A rapid cooling system for processing food is disclosed which includes a heat exchanger adapted to receive a first coolant (Coolant-I) at a first temperature and eject Coolant-I at a second temperature, a cooling chamber disposed within the heat exchanger in thermal communication with the heat exchanger, the cooling chamber includes a first inlet adapted to receive a product at an elevated temperature (T1), a second inlet adapted to receive a second coolant (Coolant-II) at a low temperature (T2), and an outlet adapted to release a combination of the product and Coolant-II at a low temperature (T.sub.out) and pressure (P.sub.out), wherein cooling of the product from T1 to T.sub.out does not cause a phase change in the product.

A convertible storage assembly is disclosed with a body with an interior space. In an embodiment, a removable waterproof liner may divide the space into first and second compartments. With a liner in place, the first compartment is accessible through a first removable barrier and is water-retaining due to the liner: and the second compartment is accessible through a second removable barrier. The size of the second compartment may be changed by deforming a flexible liner, or by changing from a first liner to a second liner of different shape.

Methods, systems, and device for solidification and/or solid production, such as ice production, are provided in accordance with various embodiments. For example, some embodiments include a method of solid production that may include contacting a first fluid with a second fluid to facilitate solidifying the second fluid; the first fluid and the second fluid may be immiscible with respect to each other. The method may include solidifying the second fluid. Some embodiments include a solid production system that may include a first fluid and a second fluid; the first fluid and the second fluid may be immiscible with respect to each other. The system may include one or more surfaces configured to contact the first fluid and the second fluid with each other and to form one or more solids from the second fluid.

Described in detail herein is cooler apparatus. The cooler can include an outer shell and an inner shell. The outer shell can include a top face, a bottom face, a front surface, back surface a first side and a second side. The top face can be secured to the cooler using a zipper. The top face can provide access the inner shell. One or more bottle openers can be affixed to the front surface of the outer shell. The front surface can further include an enclosure accessible using a zipper. The bottom side can be compressible in response to receiving pressure. One or more straps can be affixed to either the first side, second side or back surface of the cooler. The inner shell can form a volume to store physical objects. The cooler can be a backpack, tote or a 24-pack cooler.

The invention relates to a freezing machine (150) for freezing samples, encompassing: a freezing device (140) for freezing a sample received in the freezing machine (150); a container (100) for receiving the frozen sample, having a reservoir (105) for liquid nitrogen; and a transfer apparatus for transferring the frozen sample from the freezing device (140) into the container (100), the container (100) comprising at least two receiving devices (104), separated from one another, each for at least one frozen sample; a selection apparatus being provided for selecting one of the receiving devices (104) for a frozen sample that is to be transferred into the container (100), the freezing machine (150) being configured to carry out the transfer of the frozen sample, by means of the transfer apparatus, into the respectively selected receiving device (104) of the container (100); and to a method for transferring frozen samples into a container provided therefor.

A sintered heat tube and a semiconductor cooling refrigerator having the same, the sintered heat tube comprises: a main tube segment with its both ends closed, and a manifold tube segment/manifold tube segments extending from one or more portions of one side of the main tube segment (respectively), wherein a work chamber of each manifold tube segment communicates with that of the main tube segment. In the sintered heat tube and the semiconductor cooling refrigerator having the sintered heat tube of the present invention, as the sintered heat tube includes manifold tube segments, the sintered heat tube of the present invention greatly improves the heat radiating or cold transferring efficiency. The sintered heat tube is particularly suitable for heat radiation of heat sources of a high heat flow density such as semiconductor cooling plates.

A packaged food product processing machine. The machine comprises a food consumer interface configured to receive a food consumer selection identifying an end state of a food product, a package cooling sub-system comprising a chilled fluid bath, a gripper component configured to agitate a package containing the food product in the chilled fluid bath and to sense a physical parameter of the food product, and a controller configured to command the gripper to control the rate of heat transfer from the package to the chilled fluid bath based on receiving an input identifying an end state selection from the food consumer interface and based on receiving an input containing a value of the physical parameter of the food product from the gripper component.

A packaged food product processing machine. The machine comprises a food consumer interface configured to receive a food consumer selection identifying an end state of a food product, a package cooling sub-system comprising a chilled fluid bath, a gripper component configured to agitate a package containing the food product in the chilled fluid bath and to sense a physical parameter of the food product, and a controller configured to command the gripper to control the rate of heat transfer from the package to the chilled fluid bath based on receiving an input identifying an end state selection from the food consumer interface and based on receiving an input containing a value of the physical parameter of the food product from the gripper component.

Shipping systems for temperature-sensitive materials and methods of making and using same. In one embodiment, the shipping system includes a cooler base and a lid. The base includes an inner portion and an outer portion. The inner portion includes a thermal insulation unit including a bottom wall and four side walls. A thermally-conductive member is positioned on the bottom wall. A polymeric bag encapsulates the thermally-conductive member and some of the thermal insulation unit. The outer portion includes thermally-insulating material and defines an opening. The inner portion is permanently bonded to the outer portion, with cavities defined therebetween. A product box is placed in the inner portion directly over the polymeric bag and the underlying thermally-conductive member. First temperature-control members are disposed within the inner portion, with at least one temperature-control member directly over the polymeric bag and the underlying thermally-conductive member. Second temperature-control members are disposed within the cavities.

Shipping systems for temperature-sensitive materials and methods of making and using same. In one embodiment, the shipping system includes a cooler base and a lid. The base includes an inner portion and an outer portion. The inner portion includes a thermal insulation unit including a bottom wall and four side walls. A thermally-conductive member is positioned on the bottom wall. A polymeric bag encapsulates the thermally-conductive member and some of the thermal insulation unit. The outer portion includes thermally-insulating material and defines an opening. The inner portion is permanently bonded to the outer portion, with cavities defined therebetween. A product box is placed in the inner portion directly over the polymeric bag and the underlying thermally-conductive member. First temperature-control members are disposed within the inner portion, with at least one temperature-control member directly over the polymeric bag and the underlying thermally-conductive member. Second temperature-control members are disposed within the cavities.