Disclosed is a two-stage heating geothermal system using geothermal energy. The two-stage heating geothermal system includes a geothermal heat exchanger, a geothermal heat pump, a booster heat pump, a bypass line, and a bypass line opening and closing valve. The operating efficiency of the two-stage heating geothermal system using geothermal energy is significantly improved. Hot water supply, auxiliary heating, and the like are controlled to be completely independent of main heating.

Disclosed is a two-stage heating geothermal system using geothermal energy. The two-stage heating geothermal system includes a geothermal heat exchanger, a geothermal heat pump, a booster heat pump, a bypass line, and a bypass line opening and closing valve. The operating efficiency of the two-stage heating geothermal system using geothermal energy is significantly improved. Hot water supply, auxiliary heating, and the like are controlled to be completely independent of main heating.

The present invention relates to a high-vacuum serial condenser system that can minimize a pressure drop of fluid in condensers by disposing straight pipes between the condensers and installing baffles at predetermined angles in the condensers.

A refrigeration system that induces lubricant-liquid refrigerant mixture flow from a flooded or falling film evaporator by means of the lubricant-liquid refrigerant mixture flow adsorbing heat from an electronic component.

A flexible two-phase cooling apparatus for cooling microprocessors in servers can include a primary cooling loop, a first bypass, and a second bypass. The primary cooling loop can include a reservoir, a pump, an inlet manifold, an outlet manifold, and flexible cooling lines extending from the inlet manifold to the outlet manifold. The flexible cooling lines can be routable within server housings and can be fluidly connected to two or more series-connected heat sink modules that are mountable on microprocessors of the servers. The flexible cooling lines can be configured to transport low-pressure, two-phase dielectric coolant. The first bypass can include a first pressure regulator configured to regulate a first bypass flow of coolant through the first bypass. The second bypass can include a second pressure regulator configured to regulate a second bypass flow of coolant through the second bypass.

A flexible two-phase cooling apparatus for cooling microprocessors in servers can include a primary cooling loop, a first bypass, and a second bypass. The primary cooling loop can include a reservoir, a pump, an inlet manifold, an outlet manifold, and flexible cooling lines extending from the inlet manifold to the outlet manifold. The flexible cooling lines can be routable within server housings and can be fluidly connected to two or more series-connected heat sink modules that are mountable on microprocessors of the servers. The flexible cooling lines can be configured to transport low-pressure, two-phase dielectric coolant. The first bypass can include a first pressure regulator configured to regulate a first bypass flow of coolant through the first bypass. The second bypass can include a second pressure regulator configured to regulate a second bypass flow of coolant through the second bypass.

A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation.

A sacrifice positive electrode layer is formed conveniently, efficiently, and accurately on the surface of a refrigerant distributor having a complicated shape. Further, during the formation of the sacrifice positive electrode layer, the strength in the surroundings of joined parts is prevented from being lowered by excessive heating. Included are: an applying step of applying flux to remove an aluminum oxide to a surface of a plurality of outflow sections and a distributing section; an alloy disposing step of disposing a zinc-containing aluminum-silicon alloy on the surface to which the flux is applied; a forming step of forming the sacrifice positive electrode layer on the surface by heating the disposed zinc-containing aluminum-silicon alloy; a brazing material disposing step of inserting a plurality of outflow pipes into the plurality of outflow sections, respectively, and disposing an aluminum-silicon alloy brazing material on the surface of the outflow sections; and a brazing step of brazing the plurality of outflow sections with the plurality of outflow pipes, respectively, by heating the aluminum-silicon alloy brazing material.

A sacrifice positive electrode layer is formed conveniently, efficiently, and accurately on the surface of a refrigerant distributor having a complicated shape. Further, during the formation of the sacrifice positive electrode layer, the strength in the surroundings of joined parts is prevented from being lowered by excessive heating. Included are: an applying step of applying flux to remove an aluminum oxide to a surface of a plurality of outflow sections and a distributing section; an alloy disposing step of disposing a zinc-containing aluminum-silicon alloy on the surface to which the flux is applied; a forming step of forming the sacrifice positive electrode layer on the surface by heating the disposed zinc-containing aluminum-silicon alloy; a brazing material disposing step of inserting a plurality of outflow pipes into the plurality of outflow sections, respectively, and disposing an aluminum-silicon alloy brazing material on the surface of the outflow sections; and a brazing step of brazing the plurality of outflow sections with the plurality of outflow pipes, respectively, by heating the aluminum-silicon alloy brazing material.

The present invention relates to a cooling device (1) comprising more than one cabinet (2, 102, 202) wherein items to be cooled are placed and which are positioned separately, a compressor (5) providing the cooling cycle to be performed, and more than one valve (6, 106, 206) providing the refrigerant pumped from the compressor (5) to be determined, to which cabinet (2, 102, 202) and in which amount it will be directed.