Systems and techniques are described that provide for enhanced gain and radiation characteristics of antennas. The systems and techniques employ layers or cards of fractal plasmonic surfaces to provide gain to the antennas. The fractal plasmonic surfaces each include a close-packed arrangements of resonators having self-similar or fractal shapes, which may be referred to as fractal cells. The cards can be held by a frame adapted to fit an antenna. The FPS cards can provide benefits for gain, field emission, directivity, increased bandwidth, power delivery, and/or heat management. One or more dielectric layers or cards may be used to enhance gain and/or directivity characteristics.

A fluid heat exchanger includes: a heat spreader plate including an intended heat generating component contact region; a plurality of microchannels for directing heat transfer fluid over the heat spreader plate, the plurality of microchannels each having a first end and an opposite end and each of the plurality of microchannels extending substantially parallel with each other microchannel and each of the plurality of microchannels having a continuous channel flow path between their first end and their opposite end; a fluid inlet opening for the plurality of microchannels and positioned between the microchannel first and opposite ends, a first fluid outlet opening from the plurality of microchannels at each of the microchannel first ends; and an opposite fluid outlet opening from the plurality of microchannels at each of the microchannel opposite ends, the fluid inlet opening and the first and opposite fluid outlet openings providing that any flow of heat transfer fluid that passes into the plurality of microchannels, flows along the full length of each of the plurality of microchannels in two directions outwardly from the fluid inlet opening. A method of cooling a heat generating component uses a fluid heat exchanger that splits a mass flow of coolant.

A thermal conductive stress relaxation structure is interposed between a high-temperature substance and a low-temperature substance to conduct heat in a heat-transfer direction from the high-temperature substance to the low-temperature substance. The structure includes an assembly configured such that a thermal conductive material gathers in a non-bonded state having stress relaxation effect. Such an assembly is a rolled-up body configured such that a carbon-based sheet material and a metal-based sheet material are alternately rolled up, for example. This structure has one or more interfaces at which adjacent parts can slide, thereby dividing a deformable region to relax the thermal stress. It has a low rigidity and can thus deform to release the thermal stress. The structure can suppress the thermal stresses and the shape changes that would be generated in the high-temperature substance and the low-temperature substance, and each physical body located there between.

There is provided a device for cooling a component, including a support configured to receive a component to be cooled, the support including a fluid network configured for liquid circulation therein, the network including a first cavity, a second cavity, and a first channel connecting the first cavity to the second cavity, a first deformable membrane and a second deformable membrane configured to form a mobile wall of the first cavity and a mobile wall of the second cavity respectively, the device further including an actuating device configured to actuate the first membrane and the second membrane, and a thermal conducting element close to the channel or in contact with the channel.

A water cooling heat dissipation structure includes a first and a second plate, a water cooling heat dissipation body, which is composed of a plurality of stacked heat dissipation members. The first plate, the heat dissipation members, and the second plate are in sequence stacked up into one and another to integrally form the water cooling heat dissipation structure by heat treatment. The water cooling heat dissipation body has a top side attached to one side of the first plate and a bottom side thereof attached to the second plate, so as to secure two sides of a flow passage of the water cooling heat dissipation body. A first and a second connecting portion is respectively provided on two sides of the first plate or the water cooling heat dissipation body, and the first and the second connecting portion is communicable with the flow passage.

A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

A heat exchanger includes at least one first flow channel for a first medium, at least one second flow channel for a second medium, and at least one bottom that can be connected to the housing. The bottom has at least one expansion element.

A heat exchanger includes at least one first flow channel for a first medium, at least one second flow channel for a second medium, and at least one bottom that can be connected to the housing. The bottom has at least one expansion element.

A method for making a ceramic heat sink is provided. In the first step of the method, a mixed material of nitrite-based ceramic powder, titanium powder and inorganic resin is prepared. The mixed material is then molded into a ceramic blank with a mold coated with titanium. Thereafter, the ceramic blank may be sintered to form the ceramic heat sink. Since the mixture and the mold both contain a common material of titanium, the molded ceramic blank can be easily removed from the mold in its integrity.

A heat exchanger core assembly includes a frame assembly and a plurality of core bundles positioned within the frame assembly. Each core bundle includes at least one row of tubing defining at least one end of the core bundle, an edge seal gasket to seal the core bundle from an adjacently placed core bundle, and an indoor face seal gasket to seal the end with respect to the frame assembly. A method of replacing a core bundle of a heat exchanger core assembly includes identifying a core bundle requiring replacement, removing the core bundle by accessing the core bundle and sliding the core bundle with respect to the remaining plurality of core bundles from the frame assembly, and inserting a replacement core bundle in a space defined by the removed core bundle.