Apparatus and method for establishing a temperature gradient, comprising at least one gas-tight working space having a first boundary layer that is connected to a first electrode and a second boundary layer that is connected to a second electrode, wherein when an electric voltage is applied between the first electrode and the second electrode in the working space, an electric field can be produced between the first boundary surface and the second boundary surface, and wherein a distance between the first boundary surface and the second boundary surface is less than 5000 nm, wherein the first boundary surface comprises at least one field-enhancement device, in particular a peak, so that if an electric voltage is applied to the electrodes, a field strength of the electric field in a region of the field-enhancement device is greater than an average field strength of the electric field in the working space.

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.

A solid-state refrigeration apparatus includes a plurality of solid refrigerators, a heating medium circuit with the plurality of solid refrigerators connected, and a conveying mechanism to convey a heating medium in the heating medium circuit. Each of the solid refrigerators includes a solid refrigerant substance having a caloric effect on an external energy and an induction section to cause the solid refrigerant substance to produce the caloric effect. The heating medium circuit includes first and second channels in which the solid refrigerators are connected in series and through which the heating medium is supplied to first and second heat exchange sections. At least one bypass mechanism is connected to the first and/or second channel. The bypass mechanism switches between an action of making the heating medium flow through the solid refrigerator and an action of making the heating medium bypass the solid refrigerator.

A solid-state refrigeration apparatus includes a plurality of solid refrigerators, a heating medium circuit with the plurality of solid refrigerators connected, and a conveying mechanism to convey a heating medium in the heating medium circuit. Each of the solid refrigerators includes a solid refrigerant substance having a caloric effect on an external energy and an induction section to cause the solid refrigerant substance to produce the caloric effect. The heating medium circuit includes first and second channels in which the solid refrigerators are connected in series and through which the heating medium is supplied to first and second heat exchange sections. At least one bypass mechanism is connected to the first and/or second channel. The bypass mechanism switches between an action of making the heating medium flow through the solid refrigerator and an action of making the heating medium bypass the solid refrigerator.

The present disclosure relates to a cryogenic apparatus (300, 400, 500), comprising: at least one first temperature change mechanism (310, 410) connected to a sample stage (20) and configured to change a temperature at the sample stage (20); at least one second temperature change mechanism (320, 420, 520, 522) different from the at least one first temperature change mechanism (310, 410), wherein the at least one second temperature change mechanism (320, 420, 520, 522) is connected to the sample stage (20) and configured to change the temperature at the sample stage (20); and a controller. The controller is configured to: operate the at least one first temperature change mechanism (310, 410) in a first temperature range (A); operate the at least one second temperature change mechanism (320, 420, 520, 522) in a second temperature range (B) different from the first temperature range (A); and operate both the at least one first temperature change mechanism (310, 410) and the at least one second temperature change mechanism (320, 420, 520, 522) in a third temperature range (C) between the first temperature range (A) and the second temperature range (B).

A cooling module for solid-state refrigerant cooling includes an annular storing portion having a housing portion, low and high temperature side inflow paths, low and high temperature side outflow paths, first and second spaces between the first and second ends of housing flow paths and the low and high temperature side inflow paths, and first and second intermediate flow paths. The first intermediate flow path is in fluid communication with the low temperature side inflow path and the first space, and is configured to widen a flow of the heating medium flowing from the low temperature side inflow path to the first space. The second intermediate flow path is in fluid communication with the high temperature side inflow path and the second space, and is configured to widen a flow of the heating medium flowing from the high temperature side inflow path to the second space.

A refrigeration cycle apparatus (1) is capable of performing a refrigeration cycle using a small-GWP refrigerant. The refrigeration cycle apparatus (1) includes a refrigerant circuit (10) and a refrigerant enclosed in the refrigerant circuit (10). The refrigerant circuit includes a compressor (21), a condenser (23), a decompressing section (24), and an evaporator (31). The refrigerant contains at least 1,2-difluoroethylene.

A refrigeration cycle apparatus (1) is capable of performing a refrigeration cycle using a small-GWP refrigerant. The refrigeration cycle apparatus (1) includes a refrigerant circuit (10) and a refrigerant enclosed in the refrigerant circuit (10). The refrigerant circuit includes a compressor (21), a condenser (23), a decompressing section (24), and an evaporator (31). The refrigerant contains at least 1,2-difluoroethylene.

An apparatus can comprise a circuit and an electrical element coupled to the circuit. The circuit can include a pulse generator to generate an electrical pulse having a first power and a load. The electrical element can be configured to receive heat that is converted into electrical energy by the circuit to apply a second power, greater than the first power, to the load.

A fluid temperature control apparatus in combination with a machine tool, wherein the apparatus is arranged to adjust the temperature of a fluid being supplied to the machine tool. The apparatus comprises a temperature control assembly for adjusting the temperature of the fluid as it passes through the assembly. The assembly comprises at least one thermoelectric temperature control device.