A substrate processing apparatus according to an exemplary embodiment to the present disclosure includes: a main body which has therein a processing space capable of accommodating the substrate; a holding unit which holds the substrate in the main body; a supply unit which is provided at a side of the substrate held by the holding unit and supplies the processing fluid into the processing space; a discharge unit which discharges the processing fluid from an inside of the processing space; and a flow path limiting unit which limits a lower end of a flow path at an upstream side which is formed while the processing fluid flows from the supply unit to the discharge unit. Further, an upper end of the flow path limiting unit is disposed at a position higher than the upper surface of the substrate held by the holding unit.

An apparatus for treating a substrate includes a drying chamber that performs a drying process on the substrate having an organic solvent remaining on an upper surface thereof, a bake chamber that heats the substrate subjected to the drying process, and a transfer assembly that transfers the substrate between the drying chamber and the bake chamber.

A dual tumble dryer unit that includes a housing that defines an interior, a divider that extends between first and second side walls and divides the interior into first and second sections, and first and second dryer assemblies that are positioned in the first and second sections. The first and second dryer assemblies each include a basket positioned to rotate about a horizontal axis, and a blower disposed positioned to blow air on the basket. A first drying path is defined between a first entry opening defined in the first side wall, the first basket and a first exit opening defined in the second side wall, and a second drying path is defined between a second entry opening defined in the first side wall, the second basket and a second exit opening defined in the second side wall.

A dual tumble dryer unit that includes a housing that defines an interior, a divider that extends between first and second side walls and divides the interior into first and second sections, and first and second dryer assemblies that are positioned in the first and second sections. The first and second dryer assemblies each include a basket positioned to rotate about a horizontal axis, and a blower disposed positioned to blow air on the basket. A first drying path is defined between a first entry opening defined in the first side wall, the first basket and a first exit opening defined in the second side wall, and a second drying path is defined between a second entry opening defined in the first side wall, the second basket and a second exit opening defined in the second side wall.

A wafer drying equipment includes a base, a casing and an electrostatic generator. The base is configured to support a wafer. The casing has an inner wall. The inner wall defines a chamber. The chamber is configured to accommodate the wafer. The electrostatic generator is electrically connected to the casing and is configured to generate an electrostatic charge to the inner wall.

A wafer drying equipment includes a base, a casing and an electrostatic generator. The base is configured to support a wafer. The casing has an inner wall. The inner wall defines a chamber. The chamber is configured to accommodate the wafer. The electrostatic generator is electrically connected to the casing and is configured to generate an electrostatic charge to the inner wall.

In one respect, the invention is an improved valve block design having minimal or no deadlegs that improves the efficiency of a system purge process. In another respect, the invention is a system incorporating said improved valve block design.

In one respect, the invention is an improved valve block design having minimal or no deadlegs that improves the efficiency of a system purge process. In another respect, the invention is a system incorporating said improved valve block design.

My desiccator comprises a plurality of chambers in series communication with each other so a desiccating gas flows from one chamber into an adjacent chamber. A desiccating purge gas is introduced through an inlet into the desiccator's chambers at a predetermined flow rate, and a one-way bleed valve allows gas within the chambers to constantly flow from the desiccator while maintaining a positive pressure within the desiccator. A fan that constantly mixes and circulates the gas between the chambers as the desiccating purge gas is introduced into the desiccator, constantly diluting the gas within the chambers with a fresh supply of the desiccating gas. My method employs my desiccator to store items, wherein a dry, pressurized desiccating gas is introduced into the desiccator's chambers in a manner that constantly circulates the gas between the chambers as gas is slowly bled from the chambers, constantly diluting the gas within the chambers with a fresh supply of the desiccating gas. In my method the dew point of the desiccating gas is from 20 to 90 F. , the pressure of the desiccating gas is from 30 to 120 psi, and the average flow rate of the desiccating gas into the desiccator is from 0.25 to 4.0 cubic feet per minute.

My desiccator comprises a plurality of chambers in series communication with each other so a desiccating gas flows from one chamber into an adjacent chamber. A desiccating purge gas is introduced through an inlet into the desiccator's chambers at a predetermined flow rate, and a one-way bleed valve allows gas within the chambers to constantly flow from the desiccator while maintaining a positive pressure within the desiccator. A fan that constantly mixes and circulates the gas between the chambers as the desiccating purge gas is introduced into the desiccator, constantly diluting the gas within the chambers with a fresh supply of the desiccating gas. My method employs my desiccator to store items, wherein a dry, pressurized desiccating gas is introduced into the desiccator's chambers in a manner that constantly circulates the gas between the chambers as gas is slowly bled from the chambers, constantly diluting the gas within the chambers with a fresh supply of the desiccating gas. In my method the dew point of the desiccating gas is from 20 to 90 F. , the pressure of the desiccating gas is from 30 to 120 psi, and the average flow rate of the desiccating gas into the desiccator is from 0.25 to 4.0 cubic feet per minute.