A heat dissipating structure and a water-cooling heat dissipating apparatus including the structure are disclosed. The heat dissipating structure includes a vapor chamber, plural heat pipes and a heat dissipating member, and the vapor chamber has a hollow slot penetrating through the vapor chamber, and the vapor chamber also has a cavity. Each heat pipe is vertically installed to the vapor chamber and communicated with the cavity. The heat dissipating member includes a substrate and plural fins integrally extended from the substrate and seals the hollow slot by a substrate, so as to improve the thermal conduction and dissipation of the heat dissipating structure and the water-cooling heat dissipating apparatus.

A heat dissipating structure and a water-cooling heat dissipating apparatus including the structure are disclosed. The heat dissipating structure includes a vapor chamber, plural heat pipes and a heat dissipating member, and the vapor chamber has a hollow slot penetrating through the vapor chamber, and the vapor chamber also has a cavity. Each heat pipe is vertically installed to the vapor chamber and communicated with the cavity. The heat dissipating member includes a substrate and plural fins integrally extended from the substrate and seals the hollow slot by a substrate, so as to improve the thermal conduction and dissipation of the heat dissipating structure and the water-cooling heat dissipating apparatus.

A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

In one example, a portion of a shell includes a shell wall portion that has an interior wall portion and an exterior wall portion located near the interior wall portion. In addition, fluid passageways are disposed between the interior wall portion and the exterior wall portion. One or more of the fluid passageways are defined in part by one or both of the interior wall portion and the exterior wall portion. The fluid passageways form part of heat exchanger that is integrated in the shell.

In one example, a portion of a shell includes a shell wall portion that has an interior wall portion and an exterior wall portion located near the interior wall portion. In addition, fluid passageways are disposed between the interior wall portion and the exterior wall portion. One or more of the fluid passageways are defined in part by one or both of the interior wall portion and the exterior wall portion. The fluid passageways form part of heat exchanger that is integrated in the shell.

A refrigerant heat dissipation apparatus has an evaporator, a condenser having a first condensing tube and a second condensing tube, a first refrigerant tube, two second refrigerant tubes, and a refrigerant. The first refrigerant tube is connected between the top of the evaporator and an upper part of a first condensing tube. The second refrigerant tubes are respectively connected with a lower part of the first condensing tube and a lower part of the second condensing tube, so as to form a multi-flow closed-loop cycle. The refrigerant is filled into the multi-flow closed-loop cycle. The controlling of cycling direction of the refrigerant achieves the efficiency in heat dissipating of the refrigerant heat dissipation apparatus.

A cooling device for flat pieces and a method including a first cooling element with a first contact surface with the flat piece and a second cooling element with a second contact surface with the flat piece; wherein the first and second cooling element are located facing each other, defining a space between them to introduce the flat piece, and wherein the first cooling element includes a cooling circuit and second cooling element includes another cooling circuit, respectively, distributed evenly along the first and second contact surface with the flat piece through which a continuous flow of liquid coolant circulates. The flat piece is cooled until it reaches the desired temperature in order to then be removed and stored.

A cooling device for flat pieces and a method including a first cooling element with a first contact surface with the flat piece and a second cooling element with a second contact surface with the flat piece; wherein the first and second cooling element are located facing each other, defining a space between them to introduce the flat piece, and wherein the first cooling element includes a cooling circuit and second cooling element includes another cooling circuit, respectively, distributed evenly along the first and second contact surface with the flat piece through which a continuous flow of liquid coolant circulates. The flat piece is cooled until it reaches the desired temperature in order to then be removed and stored.

An air-over evaporative heat exchanger with multi-lobed or “peanut” shaped tubes replacing conventional round or elliptical tubes. The tubes have a narrow horizontal cross section and tall vertical cross section to allow the multiplication of surface area in the same coil volume while maintaining or increasing the open-air passage area. This configuration allows the coil to have an overall external heat transfer coefficient much higher than a conventional coil, while the tube shape allows the use of thinner material, reducing the weight and cost of the heat exchanger.