Systems and methods of transmitting heat away from an ultrasound probe are disclosed within. In one embodiment, a handheld ultrasound probe includes a transducer, electronics configured to drive the transducer, and a housing surrounding the transducer assembly and the electronics. A slot extending from a first side of the housing to a second side of the housing and can allow air to pass adjacent transducer and the electronics. The slot can be sized to inhibit accessibility of an operator’s finger to an inner surface of slot.

A phase change thermal management device includes a casing, a plurality of inner walls and a phase change material. The casing defines an internal space. The inner walls are arranged in the internal space and crossed one another to form a plurality of accommodation cells. Two adjacent accommodation cells are communicated with each other through at least one opening on one of the inner walls. The phase change material is provided in at least portions of the accommodation cells.

Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container formed by stacking and joining together at least two etched sheet bodies formed as metal foil sheets. Particularly, etching or pressing is performed on the surface of the sheet bodies to join at least two sheet bodies such that fine concavities and convexities can be formed on the inner surface of the container and the sheet-type heat pipe with a sufficient heat transport capability can thus be obtained even when the sealed container is thinly formed with its thickness not larger than, e.g. 0.5 mm. More particularly, since the thickness of the container is thinly formed, the sheet-type heat pipe of the present invention can be effortlessly installed in a thin chassis of a mobile terminal.

A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation.

A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation.

A water-cooling device includes a pump case, at least one winding, a driver and a heat exchange member. The pump case has a top section, a bottom section and a peripheral section together defining a pump chamber. The winding is disposed on a circuit board. The circuit board is disposed on any of the top section, the bottom section and the peripheral section. The driver is disposed in the pump chamber. At least one magnetic member is disposed on the driver in a position corresponding to the winding, whereby the magnetic member can induce and magnetize the winding on the circuit board. The heat exchange member is connected with the pump case. By means of the structural design of the water-cooling device, the volume of the water-cooling device is greatly minified and the structure of the water-cooling device is thinned.

The present invention relates to a water cooling device which comprises a liquid storing shell body having a liquid chamber and a pump having a stator and a rotor. The stator has a coil set disposed electrically on a circuit board. The circuit board and the coil set thereon are both disposed on at least one inner wall of the liquid chamber or integrally overmolded in the liquid storing shell body. The rotor and a propeller oppositely connected to the rotor are received in the liquid chamber and exposed in the cooling liquid. The propeller is provided with a plurality of blades made of metal. At least one magnetic pole region is magnetized on each of the blades opposite to the coil set. Therefore, a thinning effect can be achieved.

The present invention relates to a water cooling device which comprises a liquid storing shell body having a liquid chamber and a pump having a stator and a rotor. The stator has a coil set disposed electrically on a circuit board. The circuit board and the coil set thereon are both disposed on at least one inner wall of the liquid chamber or integrally overmolded in the liquid storing shell body. The rotor and a propeller oppositely connected to the rotor are received in the liquid chamber and exposed in the cooling liquid. The propeller is provided with a plurality of blades made of metal. At least one magnetic pole region is magnetized on each of the blades opposite to the coil set. Therefore, a thinning effect can be achieved.

A thermal energy conveyance process involving at least one of transferring heat to a first heat transfer fluid and recovering heat from a second heat transfer fluid, wherein the first and the second heat transfer fluids include a gaseous carrier containing a quantity of micron sized solid particles and wherein the at least one of transferring heat and recovering heat is conducted to involve at least one of a) a temperature in excess of 1000° F. and b) a dilute-to-dense phase of the micron sized solid particles. Also provided is a media adapted for such heat conveyance operation.

A heat sink module for cooling a heat providing surface can include an inlet chamber and an outlet chamber formed within the heat sink module. The outlet chamber can have an open portion that can be enclosed by the heat providing surface when the heat sink module is installed on the heat providing surface. The heat sink module can include a dividing member disposed between the inlet chamber and the outlet chamber. The dividing member can include a first plurality of orifices extending from a top surface of the dividing member to a bottom surface of the dividing member. The first plurality of orifices can be configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the inlet chamber.