A vertical batch furnace assembly for processing wafers comprising a cassette handling space, a wafer handling space, and an internal wall separating the cassette handling space and the wafer handling space. The cassette handling space is provided with a cassette storage configured to store a plurality of wafer cassettes provided with a plurality of wafers. The cassette handling space is also provided with a cassette handler configured to transfer wafer cassettes between the cassette storage and a wafer transfer position. The wafer handling space is provided with a wafer handler configured to transfer wafers between a wafer cassette in the wafer transfer position and a wafer boat in a wafer boat transfer position. The internal wall is provided with a wafer transfer opening adjacent the wafer transfer position for a wafer cassette from or to which wafers are to be transferred. The cassette storage comprises two cassette storage carousels.

A vertical batch furnace assembly for processing wafers comprising a cassette handling space, a wafer handling space, and an internal wall separating the cassette handling space and the wafer handling space. The cassette handling space is provided with a cassette storage configured to store a plurality of wafer cassettes. The cassette handling space is also provided with a cassette handler configured to transfer wafer cassettes between the cassette storage and a wafer transfer position. The wafer handling space is provided with a wafer handler configured to transfer wafers between a wafer cassette in the wafer transfer position and a wafer boat. The internal wall is provided with a wafer transfer opening adjacent the wafer transfer position for a wafer cassette from or to which wafers are to be transferred. The cassette storage comprises a cassette storage carousel with a diameter between 1.1 and 1.6 meter.

There is provided a technique that includes a substrate support including a support column made of metal and a plurality of supports installed at the support column and configured to support a plurality of substrates in multiple stages; a process chamber configured to accommodate the plurality of substrates supported by the substrate support; and a heater configured to heat the plurality of substrates accommodated in the process chamber, wherein the plurality of supports includes at least a contact portion configured to make contact with the plurality of substrates and made of at least one selected from the group of a metal oxide and a non-metal material.

A vertical batch furnace assembly for processing wafers comprising a cassette handling space, a wafer handling space, and a first wall separating the cassette handling space from the wafer handling space. The wall having a wafer transfer opening. The wafer transfer opening is associated with a cassette carrousel comprising a carrousel stage having a plurality of cassette support surfaces each configured for supporting a wafer cassette. The carrousel stage is rotatable by an actuator around a substantially vertical axis to transfer each cassette support surface to a wafer transfer position in front of the wafer transfer opening and to at least one cassette load/retrieve position, wherein the vertical batch furnace assembly is configured to load or retrieve a wafer cassette on or from a cassette support surface of the carousel stage which is in the at least one load/retrieve position.

The present application discloses a diffusion furnace, including: a furnace tube structure including a furnace tube body and a furnace bottom, a bottom of the furnace tube body being connected to the furnace bottom to form a reaction chamber; and a carrying structure including a pedestal and a plurality of cassettes disposed on the pedestal, the pedestal being disposed on the furnace bottom. By disposing the plurality of the cassettes, a height of the furnace tube body can be decreased and a width of the furnace tube body can be increased, thus enlarging a space of equipment repair and maintenance, which is favorable for the repair and maintenance of the equipment.

An apparatus for heat-treating a substrate includes: a stage where the substrate is disposed; a heating part configured to change an output; a first temperature measurement part configured to measure a temperature at which the substrate is heated; a second temperature measurement part configured to measure the temperature, and having a level of measurement accuracy which is lower than that of the first temperature measurement part in a first temperature region and is higher than that of the first temperature measurement part in a second temperature region; a temperature calculator configured to calculate a weighted average temperature of the temperatures measured by the first and second temperature measurement parts if a reference temperature is in a temperature range between the first and second temperatures, and configured to change a weight of the weighted average temperature; and a controller configured to control the output based on the weighted average temperature.

A method of manufacturing a permanent magnet comprises a solution heat treatment. The solution heat treatment includes: performing a heat treatment at a temperature T.sub.ST; placing a cooling member including a first layer and a second layer on the first layer between the heater and the treatment object so that the first layer faces the treatment object; and transferring the treatment object together with the cooling member to the outside of a heating chamber, and cooling the treatment object until a temperature of the treatment object becomes a temperature lower than a temperature T.sub.ST200 C. In the step of cooling the treatment object, a cooling rate until the temperature of the treatment object becomes the temperature T.sub.ST200 C. is 5 C./s or more.

A furnace (2) has at least one furnace chamber (20) delimited by a wall (25); at least one opening (5) is provided in the wall (25). The opening is provided with at least one nozzle (50), configured to generate a sealing air flow. A glass semi-finished product (4) can be introduced into the furnace chamber.

A heat treatment apparatus for heating, in a treatment container, a substrate on which a coating film is formed, the heat treatment apparatus includes: a mount provided in the treatment container and configured to mount the substrate thereon; a heating part configured to heat the substrate mounted on the mount; a suction pipe leading to a suction port formed in the mount, penetrating the mount, and extending directly downward; and a collection container provided on a suction path between the suction pipe and a suction mechanism, wherein the collection container is provided directly below the mount in plan view and connected to the suction pipe to collect a sublimate in the treatment container.

The present invention provides an automated system (100) for performing a cooling curve analysis for a plurality of quenchants wherein the system (100) comprises a quench probe (101) which is heated up to a maximum pre-defined temperature by an electric resistance furnace (102). Further, the quench probe (101) is automatically transferred and inserted into a quench vessel (107) after being heated to a maximum pre-defined temperature. The quench probe (101) is retained in the quench vessel (107) till the temperature of the quench probe (101) gradually decreases to a pre-defined minimum temperature as indicated by a Universal Serial Bus (USB) data logger (106) which logs the temperature of the quench probe (101) and indicates a graphical representation of the cooling curve analysis through the process automation tool installed on a computer hardware device.