supply, a subcooling circuit configured to cool the refrigeration circuit, the subcooling circuit including a subcooling condenser, a subcooling heat exchanger, and at least one adsorption bed, and a heat generation system thermally coupled to the subcooling circuit.