A plurality of substrate support parts provided on a susceptor each have an outer circumferential surface such that a plane parallel to a holding surface of a holding plate is formed on a top portion of a spherical surface. Even if a semiconductor wafer irradiated with flash light abruptly warps such that its front surface becomes raised, a back surface of the semiconductor wafer can smoothly rub against the plurality of substrate support parts. This can prevent chipping and breakage of the substrate support parts, and can also prevent scratches on the back surface of the semiconductor wafer. The substrate support parts having the outer circumferential surface of the above-mentioned shape can be located in any directions on the holding plate, thereby facilitating manufacturing, inspection, and management of the susceptor relating to the substrate support parts.

A sintering apparatus is provided. The sintering apparatus includes a case having an internal space formed therein and including a door provided in a front portion thereof to open and close the internal space, a magnetron coupled to the case and oscillating microwaves toward the internal space, a heat insulating unit disposed in the internal space to form a chamber space and blocking transmission of heat of the chamber space to the internal space, a susceptor unit disposed in the chamber space and having a sintering space in which a to-be-sintered material is accommodated, and a cooling unit cooling at least one of the case or the chamber space.

A sintering apparatus is provided. The sintering apparatus includes a case having an internal space formed therein and including a door provided in a front portion thereof to open and close the internal space, a magnetron coupled to the case and oscillating microwaves toward the internal space, a heat insulating unit disposed in the internal space to form a chamber space and blocking transmission of heat of the chamber space to the internal space, a susceptor unit disposed in the chamber space and having a sintering space in which a to-be-sintered material is accommodated, and a cooling unit cooling at least one of the case or the chamber space.

An electric cooker capable of changing between a high-pressure mode and a non-pressure mode and cooking a menu corresponding to the changed mode. The electric cooker includes a main body having an accommodation space therein to receive an inner pot, a lid coupled to the upper portion of the main body to be opened and closed, a pressure conversion part for selecting a high-pressure mode and a non-pressure mode by opening and closing a plurality of discharge paths configured to pass through and to block the gap between the inside of the inner pot and the outside of the lid, a sensor for sensing the high-pressure mode or the non-pressure mode selected by the pressure conversion part, and a controller for determining the pressure mode based on the sensing signal from the sensor among the pressure modes at least including the high-pressure mode and the non-pressure mode.

An electric cooker capable of changing between a high-pressure mode and a non-pressure mode and cooking a menu corresponding to the changed mode. The electric cooker includes a main body having an accommodation space therein to receive an inner pot, a lid coupled to the upper portion of the main body to be opened and closed, a pressure conversion part for selecting a high-pressure mode and a non-pressure mode by opening and closing a plurality of discharge paths configured to pass through and to block the gap between the inside of the inner pot and the outside of the lid, a sensor for sensing the high-pressure mode or the non-pressure mode selected by the pressure conversion part, and a controller for determining the pressure mode based on the sensing signal from the sensor among the pressure modes at least including the high-pressure mode and the non-pressure mode.

Provided is a semiconductor substrate manufacturing device which is capable of uniformly heating the surface of a semiconductor substrate that has a relatively large diameter or major axis. The semiconductor substrate manufacturing device includes a container body for accommodating a semiconductor substrate and a heating furnace that has a heating chamber which accommodates the container body, and the heating furnace has a heating source in a direction intersecting the semiconductor substrate to be disposed inside the heating chamber.

Provided is a semiconductor substrate manufacturing device which is capable of uniformly heating the surface of a semiconductor substrate that has a relatively large diameter or major axis. The semiconductor substrate manufacturing device includes a container body for accommodating a semiconductor substrate and a heating furnace that has a heating chamber which accommodates the container body, and the heating furnace has a heating source in a direction intersecting the semiconductor substrate to be disposed inside the heating chamber.

A system for making oxide material may comprise a preheating cyclone stage for receiving a solid carbonate material and operating at a temperature less than a calcination temperature of the solid carbonate material, a calcination cyclone stage for heating the preheated solid carbonate material and operating at a temperature of at least the calcination temperature to convert the preheated solid carbonate material to a solid oxide material and carbon dioxide gas, a cooling cyclone stage for cooling the solid oxide material and operating at a temperature less than the calcination temperature to cool the solid oxide material to ambient temperature, a first recirculating system to extract and recirculate a first gas from an outlet of the calcination cyclone stage to an inlet of the calcination cyclone stage zone, and a second recirculating system to extract and recirculate a second gas from the cooling cyclone stage to the preheating cyclone stage.

A receiver is formed as the physical inverse or relief of at least a portion of a machined part or casting. The receiver has accommodations for sensor systems that monitor the temperature of the part during a radiant heating process which is placed on top of the casting receiver to move through the radiant heating process.

A receiver is formed as the physical inverse or relief of at least a portion of a machined part or casting. The receiver has accommodations for sensor systems that monitor the temperature of the part during a radiant heating process which is placed on top of the casting receiver to move through the radiant heating process.