The present invention provides a power supply device and a power supply method for a DC electric arc furnace, wherein the power supply device comprises phase-shifting rectifier transformers, rectifying units and a regulator; through a structural design of a plurality of branches and a plurality of rectifying units at an output end of each phase-shifting rectifier transformer, and a structural design that outputs of the plurality of rectifying units are connected in parallel and then connected to a power supply short network of a DC electric arc furnace through bus bars, a current output topological structure is formed, which can provide a stable large current for one electrode assembly, and a plurality of current output topological structures can supply power to a plurality of electrode assemblies, so that requirement of a larger power supply current of the DC electric arc furnace can be satisfied; positions of top electrodes are judged and adjusted by the regulator according to real-time working parameters, which ensures that a lifting mechanism of the top electrodes can steadily perform the function of stabilizing arc burning for a long time; at the same time, output voltages and output currents of the rectifying units are adjusted by the regulator according to feedback of the real-time working parameters, so as to provide stable electric energy for the DC electric arc furnace.

An electric kettle may include a body formed by an outer body and an inner body having a cylindrical shape and an open upper surface and an open lower surface, a heat insulation space being formed between the outer body and the inner body, a lid configured to open or close the open upper surface of the body, a heating module configured to partition an inside of the inner body vertically and heat fluid, such as water inside of the inner body, a mounting portion which is formed on an inner surface of the inner body and on which the heating module is mounted, and a base on which a lower surface of the body is seated and which transfers power applied from outside to the heating module when the body is seated. The heating module may include a heating plate inserted through the open lower surface of the inner body and coupled to the mounting portion to form a bottom surface of the inner body, and a heater provided on a lower surface of the heating plate to generate heat.

A plurality of flash lamps are disposed on an upper side of a chamber housing a semiconductor wafer and a plurality of LED lamps are disposed on a lower side thereof. A surface of a semiconductor wafer preheated by light irradiation from a plurality of LED lamps is irradiated with a flash of light from a flash lamp. The LED lamps emit light having a wavelength of 900 nm or less. The light radiated from the LED lamps passes through a quartz lower chamber window, and then emitted to the semiconductor wafer. The light with the wavelength of 900 nm or less radiated from the LED lamps is also favorably absorbed by the semiconductor wafer in a low temperature range of 500° C. or less, and is hardly absorbed by the quartz lower chamber window. Thus, the semiconductor wafer can be efficiently heated by the LED lamps.

A plurality of flash lamps are disposed on an upper side of a chamber housing a semiconductor wafer and a plurality of LED lamps are disposed on a lower side thereof. A surface of a semiconductor wafer preheated by light irradiation from a plurality of LED lamps is irradiated with a flash of light from a flash lamp. The LED lamps emit light having a wavelength of 900 nm or less. The light radiated from the LED lamps passes through a quartz lower chamber window, and then emitted to the semiconductor wafer. The light with the wavelength of 900 nm or less radiated from the LED lamps is also favorably absorbed by the semiconductor wafer in a low temperature range of 500° C. or less, and is hardly absorbed by the quartz lower chamber window. Thus, the semiconductor wafer can be efficiently heated by the LED lamps.

A receiver is formed as the physical inverse or relief of at least a portion of a machined part or casting. The receiver has accommodations for sensor systems that monitor the temperature of the part during a radiant heating process which is placed on top of the casting receiver to move through the radiant heating process.

A receiver is formed as the physical inverse or relief of at least a portion of a machined part or casting. The receiver has accommodations for sensor systems that monitor the temperature of the part during a radiant heating process which is placed on top of the casting receiver to move through the radiant heating process.

The invention relates to a tube furnace device for an atomizing furnace and to an analyzing apparatus comprising an atomizing furnace and a tube furnace device, in particular for atomic absorption spectrometry, the tube furnace device comprising a sample carrier means (11) and a bearing means (12) for supporting and forming electrical contact with the sample carrier means, the sample carrier means having a receiving tube (16) forming a tubular receiving space (17) for receiving an analyte, the sample carrier means having two bearing protrusions on the receiving tube for forming a connection with the bearing means, the bearing protrusions extending perpendicularly, preferably orthogonally, in relation to a longitudinal axis of the receiving tube, wherein the tube furnace device has a contact pressure means (13) via which a contact pressure force (14) can be exerted on the bearing protrusions in the direction of a passant line (20) in relation to a circular cross section (21) of the receiving tube.

Method for cooling a heating element of an electric heater in a thermal process cycle comprising the steps of cooling the heating element at a first cooling rate from a first temperature to a second temperature and cooling the heating element at a second cooling rate from the second temperature to a third temperature, wherein the second cooling rate is faster than the first cooling rate.

Method for cooling a heating element of an electric heater in a thermal process cycle comprising the steps of cooling the heating element at a first cooling rate from a first temperature to a second temperature and cooling the heating element at a second cooling rate from the second temperature to a third temperature, wherein the second cooling rate is faster than the first cooling rate.

Embodiments of the disclosure provide a system including: an enclosure having an interior sized to enclose and the workpiece and form a vacuum and pressurized atmosphere within the interior. A plurality of thermal applicators may be in thermal communication with first and second portions of the interior. First and second thermal applicators may independently heat and cool the first and second portions of the interior. The first thermal applicator may apply a first thermal treatment to a first portion of the workpiece in the first portion of the interior. A second thermal applicator may apply a second thermal treatment to a second portion of the workpiece in the second portion of the interior independently of the first thermal treatment.