Patent classifications
F28C3/00
SHAPE MEMORY MATERIAL BASED THERMAL COUPLER/DECOUPLER AND METHOD
A thermal interface is provided. The thermal interface includes a shape memory material and a thermally-conductive material. The thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface. The compressed thermal interface is configured to partially fill a thermal gap between a first component and a second component. The expanded thermal interface is configured to substantially fill the thermal gap between the first and second components.
Orifice plate for controlling solids flow, methods of use thereof and articles comprising the same
Disclosed herein is an orifice plate comprising one or more plates having orifices disposed therein; the orifices being operative to permit the flow of solids from a moving bed heat exchanger to a solids flow control system; where the orifice plate is downstream of a tube bundle of the moving bed heat exchanger and upstream of the solids flow control system and wherein the orifice plate is operative to evenly distribute the flow of solids in the solids flow control system.
Cooling device of an electrical storage system and method using the cooling device
The invention relates to a condenser (3) of a cooling device (2) of at least one battery element (103) of a motor vehicle, configured to liquefy a dielectric fluid deposited in the form of vapor at the surface of said condenser, characterized in that the condenser comprises at least one main wall (6) and a plurality of secondary walls projecting from the main wall and participating in forming a chamber for receiving one or more battery elements. The condenser comprises a cooling fluid circuit provided in the thickness of the main wall and at least one dielectric fluid circuit in liquid form provided in the thickness of at least one secondary wall, said electrical fluid circuit being equipped with at least one nozzle for projecting the dielectric fluid.
System for controlling temperature of a body
A system for controlling temperature of a body (6) comprising a DBD actuator (9) connectable to a power source to produce an ionic wind on the body; a control unit (8) to select an initial configuration and to control the power source (5) depending on a temperature difference (T) between an input temperature (T.sub.i) and a target temperature (T.sub.ta) on the body (6), wherein the initial configuration comprises the following constructive parameters of the DBD actuator: number, shape, geometry, relative position of electrodes (d), dielectric material, dielectric thickness (e), wherein the initial configuration further comprises the following setting parameters to be set in the power source (5): a frequency value (f), an amplitude value (V), a waveform signal and a duty cycle, wherein the control unit (8) adjusts the initial configuration by modifying any of the setting parameters to control the heat transferred to the surface of the body.
POWER GENERATION SYSTEM
A power generation system may be used to cool a heat dissipation device based on immersion in a refrigerant such that bubbles are generated at a heat dissipation device surface of the heat dissipation device in the refrigerant. The power generation system includes a turbine, a connector, and a converter. The turbine includes a turbine shaft and turbine blades connected thereto. The connector connects the turbine and the heat dissipation device to position the turbine shaft to extend parallel to gravity and position the turbine in the refrigerant above at least a portion of the heat dissipation device surface in a vertical direction, to configure the turbine to rotate based on an action of rising pressure exerted by the bubbles rising from the heat dissipation device surface to impinge on the turbine blades. The converter is configured to convert kinetic energy of the turbine into electrical energy.
Extendable conductor for thermal management
A conductor of the extendable conductor assembly may be extended (e.g., into a thermal target, such as a preexisting or a newly created feature of a planetary body) and used to thermally couple a rover, vehicle, fixed installation, or other hardware with the thermal target. Thus, the temperature of the hardware may be managed via heat transfer to/from the thermal target. For instance, heat may be transferred from the thermal target to maintain the temperature of the hardware under cold conditions, while excess heat may be transferred to the thermal target under hot conditions. A rover forms a borehole in the lunar surface, in which a conductor is extended to facilitate heat transfer between the rover and the Moon accordingly.
APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR WAFER
The present disclosure describes a cleaning system using a cleaning liquid generated by a cooling system. and a second flow rate of the second liquid coolant based on a temperature of the second die. The cleaning system includes a cooling system configured to generate a cleaning liquid, a controller configured to control a temperature of the cleaning liquid, a wafer holder configured to hold and rotate a wafer, a first nozzle above the wafer and configured to spray the cleaning liquid on a top surface of the wafer, and a second nozzle below the wafer and configured to spray the cleaning liquid on a bottom surface of the wafer.
APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR WAFER
The present disclosure describes a cleaning system using a cleaning liquid generated by a cooling system. and a second flow rate of the second liquid coolant based on a temperature of the second die. The cleaning system includes a cooling system configured to generate a cleaning liquid, a controller configured to control a temperature of the cleaning liquid, a wafer holder configured to hold and rotate a wafer, a first nozzle above the wafer and configured to spray the cleaning liquid on a top surface of the wafer, and a second nozzle below the wafer and configured to spray the cleaning liquid on a bottom surface of the wafer.