A mesh panel for a heat exchanger system is provided. The mesh panel comprises a mesh body extending from an upper end to a lower end, the mesh body having an inlet side and an outlet side opposite the inlet side. The mesh body comprises a plurality of mesh wires arranged to form a mesh pattern defining a plurality of mesh openings between the mesh wires, and at least one penetrating mesh portion extending at least partly along a depth direction of the mesh body, the depth direction being normal to a plane extending between the upper and lower ends of the mesh body, the at least one penetrating mesh portion at least partly defining an air flow opening, the air flow opening having greater dimensions than each of the mesh openings.

Disclosed is a flash closed heat exchanger, comprising a closed housing. A negative pressure fan is provided on the closed housing. A negative pressure environment is formed inside the closed housing by means of the negative pressure fan. A water atomization device is provided inside the closed housing. The water atomization device sprays atomized water into the inside of the closed housing, so that the atomized water evaporates into steam in the negative pressure environment. In the flash closed heat exchanger of the present invention, the evaporation of atomized water is promoted in a closed negative pressure environment, so that the overall temperature in the closed environment is reduced to achieve a refrigeration effect, without being affected by the temperature and humidity of the natural wind outside; the installed capacity of the equipment is small, and the space occupied is small; no heat is discharged into the atmosphere during a refrigeration process, no heat island effect is achieved, the refrigeration efficiency is high, and the effect is stable and reliable.

The present disclosure relates to an air handling system which has a fan supply section for intaking warm air from a room environment, and first and second indirect evaporative cooling subsystems (IDECs) spaced apart from one another to form an air plenum and a hot aisle in communication with the air plenum. The air plenum and the hot aisle are both formed between the IDECs, with the air plenum communicating with the fan supply section to receive the warm air. The IDECs receive the warm air and cool the warm air to produce first and second cooled airflows. The system also includes spaced apart cold aisles adjacent each of the IDECs for channeling the cooled airflows into an evaporator section. The evaporator section produces a final cooled airflow which is directed back into the room environment.

The present disclosure relates to an air handling system which has a fan supply section for intaking warm air from a room environment, and first and second indirect evaporative cooling subsystems (IDECs) spaced apart from one another to form an air plenum and a hot aisle in communication with the air plenum. The air plenum and the hot aisle are both formed between the IDECs, with the air plenum communicating with the fan supply section to receive the warm air. The IDECs receive the warm air and cool the warm air to produce first and second cooled airflows. The system also includes spaced apart cold aisles adjacent each of the IDECs for channeling the cooled airflows into an evaporator section. The evaporator section produces a final cooled airflow which is directed back into the room environment.

An air conditioner includes an airflow path configured to direct an airflow in a direction. The air conditioner also includes an evaporative cooling membrane panel disposed within the air flow path and including a face disposed at an oblique angle relative to the direction. The face is defined by microporous fibers of the evaporative cooling membrane panel. Each microporous fiber is configured to receive liquid in a fluid flow path of the microporous fiber such that the air flow over the microporous fiber generates a vapor. Each microporous fiber is also configured to release the vapor into the air flow via pores of the microporous fiber.

An air transfer apparatus being made as a monolithic or an integral structure or enclosure. The air transfer apparatus is made from a non-porous material and is made from any of the manufacturing methods of molding, injection molding, gas assisted injection molding, liquid/water assisted injection molding, blow molding, extruding, electrofusion or 3-D printing. The air transfer apparatus can be any of a cooling tower, a swamp cooler or a cooling Indirect Direct Evaporative Cooler. The air transfer apparatus has at least one integral cavity manufactured therein and at least one heat exchanger pad can be attached to the air transfer apparatus or made integral with the air transfer apparatus.

An air transfer apparatus being an integral or a monolithic structure or enclosure including an integral cavity and other cavities formed from a single piece of material. The integrated cavity includes a plurality of individual dividers forming a plurality of integral segmented cavities where pumps and motors are installed, and a controller which controls the operation of the pump motor such as turns on and off the pump motor and adjusts the speed of the pump motor. The air transfer apparatus is adapted to have at least one heat exchanger pad installed in at least of the sides of the walls and at least one fan installed in the air transfer apparatus.

A water redistribution system for adiabatically pre-cooled dry coolers having stacked adiabatic panels, the water redistribution system located between upper and lower adiabatic panels and having a plurality of alternating baffles arranged to reduce water free-fall height and resultant splashing. Upwardly turned flanges at the top of each baffle inhibit the travel of water out of the interior water channel.

A current stabilization and pressure boosting device for evaporator is disclosed, comprising a heat-sinking module and an outer case, wherein the heat-sinking module is assembled by successively stacking a large number of heat-sinking components, with each of the heat-sinking components having a first board surface, a second board surface and a third board surface, so that the insides of such heat-sinking components form a semi-open inner flow channel, and a fourth board surface is further respectively provided at the two ends of the heat-sinking components opposite to the inner flow channel, and the heat-sinking module is respectively configured with a water injection channel and an air exhausting channel, and the heat-sinking module is installed inside the outer case and the outer lid.

A current stabilization and pressure boosting device for evaporator is disclosed, comprising a heat-sinking module and an outer case, wherein the heat-sinking module is assembled by successively stacking a large number of heat-sinking components, with each of the heat-sinking components having a first board surface, a second board surface and a third board surface, so that the insides of such heat-sinking components form a semi-open inner flow channel, and a fourth board surface is further respectively provided at the two ends of the heat-sinking components opposite to the inner flow channel, and the heat-sinking module is respectively configured with a water injection channel and an air exhausting channel, and the heat-sinking module is installed inside the outer case and the outer lid.