The present invention provides a cold end heat exchanging device, which comprises: a cold end heat exchanging part which defines an inner cavity or pipeline for containing a refrigerant existing in both gas and liquid phases; and a plurality of refrigerant pipelines, each provided with: an evaporation section which is downwardly bent and extends in a vertical plane and has a closed tail end, and a connection section which is upwardly bent and extends from a starting end of the evaporation section and is connected to the inner cavity or pipeline; wherein the evaporation sections of at least some refrigerant pipelines are arranged in two vertical planes perpendicular to each other. The present invention further provides a semiconductor refrigerator having the cold end heat exchanging device. The cold dissipation efficiency of the cold end heat exchanging device and the energy efficiency of the semiconductor refrigerator are significantly improved.

The present invention relates to a cryogenic cooling apparatus capable of stably maintaining a cryogenic condition by repairing or exchanging a sensor such as a temperature sensor of the cryogenic cooling apparatus without releasing vacuum states of the cryogenic cooling apparatus and a system connected thereto, when the sensor needs to be repaired or exchanged.

A vacuum adiabatic body includes a first plate; a second plate; a seal; a support; a heat resistance unit; and an exhaust port, wherein the heat resistance unit includes a conductive resistance sheet having one end connected to the first plate member, the conductive resistance sheet resisting heat conduction flowing along a wall for the third space, the heat resistance unit further includes a side frame connected to the conductive resistance sheet, the side frame defining at least one portion of the wall for the third space, the side frame includes a first mounting surface connected to the conductive resistance sheet and a second mounting surface connected to the second plate, and the second mounting surface is supported by the support.

A cryostat socket for holding an ion trap device mounted on a substrate in a cryostat includes a housing frame provided for pre-assembly in the cryostat. A pin insert is arranged in the housing frame. The pin insert includes a base plate and contact pins. The contact pins are arranged in an array. A housing cover has a receptacle for the substrate. The housing cover, when assembled with the housing frame, exerts a compressive force on a front side of the substrate by which a rear side of the substrate is pressed onto the contact pins.

A refrigerator includes a cabinet, a first inner case that defines a freezing compartment, a second inner case that defines a refrigerating compartment, a thermal siphon unit that is configured to carry a working fluid for heat transfer and that has a closed loop shape that includes a first part arranged at an outer side of the first inner case and a second part arranged at an outer side of the second inner case, and a cool air storage unit arranged in a space partitioned in the first inner case. The cool air storage unit is configured to accommodate cool air of the freezing compartment and transfer the cool air to the first part of the thermal siphon unit arranged outside of the first inner case.

There is provided a mounting structure for mounting a cryocooler cold head on a vacuum vessel. The cold head includes a cold head-side cooling stage and a cold head-side flange. The mounting structure includes a cold head accommodation sleeve installed in the vacuum vessel and including a sleeve-side cooling stage which comes into thermal contact with the cold head-side cooling stage by coming into physical contact with the cold head-side cooling stage, and a sleeve-side flange to be coupled to the cold head-side flange, an inter-flange distance adjustment mechanism configured to adjust a distance between the sleeve-side flange and the cold head-side flange so that the cold head-side cooling stage and the sleeve-side cooling stage are physically brought into contact with each other or brought into a contactless state therebetween, and a flange fastening mechanism configured to fasten the cold head-side flange to the sleeve-side flange.

The invention relates to a table having a tabletop and including a refrigerating machine, at least one section of the tabletop being coolable by means of the refrigerating machine via a thermal contact; an upper vacuum chamber, which can be evacuated, for thermally insulating the thermal contact from a surrounding area of the table, said chamber connecting an upper face of the refrigerating machine facing the tabletop and the section to be cooled, and which has at least one flexible upper chamber section; a lower vacuum chamber, which can be evacuated, which is connected to a lower face of the refrigerating machine facing away from the tabletop, and which has at least one flexible lower chamber section; and a rigid stiffening structure, which is connected to the refrigerating machine via the flexible upper chamber section and via the flexible lower chamber section.

An environmental control system is provided and includes equipment to generate an environmental control effect, a damper associated with a zone to control a portion of the environmental control effect permitted to affect the zone by assuming one of various damper positions and a capacity controller operably coupled to the equipment and the damper to control operation of the equipment and to adjust the damper to assume the one of the various damper positions based on a demand of the zone and a capacity of the equipment.

Methods, systems, and devices for ultra or extreme-high vacuum are described. Such systems may comprise a vacuum chamber, a target within the vacuum chamber, two or more overlapping radiation shields arranged within an inner vacuum space of a vacuum chamber, and surrounding at least a portion of the target, a first and a second cooling element unit thermally coupled to a first and second radiation shield of the two or more overlapping radiation shields, wherein the first unit is configured to reduce the first radiation shield's temperature to at least <100K, and the second unit is configured to reduce the second radiation shield's temperature to at least <25K, and a third cooling element unit coupled to the target and isolated from the first and second radiation shield, wherein the third cooling element unit is configured to reduce the target's temperature to at least <4K.

Methods, systems, and devices for ultra or extreme-high vacuum are described. Such systems may comprise a vacuum chamber, a target within the vacuum chamber, two or more overlapping radiation shields arranged within an inner vacuum space of a vacuum chamber, and surrounding at least a portion of the target, a first and a second cooling element unit thermally coupled to a first and second radiation shield of the two or more overlapping radiation shields, wherein the first unit is configured to reduce the first radiation shield's temperature to at least <100K, and the second unit is configured to reduce the second radiation shield's temperature to at least <25K, and a third cooling element unit coupled to the target and isolated from the first and second radiation shield, wherein the third cooling element unit is configured to reduce the target's temperature to at least <4K.