F25D19/00

Analytical Instruments, Methods, and Components

Variable temperature analytical instruments are provided that can include: a mobile component comprising a cold source; a substantially fixed analysis component; and an interface configured to couple the mobile component with the analysis component. Variable temperature analytical instruments are also provided that can include: a mobile analysis component; a substantially fixed component comprising a cold source; and an interface configured to couple the mobile component with the analysis component. Variable temperature analytical instruments are also provided that can include: a cold source in thermal communication with an analysis component; and at least one pressure barrier defining a plurality of discrete masses maintained at different temperatures between the cold source and the analysis component. Variable temperature analytical instruments are provided that can include: a cold source in thermal communication with an analysis component; and a plurality of discrete masses maintained at different temperatures about a single thermal communication between the cold source and the analysis component. Variable temperature analytical instruments are also provided that can include: a cold source in fluid communication with at least one analysis component; a pump assembly operably coupled to the cold source and the analysis component; at least a pair of conduits extending between the cold source and the analysis component; and another conduit extending between the analysis component and the pump assembly. Variable temperature analytical instruments are also provided that can include: a cold source in fluid communication with at least one analysis component; a pump assembly operably coupled to the cold source and the analysis component; at least a pair of conduits extending between the cold source and the analysis component; and another conduit extending between the analysis component and the pump assembly.

Analytical Instruments, Methods, and Components

Variable temperature analytical instruments are provided that can include: a mobile component comprising a cold source; a substantially fixed analysis component; and an interface configured to couple the mobile component with the analysis component. Variable temperature analytical instruments are also provided that can include: a mobile analysis component; a substantially fixed component comprising a cold source; and an interface configured to couple the mobile component with the analysis component. Variable temperature analytical instruments are also provided that can include: a cold source in thermal communication with an analysis component; and at least one pressure barrier defining a plurality of discrete masses maintained at different temperatures between the cold source and the analysis component. Variable temperature analytical instruments are provided that can include: a cold source in thermal communication with an analysis component; and a plurality of discrete masses maintained at different temperatures about a single thermal communication between the cold source and the analysis component. Variable temperature analytical instruments are also provided that can include: a cold source in fluid communication with at least one analysis component; a pump assembly operably coupled to the cold source and the analysis component; at least a pair of conduits extending between the cold source and the analysis component; and another conduit extending between the analysis component and the pump assembly. Variable temperature analytical instruments are also provided that can include: a cold source in fluid communication with at least one analysis component; a pump assembly operably coupled to the cold source and the analysis component; at least a pair of conduits extending between the cold source and the analysis component; and another conduit extending between the analysis component and the pump assembly.

Cryogenic cooling system

A cryogenic cooling system is provided comprising: a mechanical refrigerator, a heat pipe and a heat switch assembly. The mechanical refrigerator has a first cooled stage and a second cooled stage. The heat pipe has a first part coupled thermally to the second cooled stage and a second part coupled thermally to a target assembly. The heat pipe is adapted to contain a condensable gaseous coolant when in use. The heat switch assembly comprises one or more gas gap heat switches, a first end coupled thermally to the second cooled stage and a second end coupled thermally to the target assembly. The cryogenic cooling system is adapted to be operated in a heat pipe cooling mode in which the temperature of the second cooled stage is lower than the first cooled stage and wherein the temperature of the target assembly causes the coolant within the second part of the heat pipe to be gaseous and the temperature of the second cooled stage causes the coolant in the first part of the heat pipe to condense. The target assembly is cooled by the movement of the condensed liquid coolant from the first part of the heat pipe to the second part of the heat pipe during the heat pipe cooling mode. The cryogenic cooling system is further adapted to be operated in a gas gap cooling mode in which the temperature of the second cooled stage causes freezing of the coolant. The heat switch assembly is adapted to provide cooling from the second cooled stage to the target assembly during the gas gap cooling mode via the one or more gas gap heat switches.

Optically powered cryogenic focal plane array (FPA) with an optical data link

An optically powered cryogenic FPA with an optical data link eliminates electrical penetrations of the cryogenic chamber for power delivery thereby reducing heat leaks into the cold volume by copper wires and EMI. An optical splitter receives and separates an optical input signal into an optical carrier signal, an optical Data IN signal and an optical power signal. An optical-to-electrical (O/E) converter converts the optical power signal into an electrical power signal, which is converted into a plurality of DC voltage signals to supply power within the chamber. An optical data link modulates the optical carrier signal with electrical signals from the ROIC to form and output an optical Data OUT signal.

Optically powered cryogenic focal plane array (FPA) with an optical data link

An optically powered cryogenic FPA with an optical data link eliminates electrical penetrations of the cryogenic chamber for power delivery thereby reducing heat leaks into the cold volume by copper wires and EMI. An optical splitter receives and separates an optical input signal into an optical carrier signal, an optical Data IN signal and an optical power signal. An optical-to-electrical (O/E) converter converts the optical power signal into an electrical power signal, which is converted into a plurality of DC voltage signals to supply power within the chamber. An optical data link modulates the optical carrier signal with electrical signals from the ROIC to form and output an optical Data OUT signal.

Cryostat

A cryostat includes a room temperature vessel, a low temperature vessel, and a refrigeration mechanism. The room temperature vessel includes a room temperature tank, an outer neck tube and a sealing head. The low temperature vessel includes a low temperature tank, an inner neck tube and a liquefaction chamber. The liquefaction chamber corresponds to the first opening and passes through the first opening. The refrigeration mechanism includes a device panel and a refrigeration device. The device panel is disposed on the sealing head. The refrigeration device includes a body and a cold finger. The body is disposed at the device panel. The cold finger is connected with the body and extends into the liquefaction chamber.

Cryostat

A cryostat includes a room temperature vessel, a low temperature vessel, and a refrigeration mechanism. The room temperature vessel includes a room temperature tank, an outer neck tube and a sealing head. The low temperature vessel includes a low temperature tank, an inner neck tube and a liquefaction chamber. The liquefaction chamber corresponds to the first opening and passes through the first opening. The refrigeration mechanism includes a device panel and a refrigeration device. The device panel is disposed on the sealing head. The refrigeration device includes a body and a cold finger. The body is disposed at the device panel. The cold finger is connected with the body and extends into the liquefaction chamber.

Device for examining an atmosphere and use of the device
11327062 · 2022-05-10 · ·

The invention relates to a device for examining an atmosphere, comprising an atmosphere analysis chamber and a cryocooler, which is thermally coupled to the atmosphere analysis chamber for cooling the atmosphere analysis chamber. The invention further relates to the use of the device for examining an atmosphere, in particular the composition of an atmosphere.

Cryogenic refrigerator and heating method for pulse tube cryocooler
11326811 · 2022-05-10 · ·

A cryogenic refrigerator includes a pulse tube cryocooler including a pulse tube, and a pulse tube cryocooler rotating mechanism that rotatably supports the pulse tube cryocooler allowing it to be changed from a cooling posture to a heating posture. When the pulse tube cryocooler is in the cooling posture, an inclination angle formed between a vertical line and a center axis of the pulse tube is a first angle, and when the pulse tube cryocooler is in the heating posture, the inclination angle is a second angle. In a case where the inclination angle formed when a cold end of the pulse tube faces vertically downward is defined as zero degrees and the inclination angle formed when the cold end of the pulse tube faces vertically upward is defined as 180 degrees, the second angle is larger than the first angle.

TERMINAL STRUCTURE FOR CONDUCTION COOLING HIGH TEMPERATURE SUPERCONDUCTING CABLE

The present application discloses a terminal structure for conduction cooling high temperature superconducting cable, comprising: a cable terminal body; a terminal thermal insulation shell, in which a vacuum thermal insulation cavity is formed, and the cable terminal body being arranged in the vacuum thermal insulation cavity; a refrigeration mechanism comprising a refrigeration output part extending into the vacuum thermal insulation cavity, and the refrigeration output part being connected to the cable terminal body through a cooling-conducting structure. The terminal structure provided by the present application cools the high-temperature superconducting cable by means of conduction cooling of a refrigerator without operations of low-temperature liquid transportation and supplementary, and can operate for a long time without regular maintenance, reduce the heat leakage of the cable terminal, improve the utilization efficiency of the cooling capacity of the refrigerator, and effectively ensure the stable operation of the cable for a long time.