A sample heating/cooling device (2) comprises a plurality of members (6) operable in use to heat and/or cool one or more samples (22). Each member (6) has a sample contact surface and is biased towards a resting position under the operation of a biasing means. The members (6) are movable independently of one another against said bias under the application of a force on the sample contact surface and so are able to conform to the shape of a sample placed on the members to provide a uniform heating/cooling profile. The members (6) may be mounted in a heating/cooling element (4) and adapted to conduct thermal energy between the sample (22) and the element (4). The device (2) is particularly suitable for thawing frozen sample bags having an irregular shape. A corresponding method is also described.

A sample heating/cooling device (2) comprises a plurality of members (6) operable in use to heat and/or cool one or more samples (22). Each member (6) has a sample contact surface and is biased towards a resting position under the operation of a biasing means. The members (6) are movable independently of one another against said bias under the application of a force on the sample contact surface and so are able to conform to the shape of a sample placed on the members to provide a uniform heating/cooling profile. The members (6) may be mounted in a heating/cooling element (4) and adapted to conduct thermal energy between the sample (22) and the element (4). The device (2) is particularly suitable for thawing frozen sample bags having an irregular shape. A corresponding method is also described.

A sample heating/cooling device comprises a plurality of members operable in use to heat and/or cool one or more samples. Each member has a sample contact surface and is biased towards a resting position under the operation of a biasing means. The members are movable independently of one another against said bias under the application of a force on the sample contact surface and so are able to conform to the shape of a sample placed on the members to provide a uniform heating/cooling profile. The members may be mounted in a heating/cooling element and adapted to conduct thermal energy between the sample and the element. The device is particularly suitable for thawing frozen sample bags having an irregular shape. A corresponding method is also described.

A sample heating/cooling device comprises a plurality of members operable in use to heat and/or cool one or more samples. Each member has a sample contact surface and is biased towards a resting position under the operation of a biasing means. The members are movable independently of one another against said bias under the application of a force on the sample contact surface and so are able to conform to the shape of a sample placed on the members to provide a uniform heating/cooling profile. The members may be mounted in a heating/cooling element and adapted to conduct thermal energy between the sample and the element. The device is particularly suitable for thawing frozen sample bags having an irregular shape. A corresponding method is also described.

A beverage container cooling unit has: (a) a housing having a slot for receiving a container therein, (b) a cooling element having a cold supply, (c) a heat conductive panel enabling heat transfer between a container provided in the slot and the cold supply; wherein the heat conductive panel has two material layers fixed against one another: (I) a first material layer defining a cooling surface facing the container receiving slot and an opposed surface, said first layer made of a material having a thermal expansion coefficient of X.sub.1; (ii) a second material layer having a contact surface facing positioned against the opposed surface of the first material layer and a second opposed surface, the second material layer having a thermal expansion coefficient of X.sub.2, different from X.sub.1, the difference in thermal expansion causing the conductive panel to bulge at a change in temperature.

A beverage container cooling unit has: (a) a housing having a slot for receiving a container therein, (b) a cooling element having a cold supply, (c) a heat conductive panel enabling heat transfer between a container provided in the slot and the cold supply; wherein the heat conductive panel has two material layers fixed against one another: (I) a first material layer defining a cooling surface facing the container receiving slot and an opposed surface, said first layer made of a material having a thermal expansion coefficient of X.sub.1; (ii) a second material layer having a contact surface facing positioned against the opposed surface of the first material layer and a second opposed surface, the second material layer having a thermal expansion coefficient of X.sub.2, different from X.sub.1, the difference in thermal expansion causing the conductive panel to bulge at a change in temperature.

A heat pipe structure is used for cooling a heat source. The heat pipe structure includes a sleeve tube and a shaft. The sleeve tube includes an inner wall. The sleeve tube has a trench on the inner wall. The trench is at an outlet end of the sleeve tube. The trench extends in a circumferential direction of the sleeve tube. The shaft is connected to the heat source. The shaft is inserted into the sleeve tube from the outlet end such that the shaft is rotatable relative to the sleeve tube. The trench surrounds the shaft.

A heat pipe structure is used for cooling a heat source. The heat pipe structure includes a sleeve tube and a shaft. The sleeve tube includes an inner wall. The sleeve tube has a trench on the inner wall. The trench is at an outlet end of the sleeve tube. The trench extends in a circumferential direction of the sleeve tube. The shaft is connected to the heat source. The shaft is inserted into the sleeve tube from the outlet end such that the shaft is rotatable relative to the sleeve tube. The trench surrounds the shaft.

A convector for cooling a microprocessor includes a volute-shaped housing, a stator, and a rotor, and can be mounted to a CPU board of a computing device for thermal coupling with the microprocessor. The volute-shaped housing of the convector encapsulates the stator and the rotor, and has a radially outer casing which defines a single exit port for guiding a fluid out of the housing. The stator has a plurality of plates configured to conduct heat. The rotor has a plurality of disks and a shaft extending longitudinally along the housing. Together, the housing, the stator, and the rotor define a spiral flow path through the volute-shaped housing, in both radially outward and longitudinal directions, to the single exit port. A motor may be provided to impart rotational motion to the rotor.

A convector for cooling a microprocessor includes a volute-shaped housing, a stator, and a rotor, and can be mounted to a CPU board of a computing device for thermal coupling with the microprocessor. The volute-shaped housing of the convector encapsulates the stator and the rotor, and has a radially outer casing which defines a single exit port for guiding a fluid out of the housing. The stator has a plurality of plates configured to conduct heat. The rotor has a plurality of disks and a shaft extending longitudinally along the housing. Together, the housing, the stator, and the rotor define a spiral flow path through the volute-shaped housing, in both radially outward and longitudinal directions, to the single exit port. A motor may be provided to impart rotational motion to the rotor.