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Heat transfer assemblies
10514214 · 2019-12-24 · ·

A heat transfer assembly for transferring heat from a heat generating electrical element and having a porous element having a portion configured to contact the heat generating element and a moveable diaphragm having a portion adjacent the porous element and where the diaphragm is moveable between an extended position towards the porous element and a retracted position away from the porous element.

Water cooling head with sparse and dense fins

A water cooling head with sparse and dense fins, including a main body, a first fin set and a second fin set. Wherein a chamber is formed inside the main body, the main body has a first plate and a second plate, the main body forms an inlet channel and an outlet channel, so that the cooling water passes through the chamber. The first fin set and the second fin set are arranged in the chamber, and the first fin set and the second fin set are connected to the first plate respectively. The first fin set comprises several first fins spaced apart, the first fins divide the chamber to form several first channels. The second fin set comprises several second fins spaced apart, the second fins divide the chamber to form several second channels. The water cooling head can increase the overall heat sinking efficiency.

WATER-BASED POLYMER NETWORK FOR TRANSPIRANT COOLING APPLICATIONS
20240052227 · 2024-02-15 ·

A method includes obtaining thermal energy from a structure to be cooled, where the structure includes micro-channels. The method also includes providing the thermal energy to a water-based polymer network, where the water-based polymer network includes a gel formed using a polymer and water. The method further includes generating one or more gases by heating the water-based polymer network, where generating the one or more gases includes releasing the water in the water-based polymer network to produce steam. In addition, the method includes passing the one or more gases through the micro-channels to remove at least some of the thermal energy from the structure.

Orthogonal shear structure

A support structure for reinforcing first and second skins in an aircraft component includes a plurality of core members connected together to form at least one layer. Each core member has a geometrically isotropic shape.

Orthogonal shear structure

A support structure for reinforcing first and second skins in an aircraft component includes a plurality of core members connected together to form at least one layer. Each core member has a geometrically isotropic shape.

Heat pipe

A heat pipe containing a working fluid includes a first metal layer and a second metal layer. The first metal layer includes an upper surface and bottomed holes depressed from the upper surface. The second metal layer includes a lower surface that is joined with the upper surface of the first metal layer and a recess that is depressed from the lower surface. The recess forms a vapor layer in which vapor vaporized from the working fluid moves. Adjacent bottomed holes are in communication with each other so that the bottomed holes form a liquid layer in which the working fluid liquefied from the vapor moves.

RADIANT HEATER DEVICE

A radiant heater device has an electrode embedded in a substrate part and a plurality of heating parts. The electrodes are formed by material that has low specific resistance. An area occupied by the electrode is restricted. The heating parts are formed by material having high specific resistance in order to generate heat so that radiation is produced. The electrode and the heating part are electrically connected within the substrate part. The plurality of heating parts are arranged in parallel between a pair of electrodes. The electrodes and the heating parts are formed in a film-like shape, and the thermal capacity is reduced. As a result, a temperature of the heating parts rises promptly in response to a turning on of power. In addition, the temperature of the heating parts promptly decreases when an object comes into contact therewith.

RADIANT HEATER DEVICE

A radiant heater device has an electrode embedded in a substrate part and a plurality of heating parts. The electrodes are formed by material that has low specific resistance. An area occupied by the electrode is restricted. The heating parts are formed by material having high specific resistance in order to generate heat so that radiation is produced. The electrode and the heating part are electrically connected within the substrate part. The plurality of heating parts are arranged in parallel between a pair of electrodes. The electrodes and the heating parts are formed in a film-like shape, and the thermal capacity is reduced. As a result, a temperature of the heating parts rises promptly in response to a turning on of power. In addition, the temperature of the heating parts promptly decreases when an object comes into contact therewith.

Efficient heat exchange systems and methods
10477724 · 2019-11-12 · ·

A heat exchange system can include an inner enclosure, an outer enclosure, a flow path between the inner and the outer enclosure, an outer fan to induce air flow through the flow path, an inner fan to circulate air within the inner enclosure, and a heat source within the inner enclosure. The heat exchange systems can be used to dissipate heat from the electrical components of various devices, such as laser marking systems, machine readable symbol readers, and dimensioning systems.

Thin heat dissipation device and method for manufacturing the same
11974411 · 2024-04-30 ·

The present invention is related to a thin heat dissipation device and a method for manufacturing the same. The device of the present invention mainly comprises a hollow body having an enclosed chamber and a working fluid with which the enclosed chamber is filled. The enclosed chamber comprises a first fluid channel and a second fluid channel. The first and second fluid channels extend in the longitudinal direction of the hollow body, are juxtaposed in the width direction of the hollow body and communicated with each other, and an interface between the first fluid channel and the second fluid channel has a height of about 0.1 mm or less. As such, a novel capillary structure which is capable of greatly reducing the entire thickness, enhancing heat transfer efficiency and reducing cost and which is reliable and durable is provided.