A method for cleaning a substrate includes the following: exposing the substrate to a cleaning agent to remove impurities on a surface of the substrate; exposing the substrate to a dewetting chemical agent in a liquid phase to remove the cleaning agent on the surface of the substrate; solidifying the dewetting chemical agent in the liquid phase remaining on the surface of the substrate to obtain the dewetting chemical agent in a solid phase; and sublimating and removing the dewetting chemical agent in the solid phase.

The present invention provides a method for treating a substrate. The method for treating a substrate comprises: treating the substrate with liquid; and drying the liquid-treated substrate, and the liquid treatment step includes: a first liquid supply step of supplying a first liquid to an upper surface of the rotating substrate; and a second liquid supply step of supplying a second liquid to an upper surface of the rotating substrate, and in the second liquid supply step, a rotation speed of the substrate is adjusted such that the second liquid supplied on the substrate flows from a central region of the substrate to an edge region of the substrate.

A substrate processing method of the invention includes: a first step of introducing a processing fluid in a gas phase into a chamber housing a substrate; a second step of changing the processing fluid in the chamber from the gas phase to a supercritical state without intervention of a liquid phase; a third step of changing the processing fluid in the chamber from the supercritical state to a liquid phase; a fourth step of changing the processing fluid in the chamber from the liquid phase to a supercritical state; and a fifth step of changing the processing fluid in the chamber from the supercritical state to a gas phase without intervention of a liquid phase and discharging the processing fluid from the chamber.

Devices and methods related to drying absorbent articles with water reactive materials are generally described.

Wafers on a first wafer carrier in a tank are lifted from the first wafer carrier and a bath in the tank so as to accomplish Marangoni drying of the wafers. The lifted dry wafers are positioned on a second wafer carrier in a chamber and shifted to an offset position. A barrier, which can be a wall of the chamber with or without a sweeping flow of gas, impedes the passage of deposits to the wafers arising during drying of the first wafer carrier. Static electricity can be discharged from wafer supports in the offset position.

Wafers on a first wafer carrier in a tank are lifted from the first wafer carrier and a bath in the tank so as to accomplish Marangoni drying of the wafers. The lifted dry wafers are positioned on a second wafer carrier in a chamber and shifted to an offset position. A barrier, which can be a wall of the chamber with or without a sweeping flow of gas, impedes the passage of deposits to the wafers arising during drying of the first wafer carrier. Static electricity can be discharged from wafer supports in the offset position.

In one respect, the invention is an improved valve block design having minimal or no deadlegs that improves the efficiency of a system purge process. In another respect, the invention is a system incorporating said improved valve block design.

In one respect, the invention is an improved valve block design having minimal or no deadlegs that improves the efficiency of a system purge process. In another respect, the invention is a system incorporating said improved valve block design.

Disclosed herein are devices systems and methods for removing moisture from a material via radio frequency electromagnetic wave exposure. A moisture-removal system can include having spaced apart a first and a second electrical conductor extending along a same first direction, each of the first and second electrical conductor comprising opposing broad top and bottom sides, the broad bottom side of the first electrical conductor facing the broad top side of the second electrical conductor. The system includes a material containing moisture at least partially filling the space between the first and the second electrical conductor. The system further includes at least one first wire attached to a first radio frequency generator and to the first end of the first electrical conductor. The system also includes at least one second wire attached to the electrical ground of the first radio frequency generator to the first end of the second electrical conductor.

Disclosed herein are devices systems and methods for removing moisture from a material via radio frequency electromagnetic wave exposure. A moisture-removal system can include having spaced apart a first and a second electrical conductor extending along a same first direction, each of the first and second electrical conductor comprising opposing broad top and bottom sides, the broad bottom side of the first electrical conductor facing the broad top side of the second electrical conductor. The system includes a material containing moisture at least partially filling the space between the first and the second electrical conductor. The system further includes at least one first wire attached to a first radio frequency generator and to the first end of the first electrical conductor. The system also includes at least one second wire attached to the electrical ground of the first radio frequency generator to the first end of the second electrical conductor.