The present disclosure provides pumped thermal energy storage systems that can be used to store electrical energy. A pumped thermal energy storage system of the present disclosure can store energy by operating as a heat pump or refrigerator, whereby network input can be used to transfer heat from the cold side to the hot side. A working fluid of the system is capable of efficient heat exchange with heat storage fluids on a hot side of the system and on a cold side of the system. The system can extract energy by operating as a heat engine transferring heat from the hot side to the cold side, which can result in network output. Systems of the present disclosure can employ solar heating for improved storage efficiency.

The present disclosure provides pumped thermal energy storage systems that can be used to store electrical energy. A pumped thermal energy storage system of the present disclosure can store energy by operating as a heat pump or refrigerator, whereby network input can be used to transfer heat from the cold side to the hot side. A working fluid of the system is capable of efficient heat exchange with heat storage fluids on a hot side of the system and on a cold side of the system. The system can extract energy by operating as a heat engine transferring heat from the hot side to the cold side, which can result in network output. Systems of the present disclosure can employ solar heating for improved storage efficiency.

A space-saving, high-density modular data pod and a method of cooling a plurality of computer racks are disclosed. The modular data pod includes an enclosure including wall members contiguously joined to one another along at least one edge of each wall member in the shape of a polygon and a data pod covering member. Computer racks arranged within the enclosure form a first volume between the inner surface of the wall members and first sides of the computer racks. A second volume is formed of second sides of the computer racks. A computer rack covering member encloses the second volume and the data pod covering member form a third volume coupling the first volume to the second volume. An air circulator continuously circulates air through the first, second, and third volumes. The method includes circulating air between the first and second volumes via the third volume and the computer racks.

A space-saving, high-density modular data pod and a method of cooling a plurality of computer racks are disclosed. The modular data pod includes an enclosure including wall members contiguously joined to one another along at least one edge of each wall member in the shape of a polygon and a data pod covering member. Computer racks arranged within the enclosure form a first volume between the inner surface of the wall members and first sides of the computer racks. A second volume is formed of second sides of the computer racks. A computer rack covering member encloses the second volume and the data pod covering member form a third volume coupling the first volume to the second volume. An air circulator continuously circulates air through the first, second, and third volumes. The method includes circulating air between the first and second volumes via the third volume and the computer racks.

The disclosure provides a fluid-cooled heat sink having a heat transfer base, a shroud, and a plurality of heat transfer fins in thermal communication with the heat transfer base and the shroud, where the heat transfer base, heat transfer fins, and the shroud form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.

The disclosure provides a fluid-cooled heat sink having a heat transfer base, a shroud, and a plurality of heat transfer fins in thermal communication with the heat transfer base and the shroud, where the heat transfer base, heat transfer fins, and the shroud form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.

A vapor-chamber that includes a porous microstructure sheet with varying surface energy across different regions to optimize utilization of a working fluid. Modulating the surface energy of the porous microstructure sheet can minimize the amount of the working fluid that becomes trapped in the condenser region(s) and maximize an aggregate thin-film evaporation area of the working fluid in the evaporator region(s). The condenser region of the vapor-chamber is treated so that the internal surfaces have low surface energy. For example, the treatment may cause the condenser region to become hydrophobic to minimize the amount of fluid that becomes trapped in the condenser. The evaporator region is treated so that the internal surfaces have high surface energy. For example, the treatment may cause the evaporator region to become hydrophilic to induce the formation of large numbers of robust (e.g., dry-out resistant) thin-film evaporation sites.

A vapor chamber structure includes a main body having multiple internal independent chambers. A capillary structure is disposed in each of the independent chambers. A working fluid is contained in each of the independent chambers. The working fluids contained in the independent chambers have different physical or chemical properties. The independent chambers are respectively in contact with different heat sources with different properties to conduct the heat. Accordingly, one single vapor chamber structure can provide complex heat conduction effect for different heat sources.

Systems and methods for controlling conditions in an enclosed space, such as a data center, or for providing cooling to a device, can include using a Liquid-to-Air Membrane Energy Exchanger (LAMEE) as an evaporative cooler. The LAMEE or exchanger can cool water to the outdoor air wet bulb temperature in a cooling system disposed outside of the enclosed space or device. The reduced-temperature water can be delivered to the enclosed space or device or can cool a coolant that is delivered to the enclosed space or device. The air in the enclosed space, or one or more components in the enclosed space, can be cooled by delivering the reduced-temperature water or coolant to the enclosed space, rather than moving the supply air from the enclosed space to the cooling system. In an example, the cooling system can include one or more cooling coils, upstream or downstream of the LAMEE.

Systems and methods for controlling conditions in an enclosed space, such as a data center, or for providing cooling to a device, can include using a Liquid-to-Air Membrane Energy Exchanger (LAMEE) as an evaporative cooler. The LAMEE or exchanger can cool water to the outdoor air wet bulb temperature in a cooling system disposed outside of the enclosed space or device. The reduced-temperature water can be delivered to the enclosed space or device or can cool a coolant that is delivered to the enclosed space or device. The air in the enclosed space, or one or more components in the enclosed space, can be cooled by delivering the reduced-temperature water or coolant to the enclosed space, rather than moving the supply air from the enclosed space to the cooling system. In an example, the cooling system can include one or more cooling coils, upstream or downstream of the LAMEE.