Embodiments described herein generally relate to a temperature control system in a substrate support assembly. In one embodiment, a substrate support assembly is disclosed. The substrate support assembly includes a support plate assembly The support plate assembly includes a first fluid supply manifold, a second fluid supply manifold, a first fluid return manifold, a second fluid return manifold, a plurality of first fluid passages, a plurality of second fluid passages, and a fluid supply conduit. The plurality of first fluid passages extend from the first fluid supply manifold to the first fluid return manifold. The plurality of second fluid passages extend from the second fluid supply manifold to the second fluid return manifold. The plurality of fluid passages extend across an upper surface of the support plate assembly in an alternating manner. The fluid supply conduit is configured to supply a fluid to the fluid supply manifolds.

Embodiments described herein generally relate to a temperature control system in a substrate support assembly. In one embodiment, a substrate support assembly is disclosed. The substrate support assembly includes a support plate assembly The support plate assembly includes a first fluid supply manifold, a second fluid supply manifold, a first fluid return manifold, a second fluid return manifold, a plurality of first fluid passages, a plurality of second fluid passages, and a fluid supply conduit. The plurality of first fluid passages extend from the first fluid supply manifold to the first fluid return manifold. The plurality of second fluid passages extend from the second fluid supply manifold to the second fluid return manifold. The plurality of fluid passages extend across an upper surface of the support plate assembly in an alternating manner. The fluid supply conduit is configured to supply a fluid to the fluid supply manifolds.

A kit for use with a recirculating cooling system includes a bag. The bag includes a first wall, a second wall opposite the first wall, and a side wall defining a reservoir configured to retain a fluid therein. A first port is defined through the first wall and a second port is defined through the side wall or the second wall. The bag is configured to maximize a temperature differential between a fluid proximate the first port and a fluid proximate the second port. Further, the bag is collapsible.

A kit for use with a recirculating cooling system includes a bag. The bag includes a first wall, a second wall opposite the first wall, and a side wall defining a reservoir configured to retain a fluid therein. A first port is defined through the first wall and a second port is defined through the side wall or the second wall. The bag is configured to maximize a temperature differential between a fluid proximate the first port and a fluid proximate the second port. Further, the bag is collapsible.

A hollow board cooling apparatus is for cooling a formed hollow board and includes first and second cooling devices, a coolant-circulating device, and a temperature-controlling unit. Each of the first and second cooling devices has a main body, a cooling channel extending through the main body to form inlet and outlet openings for passage of the hollow board, and a coolant channel formed in the main body. The coolant-circulating device introduces a coolant into the coolant channels via coolant inlets, and retrieves the coolant therefrom via coolant outlets. The temperature-controlling unit controls the coolant-circulating device to cool the coolant when the board temperature is higher than a reference temperature.

A cooling apparatus includes a cold plate including a lower surface to be in contact with a heat-radiating component, and a first coolant passage in which a coolant flows, a radiator including fins to perform cooling and pipes each defining a second coolant passage in communication with the first coolant passage, a pump to circulate the coolant, a first tank joined to one end of each of the pipes, and a second tank to join another end of each of the pipes to the pump. The radiator is provided on the cold plate, and the pump is adjacent to the second tank.

A capillary-driven heat transfer device is adapted to extract heat from a heat source and release this heat to a cold source using a two-phase working fluid. The device includes an evaporator having a microporous mass performing capillary pumping of fluid in the liquid phase, a condenser, a reservoir having an inner chamber and an inlet and/or outlet port, a vapor communication circuit, connecting the outlet of the evaporator to the inlet of the condenser, a liquid communication circuit, and a non-return device arranged between the inner chamber of the reservoir and the microporous mass of the evaporator, and arranged to prevent liquid present in the evaporator from moving to the inner chamber of the reservoir.

A computer cabinet includes at least one rackable server cooled by a cooling circuit; a cooling circuit supply device including: two cooling modules, each cooling module including: a primary hydraulic circuit; a secondary hydraulic circuit; a heat exchanger; a pump; a controller to control the pump; a central control unit connected to the controller of each of the cooling modules;
the central control unit being capable of activating one of the cooling modules while the other cooling module is inactive.

A liquid system for circulating a liquid through a circulation loop includes a liquid pump, a primary liquid reservoir and an auxiliary liquid reservoir. The liquid pump pressurizes liquid within the circulation loop. The primary liquid reservoir has a primary variable volume expandable to accommodate volumetric expansion of pressurized liquid up to a threshold volume. The auxiliary liquid reservoir has an auxiliary variable volume expandable only after the threshold volume is exceeded up to a maximum volume.

A temperature-controlled fluid forcing system includes a temperature control system generating a stream of flowing temperature-controlled fluid. A heat exchanger includes a thermally conductive housing within which a plurality of walls define a shaped flow space. The stream of temperature-controlled fluid flows through the shaped flow space and is in thermal communication with the housing. A thermally conductive probe is in thermal communication with the exterior of the housing of the heat exchanger, the thermally conductive probe comprising a thermally conductive protrusion in thermal communication with the exterior of the housing of the heat exchanger, such that, when the thermally conductive probe makes contact with a device under test (DUT), heat is conducted to or from DUT.