Patent classifications
F28F7/00
Electric radiator using calculating processors as a heat source
An electric radiator is provided using calculating processors as a heat source and includes a heating body where the heat transfer between the heat source and the ambient air takes place; a number of processors distributed over a number of printed circuit boards forming the heat source of the radiator and a power resource carrying out calculations by external computer systems; a man-machine interface enabling the control of the calculating and calorific power supplied by the radiator; a power source stabilized for the different electrical components; and a network interface for connecting the radiator to the external networks.
Plate heat exchanger in a sealed design
The disclosure relates to a plate heat exchanger in a sealed design, with a stacked arrangement comprising a front-side and a rear-side end plate, wherein at least one end plate is constituted as a connection plate, heat exchanger plates which are arranged and stacked between the front-side and the rear-side end plate, in such a way that cavities for accommodating a plurality of heat exchanger media are formed between the heat exchanger plates, and sealing elements which are disposed to seal the cavities, and a clamping device, configured to exert an external clamping pressure on the stacked arrangement for the tensioning, wherein the clamping device is formed to encompass the stacked arrangement in a form-fit manner at least in sections, namely at least in a corner region of the stacked arrangement.
Heat conductor and device including the same
A heat conductor includes a first layer containing a first resin component and first flake graphite fillers each having a basal plane; and a second layer containing a second resin component and second flake graphite fillers each having a basal plane. The heat conductor is a laminate including the first layer and the second layer, an average of first angles in the first layer is 35 degrees or smaller, each of the first angles is an acute angle between the basal plane of a corresponding one of the first flake graphite fillers and a first laminated surface of the laminate, an average of second angles in the second layer ranges from 55 degrees to 90 degrees, and each of the second angles is an acute angle between the basal plane of a corresponding one of the second flake graphite fillers and a second laminated surface of the laminate.
Heat dissipation device
A heat dissipation device includes a base, a fin assembly mounted on a top surface of the base, and a heat absorber arranged at a bottom surface of the base. The bottom surface of the base defines a recess corresponding to the heat absorber. The heat absorber is embedded in the recess. A fixing plate is positioned at the bottom surface of the base to cover the recess and define a sealed/airtight cavity between the fixing plate and the base. A top end of the heat absorber is received in the sealed/airtight cavity. A top end of the heat absorber extends through the fixing plate to expose out of the sealed/airtight cavity. A flexible sheet is totally received in the sealed/airtight cavity to buffer a stress generated by assembling the heat dissipation device with external elements.
Cooling system for a computer system
The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid, Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.
Air conditioner unit including a heating unit
In accordance with one embodiment, an air conditioner unit is provided. The air conditioner unit includes a heater housing having peripheral surfaces defining a housing interior, the peripheral surfaces including a first sidewall and a second sidewall spaced apart along the lateral direction. The air conditioner unit further includes a guide track extending along the lateral direction between the first sidewall and the second sidewall. The air conditioner unit further includes a blower fan, the blower fan including a blade assembly disposed within the interior and a motor connected to the blade assembly. The air conditioner unit further includes a heating unit comprising a first bracket and a second bracket spaced apart along the lateral direction. The heating unit further includes at least one heater bank extending along the lateral direction between the first bracket and the second bracket. The heating unit is movable along the guide track.
Heat exchanger having a passage pipe
An inner fin is a wave fin having board portions extending in a pipe longitudinal direction and a top portion connecting the board portions located adjacent with each other. The wave fin has a wave-shaped cross-section perpendicularly intersecting a pipe longitudinal direction, and the board portion is bent into a waveform extending in the pipe longitudinal direction when seen from a pipe layering direction. A wave pitch WP [mm], a wave depth WD [mm], and a passage width H [mm] are set to satisfy relationships of 2.2≤WP/WD≤4.28 and 0.5≤WD/H≤1.8.
Piping module for air fractionation plant
A piping module is described which comprises at least two fluid connections or ports for connection to at least one main heat exchanger of an air fractionation plant, whereby the main heat exchanger becomes linked to at least two fluid lines in a warm part of the air fractionation plant. The piping module comprises at least two ports on the main compressor side, couplable to at least two fluid lines in the warm part of the air fractionation plant, and at least two ports on the main heat exchanger side, couplable to at least two fluid ports of the at least one main heat exchanger, and at least two fluid lines connecting the ports on the main compressor side to the ports on the main heat exchanger side. A corresponding air fractionation plant and a method for erecting such an air fractionation plant (100) are likewise described.
Piping module for air fractionation plant
A piping module is described which comprises at least two fluid connections or ports for connection to at least one main heat exchanger of an air fractionation plant, whereby the main heat exchanger becomes linked to at least two fluid lines in a warm part of the air fractionation plant. The piping module comprises at least two ports on the main compressor side, couplable to at least two fluid lines in the warm part of the air fractionation plant, and at least two ports on the main heat exchanger side, couplable to at least two fluid ports of the at least one main heat exchanger, and at least two fluid lines connecting the ports on the main compressor side to the ports on the main heat exchanger side. A corresponding air fractionation plant and a method for erecting such an air fractionation plant (100) are likewise described.
Liquid-cooled heat sink for electronic devices
A heat sink includes a heat absorption module, a liquid transport module and a heat exchange module. The transport module includes one inlet and outlet tubes, each having a first end connected spatially with the heat absorption module. The heat exchange module includes a fin assembly, one fan unit and several connection passages extending through the fin assembly. One end portion of the fin assembly defines a liquid storage chamber, which is divided into several first chambers therein such that first ends of the connection passages extend respectively into the first chambers. The other end portion of the fin assembly defines two second chambers such that second ends of the connection passages extend respectively into the second chambers while a second end of each inlet and outlet tubes is connected spatially with a first and second pump units, which are in spatially communicated with the first chambers.